TSV 3D RF Integration

High Resistivity Si Interposer Technology

By: Shenglin Ma, Yufeng Jin

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Paperback | 27 April 2022 | Edition Number 1

At a Glance

Paperback
292 Pages

Dimensions(cm)
23.5 x 19.05 x 1.55

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TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters.

A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology.

Provides a detailed demonstration of the design and process development of HR-Si (High-Resistivity Silicon) interposer technology
Presents a series of implementation case studies that detail modeling and simulation, integration, qualification and testing methods
Offers a systematic and comparative literature review of HR-Si interposer technology by topic
Offers solutions to problems with TSV (through silicon via) interposer technology, including high frequency loss and cooling problems
Gives a systematic and accessible accounting on this leading technology

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