Reliability of Electronic Components : A Practical Guide to Electronic Systems Manufacturing - Marius Bazu

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Reliability of Electronic Components : A Practical Guide to Electronic Systems Manufacturing

By: Marius Bazu, Titu Bajenescu

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Hardcover
558 Pages

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24.13 x 15.88 x 3.18

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The objective of this book is to better understand why components fail, addressing the needs of engineers who will apply reliability principles in design, manufacture, testing, and field service. It so contributes to new approaches and the development of electronic and telecommunications component reliability. As a reference source, it summarizes the knowledge on failure modes, degradation and mechanisms, including a survey of accelerated testing, achieving better reliability, total quality topics, screening tests and prediction methods. A detailed index, a glossary, acronym lists, reliability dictionaries and a rich specific bibliography round the benefit offered by the book. The technical level suites to senior and graduate students, as well as to experts and managers in industries.

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Introduction	p. 1
Definition of reliability	p. 1
Historical development perspective	p. 2
Quality and reliability	p. 3
Economics and optimisation	p. 5
Probability; basic laws	p. 5
Probability distributions	p. 6
Basic reliability distribution theory	p. 9
Specific terms	p. 11
The generalised definition of / and MTBF	p. 13
Failures types	p. 15
Failures classification	p. 16
Reliability estimates	p. 17
"Bath-tub" failure curve	p. 19
Reliability of electronic systems	p. 20
Can the batch reliability be increased?	p. 20
What is the utility of screening tests?	p. 21
Derating technique	p. 241
About the testability of electronic and telecommunication systems	p. 25
Accelerated ageing methods for equipped boards	p. 26
Operational failures	p. 27
FMEA/FMECA method	p. 29
Fault tree analysis (FTA)	p. 30
Monte Carlo techniques	p. 30
Practical recommendations	p. 32
Component reliability and market economy	p. 33
Some examples	p. 35
References	p. 37
State of the Art in Reliability	p. 43
Cultural features	p. 44
Quality and reliability assurance	p. 44
Total quality management (TQM)	p. 46
Building-in reliability (BIR)	p. 48
Concurrent engineering (CE)	p. 49
Acquisition reform	p. 50
Reliability building	p. 51
Design for reliability	p. 51
Process reliability	p. 52
Technological synergies	p. 53
Screening and burn-in	p. 54
Bum-in	p. 56
Economic aspects of burn-in	p. 59
Other screening tests	p. 60
Monitoring the screening	p. 61
Reliability evaluation	p. 65
Environmental reliability testing	p. 66
Synergy of environmental factors	p. 68
Temperature cycling	p. 70
Behavi or in a radiation field	p. 72
Life testing with noncontinous inspection	p. 73
Accelerated testing	p. 75
Activation energy depends on the stress level	p. 77
Physics of failure	p. 78
Drift, drift failures and drift behaviour	p. 81
Prediction methods	p. 83
Prediction methods based on failure physics	p. 84
Laboratory versus operational reliability	p. 86
Standardisation	p. 87
Quality systems	p. 87
Dependability	p. 87
References	p. 87
Reliability of Passive Electronic Parts	p. 93
How parts fail	p. 93
Resistors	p. 94
Some important parameters	p. 97
Characteristics	p. 98
Reasons for inconstant resistors [3.8]...[3.10]	p. 100
Carbon film resistors (Fig. 3.4)	p. 101
Metal film resistors	p. 101
Composite resistors (on inorganic basis)	p. 101
Some design rules	p. 101
Some typical defects of resistors	p. 102
Carbon film resistors	p. 104
Metal film resistors	p. 104
Film resistors	p. 105
Fixed wirewound resistors	p. 105
Variable wirewound resistors	p. 105
Noise behaviour	p. 105
Reliability of capacitors	p. 105
Introduction	p. 105
Aluminium electrolytic capacitors	p. 107
Characteristics	p. 108
Results of reliability research studies	p. 110
Reliability data	p. 111
Main failures types	p. 111
Causes of failures	p. 112
Tantalum capacitors	p. 112
Introduction	p. 112
Structure and properties	p. 113
Reliability considerations	p. 115
DC/C₀ variation with temperature	p. 116
The failure rate and the product CU	p. 117
Loss factor	p. 117
Impedance at 100 Hz	p. 117
Investigating the stability of 35 V tantalum capacitor	p. 117
The failure rate model	p. 121
Reliability comparison	p. 121
Another reliability comparison	p. 123
Polyester film / foil capacitors	p. 124
Introduction	p. 124
Life testing	p. 125
I as a function of temperature and load	p. 126
Reliability conclusions	p. 127
Wound capacitors	p. 129
Reliability and screening methods [3.37] [3.38]	p. 131
Zinc oxide (ZnO) varistors [3.39]...[3.45]	p. 132
Pulse behaviour of ZnO varistors	p. 134
Reliability results	p. 138
Connectors	p. 138
