Semiconductor Packaging

Materials Interaction and Reliability

By: Andrea Chen, Randy Hsiao-Yu Lo

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Hardcover | 10 October 2011 | Edition Number 1

At a Glance

Hardcover
218 Pages

Dimensions(cm)
23.39 x 15.6 x 1.42

Hardcover

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In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package.

The book focuses on an important step in semiconductor manufacturing-package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how the properties of packaging materials interact with each another and explore how to maximize the performance of these materials in regard to package integrity and reliability.

By tying together the disparate elements essential to a semiconductor package, this easy-to-read book shows how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world.

Industry Reviews

This book provides a complete and systematic discussion of key materials used in electronic packages. Unlike most of its competitors which are composed by several contributors, this book is written by two authors who are well-respected veterans in the electronic package industry. Therefore, consistency and easy to follow for new engineers and students will be the most distinguishing features for this book. --Kevin K.L. Chen, Qualcomm Atheros, San Jose, California, USA This book gives a good general overview of materials used in the making of semiconductor packages. The text covers both individual material types and their performance requirements in the end product. Also discussed are the historical background, purpose, key material properties, various material interactions, reliability requirements, and future trends. The book is easy to read and would serve as an excellent introduction to the subject for a student or engineer unfamiliar with the topic. It would also serve as a handy reference guide for a basic understanding of semiconductor packaging materials, as well of semiconductor packaging itself. --Zemo Yang, Ambarella Corp, Santa Clara, California, USA Materials technology is enabling the rapid development of new and advanced semiconductor packaging form factors. Knowledge of how material interactions impact package reliability and performance is ever more critical to the semiconductor industry, so both students and engineers need a resource to turn to in understanding material technology issues and trade-offs. This book serves as such a resource and reference guide to the world of semiconductor packaging materials. --Daniel P. Tracy, SEMI, San Jose, California, USA

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You Can Find This Book In

Non-Fiction Engineering & Technology Electronics & Communications Engineering Electronics Engineering Circuits & Components Electronic Devices & Materials Semi-Conductors & Super-Conductors Mechanical Engineering & Materials Materials Science Technology in General Technical Design Environmental Science

