MEMS/MOEM Packaging

PREFACEChapter 1: Engineering Fundamentals of MEMS and MOEMS Electronic Packaging1.1: The Package as the Vital Bridge1.2: Packaging Challenges1.3: Multiple Functions1.4: Package Types1.5: Reliability and Qualification1.6: SummaryChapter 2: Principles, Materials, and Fabrication of MEMS and MOEMS Devices2.1: Definitions and Classifications2.2: Basic Principles2.3: Sensing2.4: MEMS Sensor Principles2.5: Motion Actuation2.6: MEMS "Engines"2.7: CAD Structure Library; Building Blocks2.8: MEMS Devices2.9: Optical-MEMS; MOEMS2.10: Intelligent MEMS2.11: MEMS Applications2.12: MOEMS Devices -- MEMS Plus Light2.13: SummaryChapter 3: MEMS and MOEMS Packaging Challenges and Strategies3.1: Product-Specific Character of MEMS Packaging3.2: MEMS General Packaging Requirements3.3: Hermeticity: Levels, Evaluation Methods, and Requirements: Perceived vs. Actual3.4: Cost versus Performance Tradeoffs3.5: Emergence of Low-Cost Near-Hermetic Packaging3.6: Manufacturing Process Comparisons3.7: The Packaging MOEMS (Optical-MEMS) -- Additional Requirements3.8: Packages for Materials Handling3.9: NHP Beyond MEMSChapter 4: MEMS Packaging Processes4.1: Release Step4.2: Singulation: Sawing and Protection4.3: Capping Approaches4.4: Die Attach4.5: Wire Bonding4.6: Flip Chip Methods4.7: Tape Automated Bonding (TAB)4.8: Selective Underfill and Encapsulation4.9: Lid Sealing4.10: Antistiction Processes4.11: In-Process Handling4.12: Applying In-Package Additives4.13: Equipment4.14: Testing4.15: Reliability4.16: Selecting the Right MEMS/MOEMS Package and Materials4.17: Conclusions and SummaryChapter 5: MEMS Packaging Materials5.1: The Process Determines the Materials5.2: Joining Materials5.3: Assembly Issues and Material Solutions5.4: In-Package Additives5.5: ConclusionsChapter 6: From MEMS and MOEMS to Nano Technology6.1: Definitions are Important6.2: Combining Nano and MEMS6.3: Packaging Nano6.4: Summary, Conclusions and the FutureBibliographyIndex