Understanding Smart Sensors

By: Randy Frank

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Hardcover | 1 December 1995

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Hardcover
288 Pages

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24.13 x 16.51 x 2.54

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"Two of the most important trends in sensor development in recent years have been advances in micromachined sensing elements of all kinds, and the increase in intelligence applied at the sensor level. This book addresses both, and provides a good overview of current technology." -- I&CS

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Preface	p. xv
Smart Sensor Basics	p. 1
Introduction	p. 1
Mechanical-Electronic Transitions in Sensing	p. 3
Nature of Sensors	p. 4
Integration of Micromachining and Microelectronics	p. 9
Summary	p. 14
References	p. 14
Micromachining	p. 15
Introduction	p. 15
Bulk Micromachining	p. 16
Silicon on Silicon Bonding	p. 19
Silicon on Glass (Anodic) Bonding	p. 20
Surface Micromachining	p. 20
Squeeze-Film Damping	p. 22
Stiction	p. 23
Particulate Control	p. 23
Combinations of Surface and Bulk Micromachining	p. 24
Other Micromachining Techniques	p. 25
LIGA Process	p. 25
Dry Etching Processes	p. 25
Silicon Fusion Bonding	p. 27
Lasers in Micromachining	p. 28
Post Etching to Obtain Smarter Structures	p. 29
Other Micromachined Materials	p. 33
Diamond as an Alternate Sensor Material	p. 33
Metal Oxides and Piezoelectric Sensing	p. 34
Films on Microstructures	p. 34
Summary	p. 35
References	p. 35
The Nature of Semiconductor Sensor Output	p. 39
Introduction	p. 39
Sensor Output Characteristics	p. 39
Wheatstone Bridge	p. 40
Piezoresistivity in Silicon	p. 41
Semiconductor Sensor Definitions	p. 43
Static versus Dynamic Operation	p. 45
Other Sensing Technologies	p. 46
Capacitive Sensing	p. 46
Piezoelectric Sensing	p. 46
Hall Effect	p. 48
Chemical Sensors	p. 49
Improving Sensor Characteristics	p. 49
Digital Output Sensors	p. 50
Incremental Optical Encoders	p. 50
Digital Techniques	p. 51
Noise/Interference Aspects	p. 53
Low-Power, Low-Voltage Sensors	p. 53
Impedance	p. 54
An Analysis of Sensitivity Improvement	p. 54
Thin Diaphragm	p. 54
Increase Diaphragm Area	p. 54
Combined Solution: Micromachining and Microelectronics	p. 55
Summary	p. 55
References	p. 56
Getting Sensor Information into the MCU	p. 57
Introduction	p. 57
Amplification and Signal Conditioning	p. 57
Instrumentation Amplifiers	p. 59
Sleep-Mode Operational Amplifier	p. 59
Rail-to-Rail Operational Amplifiers	p. 60
Switched-Capacitor Amplifier	p. 64
Barometer Application Circuit	p. 64
A 4- to 20-mA Signal Transmitter	p. 65
Schmitt Trigger	p. 65
Separate versus Integrated Signal Conditioning	p. 65
Integrated Passive Elements	p. 68
Integrated Active Elements	p. 68
Digital Conversion	p. 68
A/D Converters	p. 70
ADC Performance	p. 72
ADC Accuracy/Error Implications	p. 74
Summary	p. 74
References	p. 75
Using MCUs/DSPs to Increase Sensor IQ	p. 77
Introduction	p. 77
Other IC Technologies	p. 77
Logic Requirements	p. 78
MCU Control	p. 79
MCUs for Sensor Interface	p. 79
Peripherals	p. 80
Memory	p. 80
I/O	p. 81
Onboard A/D Conversion	p. 81
Power-Saving Capability	p. 83
Local Voltage or Current Regulation	p. 84
Modular MCU Design	p. 85
DSP Control	p. 85
Algorithms versus Look-Up Tables	p. 88
Techniques and Systems Considerations	p. 88
Linearization	p. 89
PWM Control	p. 89
Autozero and Autorange	p. 90
Diagnostics	p. 93
EMC/RFI Reduction	p. 93
Indirect (Computed not Sensed) versus Direct Sensing	p. 93
Software, Tools, and Support	p. 94
Sensor Integration	p. 94
Summary	p. 96
References	p. 97
Communications for Smart Sensors	p. 99
Introduction	p. 99
Background and Definitions	p. 99
Background	p. 101
Sources (Organizations) and Standards	p. 102
Automotive Protocols	p. 103
SAE J1850	p. 103
CAN Protocol	p. 105
Other Automotive Protocols	p. 108
