| Foreword | |
| Preface | |
| Authors' Biographies | |
| Acknowledgments | |
| Introduction | p. 1 |
| Microelectronics Manufacturing Diagnostics - Why? | p. 1 |
| Yield - The Objective | p. 1 |
| Technology of Packaged Microelectronics | p. 2 |
| The Manufacturing Technology Cycle | p. 3 |
| Process Overview | p. 4 |
| Shrinking Circuit Cost | p. 6 |
| Handbook Overview | p. 6 |
| Reader's Guide to the Handbook | p. 7 |
| Manufacturing Yield | p. 9 |
| Yield Management | p. 10 |
| Yield Planning: Estimates and Projections | p. 19 |
| Yield Models: Models and Applications | p. 21 |
| Problem Diagnostics | p. 36 |
| Manufacturing Line Management System | p. 36 |
| Data Management | p. 42 |
| Problem Solving | p. 48 |
| Problem Case Studies | p. 49 |
| Manufacturing Defect Classification System | p. 62 |
| Classification of Microelectronics Manufacturing Defects | p. 62 |
| Semiconductor Integrated Circuits | p. 76 |
| Packaging | p. 78 |
| Printed-Circuit Boards | p. 79 |
| Microelectronics Manufacturing Trends | p. 80 |
| Product Dimensional Metrology and Pattern Defect Inspection | p. 95 |
| Requirement Trends and Metrology Model | p. 96 |
| Overlay Metrology | p. 112 |
| Image Placement Metrology | p. 113 |
| Pattern Defect Inspection | p. 117 |
| Process and Tool Monitoring | p. 135 |
| Process Design and Characterization | p. 136 |
| Statistical Process Controls | p. 139 |
| Process Capability | p. 143 |
| Distributed Process Control | p. 143 |
| Measurements and Characterizations | p. 154 |
| Connecting Process Variables and Physical Parameters | p. 157 |
| Tool and Process Characterizations | p. 159 |
| Process Variability | p. 159 |
| Contamination Monitoring | p. 161 |
| Types of Contaminants | p. 163 |
| Sources of Contaminants | p. 165 |
| Bulk Transport of Contaminants | p. 167 |
| Deposition of Contaminants onto Surfaces | p. 168 |
| Defects, Yield and Reliability | p. 170 |
| Sampling | p. 170 |
| Analysis | p. 175 |
| Standards | p. 193 |
| Monitor Arrays and Data Processing | p. 195 |
| Contamination Monitoring in Microelectronics Plants: Examples | p. 198 |
| Sources of Additional Information | p. 198 |
| Repair and Rework | p. 205 |
| General Considerations | p. 205 |
| Repair | p. 207 |
| Rework | p. 221 |
| Defect Tolerance | p. 226 |
| Test Sites and Vehicles for Yield and Process Monitoring | p. 231 |
| Test Structures for Microelectronics | p. 232 |
| Test Sites | p. 237 |
| Critical Area Computation Area | p. 241 |
| Yield Modeling and Yield Projection | p. 243 |
| Diagnostics, Process and Design Optimization | p. 252 |
| Process Development and Defect Learning | p. 254 |
| Present and Future Role of Defect Test Sites | p. 257 |
| In-Line Electrical Test | p. 259 |
| The Test Sector | p. 265 |
| Test Structures and Test Sites | p. 269 |
| Data Utilization | p. 284 |
| The Future | p. 288 |
| Final Test | p. 294 |
| Basic Test Methodology | p. 294 |
| Automated Test Equipment | p. 305 |
| Advances in Test Methodology | p. 310 |
| Test Data | p. 313 |
| Future Trends in Test | p. 318 |
| Traceability | p. 320 |
| The Importance of Traceability: Two Practical Examples | p. 320 |
| The Elements of a Traceability System | p. 322 |
| Traceability in Component Manufacturing | p. 324 |
| Traceability at Higher Levels of Assembly | p. 336 |
| Utilizing Traceability Data | p. 342 |
| Failure Analysis of Semiconductor Devices | p. 348 |
| Origin and Methodology of Failure Analysis | p. 349 |
| Preparation of Failed Devices (Non-Destructive) | p. 351 |
| Preferential Film Delayering | p. 357 |
| Electrical Defect Isolation Methods | p. 362 |
| Package and Chip Device Sectioning Techniques | p. 368 |
| Chemical Structure Enhancements | p. 377 |
| Reactive Ion Etching Enhancements | p. 380 |
| Scanning Electron Microscope (SEM) | p. 380 |
| Focused Ion Beam Cross Sections (FIB) | p. 389 |
| Image Management for Failure Analysis | p. 390 |
| Materials and Chemical Analysis of Electronic Devices | p. 396 |
| Structural Analysis by Transmission Electron Microscopy | p. 399 |
| Surface and Depth Profiling Analysis | p. 403 |
| Stress Determination by X-Ray Diffraction and Raman Microprobe | p. 411 |
| Contamination Analysis | p. 415 |
| Modeling for Manufacturing Diagnostics | p. 425 |
| Application of Modeling in Manufacturing Diagnosis | p. 425 |
| Process Models | p. 429 |
| Computer Modeling Tools | p. 450 |
| Examples of Model-Based Manufacturing Diagnostics | p. 459 |
| Artificial Intelligence Techniques for Analysis: Expert Systems and Neural Networks | p. 469 |
| Expert Systems as Tools for Manufacturing Diagnosis | p. 469 |
| The Semiconductor Engineering Expert Diagnostic System (SEEDS) | p. 484 |
| Semiconductor Diagnostics with Neural Networks | p. 491 |
| Statistical Quality Control | p. 503 |
| Probability Distributions | p. 506 |
| Acceptance Sampling | p. 516 |
| Statistical Process Control | p. 522 |
| Appendix 1. Normal Cumulative Probability Distribution Function | p. 530 |
| Appendix 2. Percentage Points, Chi-Square Distribution | p. 532 |
| Appendix 3. Table of Factors for Setting Control Limits | p. 533 |
| Glossary | p. 533 |
| Acronyms | p. 534 |
| Variables and Symbols | p. 534 |
| Greek Letters | p. 534 |
| Reliability/Defect Severity | p. 536 |
| Objective | p. 541 |
| Early Fails | p. 541 |
| Wearout | p. 544 |
| Failure Mechanisms | p. 544 |
| Reliability Testing | p. 552 |
| Time-to-Fail Models and Applications to Semiconductors, Packaging and Printed Circuit Boards | p. 556 |
| Application Remarks | p. 575 |
| Appendix 1 | p. 577 |
| Burn-In | p. 581 |
| Reliability Modeling and Failures | p. 582 |
| Burn-in Modeling | p. 590 |
| Design Considerations | p. 597 |
| Burn-in Methods | p. 599 |
| Defect Prevention | p. 605 |
| Product Quality: Increasing Expectations | p. 605 |
| Cost of Poor Quality | p. 605 |
| What is Possible | p. 606 |
| Strategy Overview | p. 606 |
| Results | p. 621 |
| Index | p. 623 |
| Table of Contents provided by Blackwell. All Rights Reserved. |
