Thin-Film Capacitors for Packaged Electronics

By: Jain Pushkar, Eugene J. Rymaszewski

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Hardcover | 30 November 2003

At a Glance

Hardcover
180 Pages

Dimensions(cm)
23.5 x 16.51 x 1.91

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Thin-Film Capacitors for Packaged Electronics deals with the capacitors of a wanted kind, still needed and capable of keeping pace with the demands posed by ever greater levels of integration. It spans a wide range of topics, from materials properties to limits of what's the best one can achieve in capacitor properties to process modeling to application examples. Some of the topics covered are the following:
-Novel insights into fundamental relationships between dielectric constant and the breakdown field of materials and related capacitance density and breakdown voltage of capacitor structures,
-Electrical characterization techniques for a wide range of frequencies (1 kHz to 20 GHz),
-Process modeling to determine stable operating points,
-Prevention of metal (Cu) diffusion into the dielectric,
-Measurements and modeling of the dielectric micro-roughness.

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You Can Find This Book In

Non-Fiction Science Physics Electricity Engineering & Technology Mechanical Engineering & Materials Materials Science Electronics & Communications Engineering Electronics Engineering Electronic Devices & Materials Semi-Conductors & Super-Conductors Energy Technology & Engineering

Electrical Engineering Production & Industrial Engineering Industrial Chemistry & Manufacturing Technologies

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Paperback

Published: 23rd February 2014

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Preface
Acknowledgements
Introduction
Capacitor Fundamentals
Application Domains
Physical Structures/Embodiments
Capacitor Integration Drivers
Thin-Film Capacitor Technology
Summary
References
Design Fundamentals
Breakdown Voltage and Capacitance Density Design Limits
Tolerance in Capacitance Density
DC Leakage
Capacitor Losses
Series Inductance and Resistance
References
Performance Detractors
Interfacial Micro-roughness
Deviation from Optimal Stoichiometry
Film Microstructure
References
Electrical Characterization
Thin Film Decoupling Capacitors
Characterization Methodologies
Test Vehicle: Design and Fabrication
Dielectric Constant and Loss
Total Series Inductance
Leakage Current Density
Capacitance Density and Breakdown Field
Summary and Conclusion
References
Integration Issues And Challenges
Metal Diffusion into Dielectrics
Interlayer Stresses and Adhesion
Low Thermal Budget
References
Applications
2D Interconnections in ICs
Integration into 2D Packaging
Flex Circuits
Large Area Power Distribution
Integration into 3D Structures
Electromagnetic Considerations
Power Electronics
References
Index
Table of Contents provided by Publisher. All Rights Reserved.

Thin-Film Capacitors for Packaged Electronics

At a Glance

Hardcover

Shipping

How to return your order

Defective items

You Can Find This Book In

Other Editions and Formats

Paperback

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