RF and Microwave Microelectronics Packaging II

By: Ken Kuang (Editor), Rick Sturdivant (Editor)

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Hardcover | 22 March 2017

At a Glance

Hardcover
186 Pages

Dimensions(cm)
23.5 x 15.5 x 1.27

Hardcover

$199.00

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This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to "RF and Microwave Microelectronics Packaging" (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.

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