Springer Advanced Microelectronics

CH. 1. Thermal managing fundamentals and design guide in electronic packaging.- 1.1 Introduction.- 1.2 Thermal management challenges and common.- concerns.- 1.3 Fundamentals of heat transfer.- 1.4 Thermal management solutions.- 1.5 Design for advanced thermal management of electronic packaging.- 1.6 Materials selection for advanced thermal management.- 1.7 Environmental compliance of thermal managing materials.- CH. 2. Characterization methodology of thermal managing materials.- 2.1 Thermal properties and measurement techniques.- 2.2 Electrical properties and measurement techniques.- 2.3 Thermomechanical characterization.- 2.4 Analytical techniques for materials characterization.- 2.5 Surface finish and contact interface compatibility.- 2.6 Reliability analysis and environmental performance evaluation.- CH. 3. Electronic packaging materials and their thermal managements.- 3.1 Materials selection for electronic packaging.- 3.2 Ceramics and semiconductors.- 3.3 Electronic glasses.- 3.4 Polymers.- 3.5 Monolithic metals.- 3.6 Metallic composites.- 3.7 Multimaterial laminates.- 3.8 Printed Circuit Board (PCB) Materials.- 3.9 Thermal interface materials.- 3.10 Advanced thermally conductive materials.- CH. 4. THERMALLY conductive carbonaceous materials and carbon matrix composites.- 4.1 Introduction.- 4.2 Natural and industrial graphite.- 4.3 Pyrolytic graphite.- 4.4 Graphite/Carbon Foams.- 4.5 Thermally conductive carbon fibers.- 4.6 Diamond.- 4.7 Carbon Nanotubes.- 4.8 Carbon/carbon composites.- CH. 5. Thermally conductive polymer matrix composites.- 5.1 Introduction.- 5.2 Polymer matrix types.- 5.3 Reinforcements selection and its effect on thermal conductivity.- 5.4 General fabrication and manufacturing processes.- 5.5 Types and applications for thermal management.- CH. 6. High thermal conductivity metal matrix composites.- 6.1 Introduction.- 6.2 Processing of metal matrix composites.- 6.3 Aluminum matrix composites.- 6.4 Copper matrix composites.- 6.5 Other metal matrix composites.- CH. 7. Thermally conductive ceramic matrix composites.- 7.1 Introduction.- 7.2 Diamond-SiC composites.- 7.3 Carbon-SiC Composites.- 7.4 Reaction-Bonded SiC.- 7.5 Aluminum-toughened SiC.- 7.6 CNT/Ceramic- carbon nanotube composites.- CH. 8. Thermal interface materials in electronic packaging.- 8.1 Thermal contact conductance and requirement for thermal interface materials.- 8.2 Metallic thermal interface materials.- 8.3 Thermal grease.- 8.4 Thermally conductive elastomer materials.- 8.5 Phase change materials.- 8.6 Polymer solder hybrid materials.- 8.7 Fiber-reinforced thermal interface materials.- 8.8 Graphite based thermal interface material.- 8.9 Nanotechnology based thermal interface materials.- 8.10 Thermal interface materials selection.- CH. 9. Materials and design of advanced heat spreader and air cooling heat sink.- 9.1 Introduction.- 9.2 Spreading and constriction resistance.- 9.3 Type of heat spreaders and their materials selection.- 9.4 Air cooling heat sink.- 9.4.1 Heat sink design constraints and design parameters.- 9.5 Nanostructure heat sink and complex spreader sink.- CH. 10. Liquid cooling devices and materials selection.- 10.1 Introduction.- 10.2 Indirect single-phase liquid cooling.- 10.3 Direct immersion cooling.- 10.4 Spray cooling and jet impingement.- 10.5 Heat pipe cooling.- 10.6 Refrigeration cooling.- 10.7 High-flux cooling with phase-change heat transfer.- CH. 11. Thermoelectric cooling through thermoelectric materials.- 11.1 Introduction.- 11.2 Thermoelectric effects.- 11.3 Design and architecture of thermoelectric cooling devices.- 11.4 Thermoelectric materials and future development trends.- CH. 12. Development and applications of advanced thermal managing materials.- 12.1 Materials development routine and methodology.- 12.2 Smart composites and multifunctional materials for thermal management.- 12.3 Thermal managing materials with enhanced EMI shielding and absorbing performance.- 12.4 Applications.- 12.5 Future trends.-