Energy Technology & Engineering Electrical Engineering Microwave Technology

Preface	p. xiii
Authors	p. xv
Partial list of abbreviations, acronyms, and symbols	p. xvii
Semiconductor packages
History and background	p. 3
Objectives	p. 3
Introduction	p. 3
Brief history	p. 4
Hermetic packaging	p. 4
Plastic packaging	p. 4
Wire bonding process flow	p. 5
Flip-chip process flow comparison	p. 5
Equipment	p. 6
Material interactions	p. 6
Bibliography	p. 9
Package form factors and families	p. 11
Objectives	p. 11
Introduction	p. 11
Package outline standardization	p. 11
Leaded package families	p. 12
Dual lead package family	p. 12
Quad lead package family	p. 13
Substrate-based package families	p. 13
Ball grid array package family	p. 14
Chip scale packages	p. 15
Substrate-based chip scale packages	p. 16
Quad flat no lead	p. 16
Stacked-die package family	p. 17
Package-on-package and related variations	p. 17
Flip-chip packages	p. 18
Wafer-level chip scale packages	p. 18
Bibliography	p. 20
Surface-mount technology	p. 23
Objectives	p. 23
Introduction	p. 23
Background	p. 24
Package cracking or "popcorning"	p. 27
Surface-mount packages: peripheral leads versus area array	p. 27
Issues with advanced packaging	p. 29
Current and future trends	p. 30
Lead-free and halogen-free packaging	p. 30
Bibliography	p. 31
Other packaging needs	p. 33
Objectives	p. 33
Introduction	p. 33
Tape automated bonding	p. 33
Micro electro-mechanical systems (MEMS)	p. 34
Image sensor modules	p. 35
Memory cards	p. 35
Packaging needs for solar technology	p. 40
Bibliography	p. 41
Package reliability
Reliability testing	p. 45
Introduction	p. 45
Background	p. 46
Examples of reliability tests	p. 46
Preconditioning conditions	p. 48
Package failure mode: package crack or popcorning	p. 48
Temperature cycling and thermal shock	p. 48
Package failure modes from temperature cycling and thermal shock	p. 54
Package failure mode: delamination	p. 54
High-temperature storage life	p. 55
Package failure mode: intermetallics	p. 55
Temperature-humidity-bias tests	p. 55
Package failure mode: corrosion	p. 55
Limitations of reliability testing	p. 56
Bibliography	p. 57
Materials used in semiconductor packaging
Polymers	p. 61
Molding compounds	p. 61
Objectives	p. 61
Introduction	p. 61
Background	p. 61
Newer formulations	p. 64
Biphenyl	p. 64
Multifunctional	p. 65
Aromatic resins	p. 65
Technology challenges	p. 66
Moldability	p. 66
Glass transition temperature	p. 67
Flexural modulus	p. 67
Coefficient of thermal expansion	p. 68
Stress index	p. 68
Failure modes associated with molding compounds	p. 69
Package cracking during solder reflow	p. 69
Substrate postmold warpage	p. 71
Future developments	p. 72
"Green" molding compounds and changes to flame retardant additives	p. 72
Molded underfill	p. 74
High-density packaging	p. 74
Compatibility with copper wire bonding	p. 75
Die attach adhesives	p. 75
Objectives	p. 75
Introduction	p. 76
Background	p. 76
Materials composition	p. 78
Liquid epoxy resin	p. 78
Silver flakes and other filler materials	p. 78
Reactive epoxy diluents and solvents	p. 78
Catalysts and hardeners	p. 78
Other additives	p. 78
Materials analysis	p. 79
Glass transition temperature	p. 79
Coefficient of thermal expansion	p. 79
Thixotropic index	p. 79
Ionic purity	p. 80
Reliability and performance	p. 81
Outgassing	p. 81
Resin bleed	p. 81
Future developments	p. 82
Three-dimensional (3D) packaging	p. 82
Lead-free and restriction of hazardous substances (RoHS)	p. 83
Compatibility with copper wire bonding	p. 83
Other developments	p. 84
Underfill materials	p. 84
Objectives	p. 84
Introduction	p. 84
What is underfill?	p. 84
The purpose of underfill	p. 84
The (standard) underfill process	p. 85
Underfill properties	p. 86
Glass transition temperature	p. 87
Coefficient of thermal expansion	p. 87
Alternate underfill processes	p. 87
"No-flow" underfill	p. 87
Reworkable underfill	p. 88
Preapplied underfill	p. 88
Molded underfill	p. 89
Areas of research and development	p. 90
Maintaining capillary flow as features sizes shrink	p. 90
Compatibility with lead-free bump process steps, including for copper pillar bumps	p. 90
Failure modes	p. 90
Organic substrates	p. 91
Objectives	p. 91
Introduction	p. 91
