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3D Stacked Chips : From Emerging Processes to Heterogeneous Systems - Ibrahim (Abe) M. Elfadel

3D Stacked Chips

From Emerging Processes to Heterogeneous Systems

By: Ibrahim (Abe) M. Elfadel

eText | 11 May 2016

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This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.

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Non-FictionEngineering & TechnologyElectronics & Communications EngineeringElectronics EngineeringCircuits & ComponentsComputing & I.T.Computer ScienceComputer Architecture & Logic Design

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Paperback

Published: 26th May 2018

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