Specifications profile	p. 139
Elements of a test plan	p. 140
References	p. 141
Reliability of Diodes	p. 145
Introduction	p. 145
Semiconductor diodes	p. 146
Structure and properties	p. 146
Reliability tests and results	p. 146
Failure mechanisms	p. 148
Mechanical failure mechanisms	p. 148
Electrical failure mechanisms	p. 148
New technologies	p. 149
Correlation between technology and reliability	p. 150
Intermittent short-circuits	p. 153
Z diodes	p. 154
Characteristics	p. 154
Reliability investigations and results	p. 155
Failure mechanisms	p. 158
Failure mechanisms of Z diodes	p. 159
Design for reliability	p. 160
Some general remarks	p. 161
Catastrophic failures	p. 162
Degradation failures	p. 162
Trans-Zorb diodes	p. 163
Introduction	p. 163
Structure and characteristics	p. 163
Impatt (IMPact Avalanche and Transit-Time) diodes	p. 65
Reliability test results for HP silicon single drift Impatt diodes	p. 165
Reliability test results for IIP silicon double drift Impatt diodes	p. 166
Factors affecting the reliability and safe operation	p. 166
References	p. 169
Reliability of Silicon Transistors	p. 171
Introduction	p. 171
Technologies and power limitations	p. 172
Bipolar transistors	p. 173
Unipolartransistors	p. 173
Electrical characteristics	p. 175
Recommendations	p. 176
Safety Limits	p. 176
The du/dt phenomenon	p. 177
Reliability characteristics	p. 178
Thermal fatigue	p. 180
Causes of failures	p. 182
Failure mechanisms	p. 182
Failure modes	p. 183
A check-up for the users	p. 185
Bipolar transistor peripherics	p. 185
The package problem	p. 185
Accelerated tests	p. 186
The Arrhenius model	p. 187
Thermal cycling	p. 188
How to improve the reliability	p. 190
Some recommendations	p. 191
References	p. 193
Reliability of Thyristors	p. 197
Introduction	p. 197
Design and reliability	p. 199
Failure mechanisms	p. 199
Plastic and hermetic package problems	p. 202
Humidity problem	p. 204
Evaluating the reliability	p. 204
Thyristor failure rates	p. 206
Derating	p. 207
Reliability screens by General Electric	p. 209
New technology in preparation: SITH	p. 210
References	p. 213
Reliability of Integrated Circuits	p. 215
Introduction	p. 215
Reliability evaluation	p. 219
Some reliability problems	p. 219
Evaluation of integrated circuit reliability	p. 219
Accelerated thermal test	p. 221
Humidity environment	p. 222
Dynamic life testing	p. 223
Failure analysis	p. 224
Failure mechanisms	p. 224
Gate oxide breakdown	p. 225
Surface charges	p. 226
Hot carrier effects	p. 226
Metal diffusion	p. 226
Electromigration	p. 227
Fatigue	p. 228
Aluminium-gold system	p. 229
Brittle fracture	p. 229
Electrostatic Discharge (ESD)	p. 229
Early failures	p. 230
Modeling IC reliability	p. 231
Screening and burn-in	p. 233
The necessity of screening	p. 233
Efficiency and necessity of burn-in	p. 235
Failures at screening and burn-in	p. 237
Comparison between the IC families TTL Standard and TTL-LS	p. 240
Application Specific Integrated Circuits (ASIC)	p. 240
References	p. 241
Reliability of Hybrids	p. 247
Introduction	p. 247
Thin-film hybrid circuits	p. 250
Reliability characteristics of resistors	p. 250
Reliability of throughout-contacts	p. 251
Thick-film hybrids	p. 252
Failure types	p. 253
Reliability of resistors and capacitors	p. 254
Reliability of "beam-leads"	p. 254
Thick-film versus thin-film hybrids	p. 257
Reliability of hybrid ICs	p. 259
Causes of failures	p. 261
Influence of radiation	p. 264
Prospect outlook of the hybrid technology	p. 264
Die attach and bonding techniques	p. 270
Introduction	p. 270
Hybrid package styles	p. 271
Failure mechanisms	p. 274
References	p. 275
Reliability of Memories	p. 277
Introduction	p. 277
Process-related reliability aspects	p. 283
Possible memories classifications	p. 288
Silicon On Insulator (SOI) technologies	p. 290
Silicon on sapphire (SOS) technology	p. 291
Failure frequency of small geometry memories	p. 291
Causes of hardware failures	p. 292
Read only memories (ROMs)	p. 294
Small geometry devices	p. 296
Characterisation testing	p. 296
Timing and its influence on characterisation and test	p. 298
Test and characterisation of refresh	p. 298
Screening tests and test strategies	p. 299
Test programmes and -categories	p. 301
Test categories	p. 301
RAM failure modes	p. 302
Radiation environment in space; hardening approaches	p. 303
Design trends in microprocessor domain	p. 305
Failure mechanisms of microprocessors 306
References	p. 310
Reliability of Optoelectronics	p. 313
Introduction	p. 313
LED reliability	p. 316
Optocouplers	p. 318
Introduction	p. 318
Optocouplers ageing problem	p. 318
CTR degradation and its cause	p. 320
Reliability of optocouplers	p. 321
Table of Contents provided by Publisher. All Rights Reserved.

Reliability of Electronic Components : A Practical Guide to Electronic Systems Manufacturing

At a Glance

Hardcover

Shipping

How to return your order

Defective items

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