Solder Joint Technology

Materials, Properties, and Reliability

By: King-Ning Tu

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Hardcover | 22 August 2007

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388 Pages

Dimensions(cm)
24.13 x 16.51 x 2.54

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Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1^st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.

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You Can Find This Book In

Non-Fiction Engineering & Technology Industrial Chemistry & Manufacturing Technologies Metals Technology & Metallurgy Mechanical Engineering & Materials Materials Science Energy Technology & Engineering Electrical Engineering Other Technologies & Applied Sciences Applied Optics Production & Industrial Engineering Industrial Quality Control

Electronics & Communications Engineering Electronics Engineering Circuits & Components

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Published: 19th November 2010

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Introduction	p. 1
Copper-tin reactions in bulk samples	p. 37
Copper-tin reactions in thin-film samples	p. 73
Copper-tin reactions in flip chip solder joints	p. 111
Kinetic analysis of flux-driven ripening of copper-tin scallops	p. 127
Spontaneous tin whisker growth : mechanism and prevention	p. 153
Solder reactions on nickel, palladium, and	p. 183
Fundamentals of electromigration	p. 211
Electromigration in flip chip solder joints	p. 245
Polarity effect of electromigration on solder reactions	p. 289
Ductile-to-brittle transition of solder joints affected by copper-tin reaction and electromigration	p. 305
Thermomigration	p. 327
Diffusivity of vacancy mechanism of diffusion in solids	p. 347
Growth and ripening equations of precipitates	p. 351
Derivation of Huntington's electron wind force	p. 359
Table of Contents provided by Blackwell. All Rights Reserved.

Solder Joint Technology

Materials, Properties, and Reliability

At a Glance

Hardcover

Shipping

How to return your order

Defective items

You Can Find This Book In

Other Editions and Formats

Paperback

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