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Springer Advanced Microelectronics

By: Jan A. Dziuban

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Hardcover | 13 June 2006

At a Glance

Hardcover
352 Pages

Dimensions(cm)
24.13 x 15.24 x 1.27

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Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Followed by the presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applications of basic micromechanical structures in microsystems are shown. Next, high-temperature, low temperature and room-temperature bonding and their applications in microsystem technology are presented. The following part of the book contains the detailed description of anodic bonding, starting from analysis of properties of glasses suitable for anodic bonding, and discussion of the nature of the process. Next all types of anodic bonding and sealing procedures used in microsystem technology are presented. This part of the book finishes with examples of applications of anodic bonding in microsystem technology taken from the literature but mainly based on the author's personal experience.

Industry Reviews

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"Any one interested in bonding in microsystem technology will likely be well served by this outstanding volume which is addressed to scientists and researchers, as well as to academic teachers and students, engineers active in the field of electric/electronics and microelectronics. ... Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students." (Current Engineering Practice, 2007)

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You Can Find This Book In

Non-Fiction Engineering & Technology Mechanical Engineering & Materials Mechanical Engineering Other Technologies & Applied Sciences Applied Optics Technology in General Nanotechnology Materials Science Mechanics of Solids Engineering in General Energy Technology & Engineering

Electrical Engineering Electronics & Communications Engineering Electronics Engineering Electronic Devices & Materials Production & Industrial Engineering Industrial Chemistry & Manufacturing Technologies

Introduction	p. 1
Some remarks on microsystem systematic and development	p. 3
Deep three-dimensional silicon micromachining	p. 15
Bonding	p. 119
Classification of bonding and closing remarks	p. 319
Table of Contents provided by Blackwell. All Rights Reserved.

Springer Advanced Microelectronics

At a Glance

Hardcover

Industry Reviews

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How to return your order

Defective items

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