RF and Microwave Microelectronics Packaging II

By: Ken Kuang (Editor), Rick Sturdivant (Editor)

Write A Review

Hardcover | 22 March 2017

At a Glance

Hardcover
186 Pages

Dimensions(cm)
23.5 x 15.5 x 1.27

Hardcover

$199.75

or 4 interest-free payments of $49.94 with

Ships in 5 to 7 business days

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to "RF and Microwave Microelectronics Packaging" (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.

Shipping

	Standard Shipping	Express Shipping
Metro postcodes:	$9.99	$14.95
Regional postcodes:	$9.99	$14.95
Rural postcodes:	$9.99	$14.95

Orders over $89.00 qualify for free shipping.

How to return your order

At Booktopia, we offer hassle-free returns in accordance with our returns policy. If you wish to return an item, please get in touch with Booktopia Customer Care.

Additional postage charges may be applicable.