Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging
By: Shuye Zhang, Guoli Sun
Hardcover | 1 July 2025
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Hardcover
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ISBN: 9781837241408
ISBN-10: 1837241406
Series: Materials, Circuits and Devices
Published: 1st July 2025
Format: Hardcover
Language: English
Number of Pages: 300
Dimensions (cm): 23.42 x 15.62
Weight (kg): 0.46
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