Background	p. 91
Ball grid arrays and chip scale packages	p. 92
Microvias and high-density interconnect technology	p. 93
Future developments	p. 94
Bibliography	p. 97
Metals	p. 101
Lead frames, heat spreaders, and heat sinks	p. 101
Objectives	p. 101
Introduction	p. 101
Lead frames	p. 101
Metals commonly used in lead frames and other components	p. 102
Copper	p. 102
Alloy42	p. 103
Aluminum	p. 104
Heat slugs, heat spreaders, and heat sinks	p. 104
Heat slugs or spreaders	p. 104
Heat sinks	p. 106
Plating finishes	p. 107
Bonding wires	p. 107
Objectives	p. 107
Introduction	p. 107
Bonding wires	p. 108
Gold	p. 108
Copper	p. 108
Aluminum	p. 110
Other	p. 110
Kirkendall effect	p. 111
Gold-aluminum intermetallics and Kirkendall effect	p. 111
Kirkendall effect for copper wire bonding on aluminum bond pads	p. 112
Heat-affected zone phenomenon in bonding wire	p. 112
How is the heat-affected zone created?	p. 113
Effect of heat-affected zone on loop height	p. 113
Other reliability issues	p. 113
Copper wire bonding and corrosion	p. 113
Materials analysis	p. 114
Visual inspection	p. 115
Bond etching	p. 115
Bond pull	p. 115
Ball shear tests	p. 115
Recent developments	p. 115
Copper wire bonding on nickel-palladium electroless plated bond pads	p. 116
Solders	p. 116
Objectives	p. 116
Introduction	p. 117
Types of solders	p. 117
Lead-based	p. 117
Lead-free	p. 118
Gold-based	p. 120
Wafer bumping	p. 121
Objectives	p. 121
Introduction	p. 121
Bump metallurgies	p. 122
"C4"	p. 123
Electroplating	p. 123
Electroless (UBM) plating and screen/stencil printing solder	p. 125
Lead-free bumping metallurgies	p. 126
Alternative to solder bumping technologies	p. 127
Under-bump metallurgy	p. 127
Vacuum deposition	p. 128
Electroplating	p. 128
Electroless plating	p. 128
Technical issues	p. 128
Future directions	p. 129
Bibliography	p. 129
Ceramics and glasses	p. 133
Objectives	p. 133
Introduction	p. 133
Types of ceramics used in semiconductor packaging	p. 133
Alumina	p. 135
Beryllia	p. 135
Aluminum nitride	p. 135
Silicon carbide	p. 136
Boron nitride	p. 137
Types of glasses used in semiconductor packaging	p. 137
Silver-filled glass	p. 139
Lead alkali borosilicate glass	p. 139
Bibliography	p. 139
The future
Trends and challenges	p. 143
Objectives	p. 143
Introduction	p. 143
Copper interconnects and 1ow-k dielectric materials	p. 143
Copper interconnects	p. 143
Dielectric materials	p. 145
Dielectric constant requirements at each technology node	p. 146
Future interconnect and dielectric materials	p. 148
Interconnects for <22 run	p. 148
Dielectric materials for >22 run	p. 150
Dielectric materials for <22 nm	p. 150
	p. 151
Codesigning the chip with the package	p. 151
Three-dimensional (3D) integration	p. 151
Through-silicon vias	p. 151
Bibliography	p. 153
Light-emitting diodes	p. 155
Objectives	p. 155
Introduction	p. 155
Unique characteristics of light-emitting diode (LED) packaging needs	p. 157
Reliability requirements for LED packages	p. 160
Bibliography	p. 161
Glossary	p. 163
Bibliography	p. 165
Analytical tools	p. 167
Introduction	p. 167
Types of analytical tools	p. 167
Nondestructive tools and tests	p. 168
Introduction	p. 168
Optical/visual inspection	p. 168
X-ray inspection	p. 168
Scanning acoustic microscopy	p. 170
Bibliography	p. 174
Destructive tools and tests	p. 177
Introduction	p. 177
Decapsulation	p. 178
Dye penetration	p. 178
Cross-sectioning and polishing	p. 178
Scanning electron microscopy (SEM)	p. 178
Transmission electron microscopy (TEM)	p. 179
Chemical and elemental tests	p. 180
Auger electron spectroscopy (AES)	p. 180
Energy-dispersive X-ray spectroscopy (EDS or EDX)	p. 181
Fourier transform infrared spectroscopy (FTIR)	p. 181
Secondary ion mass spectrometry (SIMS)	p. 183
Other analytical techniques	p. 183
Bonding wire pull	p. 183
Ball bond shear	p. 183
Differential scanning calorimetry (DSC)	p. 184
Flexural testing	p. 184
Bibliography	p. 186
Index	p. 189
Table of Contents provided by Ingram. All Rights Reserved.

Semiconductor Packaging

Materials Interaction and Reliability

At a Glance

Hardcover

Industry Reviews

Shipping

How to return your order

Defective items

You Can Find This Book In

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