Springerbriefs in Electrical and Computer Engineering

By: Chulwoo Kim, Hyun-Woo Lee, Junyoung Song

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Paperback | 18 November 2013

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Paperback
98 Pages

Dimensions(cm)
22.86 x 15.88 x 1.27

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This book provides an overview of recent advances in memory interface design at both the architecture and circuit levels. Coverage includes signal integrity and testing, TSV interface, high-speed serial interface including equalization, ODT, pre-emphasis, wide I/O interface including crosstalk, skew cancellation, and clock generation and distribution. Trends for further bandwidth enhancement are also covered.

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