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Solid Mechanics and Its Applications

By: G.Q. Zhang, W.D. van Driel, X.J. Fan

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Hardcover | 23 June 2006

At a Glance

Hardcover
588 Pages

Dimensions(cm)
23.5 x 15.88 x 2.54

Hardcover

$329.00

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From a mechanical engineering point of view, Microelectronics and Microsystems are multi-scale in both geometric and time domains, multi-process, multi-functionality, multi-disciplinary, multi-material/interface, multi-damage and multi-failure mode. Their responses in manufacturing, assembling, qualification tests and application conditions are strongly nonlinear and stochastic. Mechanics of Microelectronics is extremely important and challenging, in terms of both industrial applications and academic research.

Written by the leading experts with both profound knowledge and rich practical experience in advanced mechanics and microelectronics industry, this book aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains essential and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.

Industry Reviews

From the reviews:

"This is an introductory treatise on the mechanism of microelectronics that has penetrated into every aspects of human life for the past half of a century. ... The treatise should be of interest to both the academia and industry, and it can be used as a 'basic source for teaching' in a graduate course. ... In sum, the authors have done a valuable service in presenting the title topic to researchers, engineers and students interested in the mechanics of microelectronics." (M. Cengiz Doekmeci, Zentralblatt MATH, Vol. 1105 (7), 2007)

"The editors of Mechanics of Microelectronics present this book, as their obligation, to graduate students in universities, researchers, engineers and managers in industries. ... The book chapters are written by the worldwide leading experts with both profound theoretical achievement and rich industrial experience ... . The book will be eagerly sought after by microelectronics and microsystems design engineers; process/product development engineers; reliability engineers; thermal, mechanical and multi-physics analysts; researchers, graduates and PhD students and their guides." (Current Engineering Practice, 2007)

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You Can Find This Book In

Non-Fiction Engineering & Technology Electronics & Communications Engineering Electronics Engineering Mechanical Engineering & Materials Mechanical Engineering Technology in General Engineering in General Materials Science Mechanics of Solids Computing & I.T.Computer Science

Artificial Intelligence

Microelectronics technology
Introduction
A heart of silicon In a little black box
Baseline CMOS Non-CMOS options
Packaging Systems
Conclusions
References
Nomenclature Reliability practices
Introduction
Reliability assessment
Reliability statistics
Acceleration factor models
Failure mechanisms
Conclusions
References
Exercises Thermal Management
Introduction
Heat transfer basics
Thermal design of assemblies
Thermal design for a SQFP
Heatsink design choices
Conclusions / final remarks
References
Introduction to Advanced Mechanics
Introduction
Stress and strain
Failure criteria
Fracture mechanics
Finite element method
References
Exercises Thermo-Mechanics of Integrated Circuits and Packages
Introduction
IC Backend and packaging processes and testing
Thermo-mechanics of IC backend processes
Thermo-Mechanics of packaging processes
Thermo-Mechanics of coupled IC backend and packaging processes
Case studies
References
Exercises Characterization and Modeling of Moisture Behavior
Introduction
Moisture diffusion modeling
Characterization of moisture diffusivity and saturation concentration
Vapor pressure modeling
Hygroscopic swelling characterization & modeling
Single void
Instability behavior
Subjected to vapor pressure and thermal stress
Interface strength characterization and modeling
Case studies
References
Exercises Characterization and Modeling of Solder Joint Reliability
Introduction
Analytical-empirical prognosis of the reliability
Thermo-mechanical characteristics of soft solders
Data evaluation and Life-time estimation
Case studies
References
Exercises Virtual thermo-mechanical prototyping
Introduction
The state-of-the-art of virtual prototyping
Case studies
Conclusions
References
Exercises Challenges and future perspectives
Introduction
Product and process inputs
Tests and experiments
Multi-scale mechanics
Advanced simulation tools
Multi-physics modeling
Material and interface behavior
Simulation-based optimization
Conclusions
References
Table of Contents provided by Publisher. All Rights Reserved.

Solid Mechanics and Its Applications

At a Glance

Hardcover

Industry Reviews

Shipping

How to return your order

Defective items

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