Materials Research and Engineering

1 Introduction.- 1.1 Scope of the Book.- 1.2 General Remarks on the Use and the Behavior of Ceramic Materials.- 1.3 The History of Alumina.- 1.4 Preceding Summarizing Literature on Alumina.- 2 Physical Properties.- 2.1 Structure.- 2.2 Thermal Properties.- 2.3 Diffusion.- 2.3.1 General Remarks on Diffusion Phenomena in Ceramics.- 2.3.2 Intrinsic Diffusion and Disorder Mechanism.- 2.3.3 Extrinsic Diffusion.- 2.3.4 Problems in Determining the Diffusion Coefficient.- 2.3.5 Diffusion Data.- 2.4 Electrical Conductivity.- 2.5 Sintering and Grain Growth.- 2.5.1 Fundamental Sintering Mechanisms in Al2O3.- 2.5.2 Intermediate and Final-Stage Sintering.- 2.5.3 Influence of Additives.- 2.5.4 Effect of MgO.- 2.5.5 Influence of Atmospheres.- 2.5.6 Grain Growth.- 2.6 Hot Pressing.- 2.7 Segregation.- 3 Mechanical Properties.- 3.1 Elastic Properties.- 3.2 Fracture Strength.- 3.2.1 The Strength of Ceramics.- 3.2.2 Fracture Energy.- 3.2.3 Types of Flaws.- 3.2.4 Strength Data.- 3.2.5 Strength-Grain Size Relationships.- 3.3 Time-Dependent Strength and Subcritical Crack Growth.- 3.3.1 The Model of Time-Dependent Strength.- 3.3.2 Subcritical Crack Growth Data.- 3.3.3 Fatigue Data.- 3.3.4 Mechanisms of Slow Crack Growth in Alumina.- 3.4 Thermal and Mechanical Shock Resistance.- 3.4.1 Thermal Shock Properties.- 3.4.2 Mechanical Shock Properties.- 3.4.3 Crack Healing.- 3.5 Plastic Deformation.- 3.5.1 Slip.- 3.5.2 Twinning.- 3.5.3 Hardness.- 3.5.4 Abrasive Wear.- 3.6 Creep.- 3.6.1 Basic Creep Mechanisms.- 3.6.2 Creep of Pure and MgO-Doped Alumina.- 3.6.3 Effect of Other Dopants.- 3.6.4 High Temperature Failure Mechanisms.- 3.7 Strengthening Mechanisms.- 3.7.1 Second Phase Dispersions.- 3.7.2 Compressive Surface Stresses.- 3.7.3 Transformation Thoughening.- 4 Fabrication.- 4.1 Preparation of Powders.- 4.2 Forming.- 4.2.1 Dry Pressing.- 4.2.2 Hydrostatic Molding.- 4.2.3 Extrusion.- 4.2.4 Injection Molding.- 4.2.5 Hot Pressing.- 4.3 Sintering.- 4.4 Hard Machining.- 4.5 Quality Control.- 4.6 Manufacturing Tolerances.- 4.7 Principles of Design.- 5 Applications.- 5.1 Electronic Applications.- 5.1.1 Metal-to-Ceramic Bonding.- 5.1.2 Spark-Plug Insulators.- 5.1.3 Components and Housings for Electron Tubes.- 5.1.4 Discharge Lamps.- 5.1.5 Microelectronics.- 5.2 Mechanical Engineering Applications.- 5.2.1 Thread Guides for Textile Machines.- 5.2.2 Wire Drawing Step Cones.- 5.2.3 Paper Machine Covers.- 5.2.4 Bearings.- 5.2.5 Cutting Tools.- 5.3 Medical Applications.- 5.3.1 Artificial Joints.- 5.3.2 Dental Implants.- 5.3.3 Maxillary Reconstructions.- 5.4 Armor Applications.- 5.5 Other Applications.- References.