Signal Processing, Telecommunication & Embedded Systems: AI and ML Applications : Proceedings of Tenth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2025), Volume 3 - Hai Van Pham

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Signal Processing, Telecommunication & Embedded Systems: AI and ML Applications

Proceedings of Tenth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2025), Volume 3

By: Hai Van Pham (Editor), Zaid Omar (Editor), Xin-She Yang (Editor), Vikrant Bhateja (Editor)

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Hardcover | 30 April 2026

At a Glance

Hardcover
588 Pages

Dimensions(cm)
23.5 x 15.5 x 3.18

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$754.75

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This book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics, and telecommunication. It contains original research works presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2025), held in London, during October 2025. The book is divided into four volumes, and it covers papers written by scientists, research scholars, and practitioners from leading universities, engineering colleges, and R&D institutes from all over the world and shares the latest breakthroughs in and promising solutions to the most important issues facing today’s society.

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