Springer Materials Science

Applications and Technology

By: Marin Alexe (Editor), Ulrich Gosele (Editor), Ulrich G. Sele (Editor)

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Hardcover | 14 May 2004

At a Glance

Hardcover
522 Pages

Dimensions(cm)
23.5 x 15.88 x 1.91

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During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

Industry Reviews

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"Wafer bonding, also known as direct wafer bonding or wafer fusion, has developed from an almost obscure niche technology in the 1980s ... . Anyone interested in learning about the basics of wafer bonding and its various application areas, will likely be served by this outstanding volume while the researcher engaged in studies on applied and technological aspects of wafer bonding, will find up-to-date information about this fast-moving area, including relevant patent information." (Current Engineering Practice, Vol. 47 (3), 2004 - 2005)

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You Can Find This Book In

Non-Fiction Engineering & Technology Electronics & Communications Engineering Electronics Engineering Electronic Devices & Materials Semi-Conductors & Super-Conductors Science Physics Materials & States of Matter Other Technologies & Applied Sciences Applied Optics Energy Technology & Engineering

Electrical Engineering Mechanical Engineering & Materials Materials Science

Direct bonding, fusion bonding, anodic bonding, wafer bonding : a historical patent picture of the worldwide moving front of the state-of-the-art of contact bonding	p. 1
Basics of silicon-on-insulator (SOI) technology	p. 61
Silicon-on-insulator by the Smart Cut process	p. 85
ELTRAN technology based on wafer bonding and porous silicon	p. 107
Wafer bonding for high-performance logic applications	p. 157
Application of bonded wafers to the fabrication of electronic devices	p. 193
Compound semiconductor heterostructures by Smart Cut : SiC on insulator, QUASIC substrates, InP and GaAs heterostructures on silicon	p. 263
Three-dimensional photonic bandgap crystals by wafer bonding approach	p. 315
Wafer direct bonding for high-brightness light-emitting diodes and vertical-cavity surface-emitting lasers	p. 327
High-density hybrid integration of III-V compound optoelectronics with silicon integrated circuits	p. 359
Layer transfer by bonding and laser lift-off	p. 377
Single-crystal lithium niobate films by crystal ion slicing	p. 417
Wafer bonding of ferroelectric materials	p. 451
Debonding of wafer-bonded interfaces for handling and transfer applications	p. 473
Table of Contents provided by Blackwell. All Rights Reserved.

Springer Materials Science

Applications and Technology

At a Glance

Hardcover

Industry Reviews

Shipping

How to return your order

Defective items

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