Industrial Networks	p. 108
Industrial Usage of CAN	p. 109
LonTalk Protocol	p. 110
Other Industrial Protocols	p. 110
Office/Building Automation	p. 111
Home Automation	p. 111
CEBus	p. 112
LonTalk	p. 112
Protocols in Silicon	p. 113
MCU with Integrated SAE J1850	p. 113
MCU with Integrated CAN	p. 113
Neuron Chips and LonTalk Protocol	p. 118
MI-Bus	p. 119
Other MCUs and Protocols	p. 120
Other Aspects of Network Communications	p. 120
MCU Protocols	p. 121
Transition between Protocols	p. 121
The Protocol as a Module	p. 122
Summary	p. 123
References	p. 123
Control Techniques	p. 125
Introduction	p. 125
Programmable Logic Controllers	p. 125
Open versus Closed-Loop Systems	p. 126
PID Control	p. 126
State Machines	p. 129
Fuzzy Logic	p. 129
Neural Networks	p. 133
Combined Fuzzy + Neural	p. 135
Adaptive Control	p. 136
Other Control Areas	p. 137
RISC versus CISC Architecture	p. 138
Combined CISC, RISC, and DSP	p. 140
Impact of Artificial Intelligence	p. 141
Summary	p. 142
References	p. 142
Transceivers, Transponders, and Telemetry	p. 145
Introduction	p. 145
The RF Spectrum	p. 146
Spread Spectrum	p. 148
Wireless Data and Communications	p. 150
Wireless Local Area Networks	p. 151
Fax/Modems	p. 151
Wireless Zone Sensing	p. 152
Optical Signal Transmission	p. 153
RF Sensing	p. 153
SAW	p. 154
Radar	p. 155
Global Positioning System (GPS)	p. 156
Remote Emissions Sensing	p. 157
Remote Keyless Entry	p. 158
Intelligent Transportation System	p. 159
RF-ID	p. 161
Other Remote Sensing	p. 162
Measuring RF Signal Strength	p. 163
Telemetry	p. 163
Summary	p. 165
References	p. 166
Microelectromechanical Systems (MEMS)	p. 169
Introduction	p. 169
Micromachined Actuators	p. 169
Microvalves	p. 170
Micromotors	p. 171
Micropumps	p. 173
Microdynamometer	p. 175
Actuators in Other Semiconductor Materials	p. 176
Other Micromachined Structures	p. 176
Cooling Channels	p. 176
Micro-Optics	p. 177
Microgripper	p. 178
Microprobes	p. 179
Micromirrors	p. 179
Heating Elements	p. 180
Thermionic Emitters	p. 180
Field Emission Devices	p. 181
Unfoldable Microelements	p. 182
Micronozzles	p. 184
Interconnects for Stacked Wafers	p. 184
Summary	p. 185
References	p. 185
Packaging Implications of Smarter Sensors	p. 187
Introduction	p. 187
Semiconductor Packaging Applied to Sensors	p. 187
Increased Pin Count	p. 190
Hybrid Packaging	p. 191
Ceramic Packaging and Ceramic Substrates	p. 191
Multichip Modules	p. 191
Dual-Chip Packaging	p. 193
Ball Grid Array Packaging	p. 194
Packaging for Monolithic Sensors	p. 195
Plastic Packaging	p. 196
Surface-Mount Packaging	p. 196
Flip-Chip	p. 196
Wafer-Level Packaging	p. 198
Reliability Implications	p. 199
Wafer-Level Sensor Reliability	p. 202
Summary	p. 203
References	p. 203
Mechatronics and Sensing Systems	p. 205
Introduction	p. 205
Integration and Mechatronics	p. 205
Smart-Power ICs	p. 206
Embedded Sensing	p. 208
Temperature Sensing	p. 208
Current Sensing in Power ICs	p. 211
Diagnostics	p. 211
Sensing Arrays	p. 215
Multiple Sensing Devices	p. 215
Multiple Types of Sensors	p. 218
An Integrated Sensing System	p. 218
Other System Aspects	p. 219
Batteries	p. 219
Field Emission Displays	p. 220
System Voltage Transients, ESD, and EMI	p. 220
Summary	p. 222
References	p. 222
The Next Phase of Sensing Systems	p. 225
Introduction	p. 225
Future Semiconductor Capabilities	p. 225
Future System Requirements	p. 227
Not-So-Future Systems	p. 228
Fabry-Perot Interferometer	p. 228
HVAC Sensor Chip	p. 229
Speech Recognition and Micro-Microphones	p. 230
Microgyroscope	p. 231
MCU with Integrated Pressure Sensor	p. 231
Software, Sensing, and the System	p. 231
Alternate Views of Smart Sensing	p. 236
Summary	p. 236
References	p. 238
Smart Sensor Acronym Decoder and Glossary	p. 241
About the Author	p. 259
Index	p. 261
Table of Contents provided by Syndetics. All Rights Reserved.

Understanding Smart Sensors

At a Glance

Hardcover

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