Single-Event Effects

Modeling, Prediction, Testing and Radiation Hardening

By: Ygor Aguiar (Editor), Corinna Martinella (Editor)

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Hardcover | 25 June 2026

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Hardcover
240 Pages

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24.41 x 16.99 x 2.06

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This Special Issue outlines the growing importance of SEE research as semiconductor technologies develop toward nanometer-scale nodes and the adoption of three-dimensional architectures. Soft errors caused by atmospheric neutrons and alpha particles extend SEE concerns beyond space applications to terrestrial systems, including high-performance computing, autonomous platforms, and safety-critical infrastructure. The ten contributions in this Special Issue address SEE challenges across multiple topics, including device-level modeling; reliability-aware EDA tools; circuit-level hardening-by-design strategies; and experimental characterization in advanced technologies, wide-bandgap devices, and programmable platforms. Several works also explore emerging data-driven approaches for reliability prediction. Collectively, these studies highlight the transition toward integrating radiation resilience directly into modern electronic design methodologies.

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