Semiconductor Packaging

This book provides a complete and systematic discussion of key materials used in electronic packages. Unlike most of its competitors which are composed by several contributors, this book is written by two authors who are well-respected veterans in the electronic package industry. Therefore, consistency and easy to follow for new engineers and students will be the most distinguishing features for this book. --Kevin K.L. Chen, Qualcomm Atheros, San Jose, California, USA This book gives a good general overview of materials used in the making of semiconductor packages. The text covers both individual material types and their performance requirements in the end product. Also discussed are the historical background, purpose, key material properties, various material interactions, reliability requirements, and future trends. The book is easy to read and would serve as an excellent introduction to the subject for a student or engineer unfamiliar with the topic. It would also serve as a handy reference guide for a basic understanding of semiconductor packaging materials, as well of semiconductor packaging itself. --Zemo Yang, Ambarella Corp, Santa Clara, California, USA Materials technology is enabling the rapid development of new and advanced semiconductor packaging form factors. Knowledge of how material interactions impact package reliability and performance is ever more critical to the semiconductor industry, so both students and engineers need a resource to turn to in understanding material technology issues and trade-offs. This book serves as such a resource and reference guide to the world of semiconductor packaging materials. --Daniel P. Tracy, SEMI, San Jose, California, USA