
New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation
By: Mohaiminul Alam, Shawon Alam, Nabil Shovon Ashraf
Paperback | 16 February 2016
At a Glance
Paperback
$50.00
Ships in 5 to 7 business days
ISBN: 9783031008993
ISBN-10: 3031008995
Series: Synthesis Lectures on Emerging Engineering Technologies
Published: 16th February 2016
Format: Paperback
Language: English
Number of Pages: 84
Audience: Professional and Scholarly
Publisher: Springer Nature B.V.
Country of Publication: GB
Dimensions (cm): 23.5 x 19.08 x 0.43
Weight (kg): 0.16
Shipping
| Standard Shipping | Express Shipping | |
|---|---|---|
| Metro postcodes: | $9.99 | $14.95 |
| Regional postcodes: | $9.99 | $14.95 |
| Rural postcodes: | $9.99 | $14.95 |
Orders over $79.00 qualify for free shipping.
How to return your order
At Booktopia, we offer hassle-free returns in accordance with our returns policy. If you wish to return an item, please get in touch with Booktopia Customer Care.
Additional postage charges may be applicable.
Defective items
If there is a problem with any of the items received for your order then the Booktopia Customer Care team is ready to assist you.
For more info please visit our Help Centre.
You Can Find This Book In
This product is categorised by
- Non-FictionEngineering & TechnologyElectronics & Communications EngineeringElectronics EngineeringCircuits & Components
- Non-FictionEngineering & TechnologyEnergy Technology & EngineeringElectrical Engineering
- Non-FictionEngineering & TechnologyElectronics & Communications EngineeringElectronics EngineeringElectronic Devices & MaterialsSemi-Conductors & Super-Conductors
- Non-FictionEngineering & TechnologyTechnology in GeneralEngineering in General
- Non-FictionComputing & I.T.Computer Hardware
- Non-FictionEngineering & TechnologyMechanical Engineering & MaterialsMaterials Science
























