Solder Joint Reliability Prediction for Multiple Environments

By: Andrew E. Perkins, Suresh K. Sitaraman

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Hardcover | 28 November 2008

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Hardcover
212 Pages

Dimensions(cm)
23.5 x 15.24 x 1.27

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Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.

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You Can Find This Book In

Non-Fiction Engineering & Technology Electronics & Communications Engineering Electronics Engineering Technology in General Engineering in General Mechanical Engineering & Materials Materials Science Other Technologies & Applied Sciences Applied Optics Industrial Chemistry & Manufacturing Technologies Metals Technology & Metallurgy

Production & Industrial Engineering Industrial Quality Control Civil Engineering Building Construction & Materials Security & Fire Alarm Systems

Introduction	p. 1
Book Layout	p. 4
Background	p. 7
CCGA and CBGA Electronic Packages	p. 7
CCGA Test Vehicle Description	p. 9
Solder Material Behavior and Fatigue	p. 11
Damage Parameters for Fatigue Prediction	p. 18
Solder Joint Fatigue Failure Prediction	p. 19
Cumulative Damage Prediction: Miner's Rule	p. 21
Laser Moire Interferometry	p. 22
Vibration Theory	p. 26
Chapter Summary	p. 36
Literature Review	p. 39
Thermal Cycling	p. 39
Power Cycling	p. 42
Vibration Environment	p. 45
Multiple Combined or Sequential Environments	p. 47
Pb-free Solder Joint Reliability	p. 48
Chapter Summary	p. 58
Unified Finite Element Modeling for Prediction of Solder Joint Fatigue	p. 65
Unified Finite Element Modeling Methodology	p. 65
Choice of Material Models and Elements	p. 76
Compatibility of Element Types and Material Models	p. 77
Calculation of Damage Parameter	p. 78
Choice of Stress-free Temperature	p. 78
Chapter Summary	p. 80
Validation of Unified FEM for Thermal Cycling and Power Cycling Environments	p. 83
Laser Moire Interferometry	p. 83
Laser Moire Studies on CCGA Package Assembly	p. 85
Laser Moire Studies on CBGA Package Assembly	p. 91
FEM Accelerated Thermal Cycling Verification with Laser Moire Interferometry	p. 96
Importance of Including Creep in Every Solder Joint of FEM	p. 99
Power Cycling Verification	p. 99
Chapter Summary	p. 101
Development of Fatigue Life Equations Under Low-Cycle Thermal and Power Cycling	p. 103
CBGA: 63Sn37Pb Solder Joint Fatigue Life	p. 103
CCGA: 90Pb10Sn Solder Joint Fatigue Life	p. 107
Chapter Summary	p. 112
Validation of Unified FEM and Development of Fatigue-life Equations for Vibration	p. 113
Vibration Experimental Setup and Results	p. 113
FEM Modal Analysis and Stress Distribution	p. 117
Dye-and-Pry Analysis of Test Vehicle D: Solder Joint Failure Location	p. 119
Solder Joint Failure Mechanism and Microstructural Analysis	p. 121
Fatigue Life Prediction for 90Pb10Sn Solder Under Vibration Loading	p. 124
Validation of Predictive Models	p. 129
Solder Joint Life Prediction for Sinusoidal Sweep Tests	p. 131
Chapter Summary	p. 133
Universal Predictive Fatigue Life Equation and the Effect of Design Parameters	p. 135
Motivation for a Universal Predictive Fatigue Life Equation	p. 135
Method	p. 136
Universal Fatigue Life Prediction Equation for CBGA Electronic Packages under Thermal Cycling	p. 146
Discussion of the Predictor Variables	p. 146
Verification of Predictive Equation Using Literature Data	p. 150
Application: Military Obsolescence and Maintanence Scheduling	p. 152
Chapter Summary	p. 154
Acceleration Factor to Relate Thermal Cycles to Power Cycles for CBGA Packages	p. 157
Power Cycling Thermal Environment	p. 157
Application of Developed AF Equation	p. 165
Chapter Summary	p. 168
Solder Joint Fatigue Failure under Sequential Thermal and Vibration Environments	p. 171
Sequence Tests	p. 172
Nonlinear Cumulative Damage Rule	p. 173
Extension of Nonlinear Sequential Cumulative Damage Rule to Include Power Cycling (PC)	p. 176
Chapter Summary	p. 177
Solder Joint Reliability Assessment for Desktop and Space Applications	p. 179
Approach and Setup for Application Examples	p. 179
Example 1: Desktop	p. 183
Example 2: Satellite	p. 186
Chapter Summary	p. 189
Table of Contents provided by Ingram. All Rights Reserved.

Solder Joint Reliability Prediction for Multiple Environments

At a Glance

Hardcover

Shipping

How to return your order

Defective items

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