| Introduction | p. 1 |
| Generalities on Pixel Detectors | p. 1 |
| Motivations for Pixel Detectors in Particle Physics | p. 2 |
| Working Principle and Operating Characteristics of Segmented Silicon Detectors | p. 5 |
| Hybrid Pixel Detectors | p. 9 |
| Monolithic Pixel Detectors | p. 12 |
| Evolution of Pixel Detectors in Particle Physics | p. 13 |
| The First Pixel Detectors and Their Use in Experiments | p. 16 |
| Other Applications | p. 23 |
| The Sensor | p. 25 |
| Introduction | p. 25 |
| Device Physics and Fundamental Sensor Properties | p. 26 |
| Carrier Concentration | p. 26 |
| Charge Generation and Recombination in Silicon | p. 29 |
| Transport of Charge Carriers | p. 37 |
| The pn-Junction | p. 40 |
| Surface Barrier | p. 44 |
| Metal Oxide Semiconductor Structure | p. 46 |
| Punch Through | p. 48 |
| Pixel Sensors and Their Properties | p. 50 |
| Different Types of Silicon Sensors | p. 50 |
| Leakage Current and Maximum Operation Voltage | p. 51 |
| Full Depletion Voltage and Substrate Doping | p. 53 |
| Pixel Capacitance | p. 57 |
| Charge Motion and Signal Formation | p. 59 |
| Spatial Resolution | p. 61 |
| Radiation Hardness | p. 67 |
| Radiation-Induced Effects on Silicon | p. 68 |
| Bulk Damage | p. 68 |
| Surface Effects | p. 80 |
| Sensor Concepts | p. 81 |
| Overview of Sensor Types | p. 82 |
| p[superscript +] in n: Low-Cost Solution for Applications in a Low- or Medium-Radiation Environment | p. 85 |
| n[superscript +] in n: Solution for Applications in a High-Radiation Environment | p. 97 |
| Processing of Silicon Wafers | p. 110 |
| Production and Cleaning of Silicon | p. 111 |
| Thermal Oxidation | p. 113 |
| Layer Deposition | p. 113 |
| Photolithographic Steps | p. 114 |
| Etching | p. 115 |
| Doping | p. 116 |
| Metallization | p. 118 |
| Example of a Process Sequence | p. 118 |
| Detector Materials Other Than Silicon | p. 121 |
| Gallium Arsenide | p. 122 |
| CdTe and CdZnTe | p. 124 |
| Diamond | p. 125 |
| The Front-End Electronics | p. 129 |
| Introduction | p. 129 |
| Generic Pixel Chip | p. 130 |
| Simple Sensor Model | p. 133 |
| Generic PUC | p. 135 |
| Module Controller Chips | p. 143 |
| Design Aspects | p. 144 |
| Typical Specifications | p. 145 |
| Radiation-Tolerant Design | p. 154 |
| Cross Talk | p. 157 |
| Testability and Ease of Operation | p. 160 |
| Analog Signal Processing | p. 161 |
| Charge Amplification | p. 162 |
| Feedback and Leakage Compensation | p. 163 |
| Hit Discrimination | p. 168 |
| Threshold Trim | p. 170 |
| Noise in a Simple FET Amplifier | p. 171 |
| Noise in Charge Amplifier/Shaper Combination | p. 178 |
| FET Preamplifer | p. 183 |
| Bipolar Amplifier | p. 184 |
| Summary | p. 186 |
| Readout Architectures | p. 187 |
| Chips Without Data Buffering | p. 188 |
| Chips with Zero Suppression and Data Buffering | p. 188 |
| Counting Chips | p. 197 |
| Integration and System Aspects | p. 201 |
| Introduction | p. 201 |
| Modules | p. 202 |
| Bump Bonding | p. 203 |
| Solder Bumping and Bonding Process | p. 204 |
| Indium Bump-Bonding Process | p. 206 |
| Gold-Stud Bump-Bonding Process | p. 210 |
| Quality Control of Bump-Bonded Assemblies | p. 212 |
| Rework of Bump-Bonded Assemblies | p. 213 |
| Thinning of Electronics Wafers | p. 214 |
| "Dressing" the Modules | p. 214 |
| Flex Hybrid | p. 215 |
| Multichip Module Deposited | p. 216 |
| Support Mechanics and Cooling | p. 218 |
| Mechanical Supports | p. 219 |
| Cooling | p. 220 |
| Power and Signal Interconnect in High-Luminosity Colliders | p. 222 |
| Operation in High-Radiation Environment | p. 223 |
| Pixel Detector Applications | p. 225 |
| Pixel Detectors for High-Luminosity Collider Experiments | p. 225 |
| Large Systems in Construction | p. 231 |
| ATLAS | p. 232 |
| CMS | p. 237 |
| ALICE | p. 241 |
| BTeV | p. 243 |
| Pixel Detectors for Imaging Applications | p. 246 |
| Pixel Imaging Systems in Operation | p. 250 |
| Counting Pixels for Radiography | p. 251 |
| Pixel Detectors for Protein Crystallography with Synchrotron Radiation | p. 254 |
| Autoradiography with Pixel Detectors | p. 256 |
| Trends and New Developments for Pixel Detectors | p. 261 |
| Introduction | p. 261 |
| Limitations and Prospects of the Hybrid Pixel Technology | p. 262 |
| MCM-D Integration | p. 263 |
| Interleaved Hybrid Pixels | p. 265 |
| Active Edge Three-Dimensional Silicon Pixel Detectors | p. 267 |
| Monolithic and Semimonolithic Pixel Detectors | p. 269 |
| Monolithic Pixels on Bulk Silicon | p. 271 |
| Monolithic CMOS Pixels | p. 272 |
| Monolithic SOI Pixels | p. 276 |
| Amorphous Silicon above CMOS Pixel Electronics | p. 277 |
| DEPFET Pixels | p. 278 |
| Glossary | p. 283 |
| References | p. 289 |
| Index | p. 301 |
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