Electronic Packaging and Interconnects

By: Luc Martens

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Hardcover | 31 October 1998

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Hardcover
176 Pages

Dimensions(cm)
24.13 x 16.51 x 1.91

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High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems.
High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models.
High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.

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Non-Fiction Engineering & Technology Technology in General Technical Design Reference, Information & Interdisciplinary Subjects Research & Information Information theory Cybernetics & Systems Theory Electronics & Communications Engineering Electronics Engineering Microwave Technology Energy Technology & Engineering

Electrical Engineering Automatic Control Engineering Robotics Communications Engineering & Telecommunications

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Paperback

Published: 23rd February 2014

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Preface
Electronic packaging and high frequencies
Electrical description of electronic packaging
High-frequency measurement techniques
High-frequency measurement techniques for electronic packaging
Measurement-based modeling algorithms
Index
Table of Contents provided by Blackwell. All Rights Reserved.

Electronic Packaging and Interconnects

At a Glance

Hardcover

Shipping

How to return your order

Defective items

You Can Find This Book In

Other Editions and Formats

Paperback

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