Compound Semiconductor Integrated Circuits

By: Tho T Vu (Editor)

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Hardcover | 7 April 2003

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Hardcover
364 Pages

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24.77 x 17.15 x 2.16

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This is the book version of a special issue of the "International Journal of High Speed Electronics and Systems", reviewing recent work in the field of compound semiconductor integrated circuits. There are 14 invited papers covering a wide range of applications, frequencies and materials. These papers deal with digital, analog, microwave and millimeter-wave technologies, devices and integrated circuits for wireline fiber-optic lightwave transmissions, and wireless radio-frequency microwave and millimeter-wave communications. In each case, the market is young and experiencing rapid growth for both commercial and millitary applications. Many new semiconductor technologies compete for these new markets, leading to an alphabet soup of semiconductor materials described in these papers. The book also includes three papers focused on radiation effects and reliability in III-V semiconductor electronics, which are useful for reference and future directions. Moreover, reliability is covered in several papers separately for certain process technologies.

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Non-Fiction Engineering & Technology Electronics & Communications Engineering Electronics Engineering Circuits & Components Electronic Devices & Materials Semi-Conductors & Super-Conductors Energy Technology & Engineering Electrical Engineering Booktopia Publisher Services World Scientific Publishing

Preface
Present and Future of High-Speed Compound Semiconductor IC's	p. 1
A Comparison of Silicon and III-V Technology Performance and Building Block Implementations for 10 and 40 Gb/s Optical Networking ICs	p. 27
The Transforming MMIC	p. 59
Metamorphic Low Noise Amplifiers and Optical Components	p. 65
GaAs PHEMT Chip Sets and IC Processes for High-End Fiber Optic Applications	p. 91
Distributed Amplifier for Fiber-Optic Communication Systems	p. 111
The InP-HEMT IC Technology for 40-Gbit/s Optical Communications	p. 141
Integrated SiGe and Si Device Capabilities and Trends for Multi-GigaHertz Applications	p. 175
High-Speed, Low-Power Digital and Analog Circuits Implemented in IBM SiGe BiCMOS Technology	p. 221
A SiGe HBT IC Chipset for 40-Gb/s Optical Transmission Systems	p. 239
Microwave GaN-Based Power Transistors on Large-Scale Silicon Wafers	p. 265
Radiation Effects in High Speed III-V Integrated Circuits	p. 277
Radiation Effects in III-V Semiconductor Electronics	p. 293
Reliability and Radiation Hardness of Compound Semiconductors	p. 327
Table of Contents provided by Blackwell. All Rights Reserved.

Compound Semiconductor Integrated Circuits

At a Glance

Hardcover

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You Can Find This Book In

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