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Sensor Technology & Devices

By: Ljubisa Ristic (Editor)

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Hardcover | 1 December 1994

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Hardcover
540 Pages

Dimensions(cm)
24.13 x 16.51 x 3.18

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?...A results-oriented book...Quality line drawings, lucid photography, and informative graphs are used generously in support of the text...The theoretical rigor of each chapter amply supports the real-world design examples that follow. Many chapters include practical solutions to problems that are commonly encountered in designing the device being discussed...the volume?s excellent graphics and text demystify many basic -- but complex -- concepts..?--Sensors Magazine

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Preface	p. xiii
Sensing the Real World
Introduction	p. 1
Sensor Classification	p. 2
Sensor Parameters	p. 3
A Seamless Sensor System	p. 4
Sensor Industry Growth	p. 6
Summary	p. 8
References	p. 11
Modeling and Simulation of Microsensors and Actuators
Introduction	p. 13
Modeling Equations	p. 14
The Basic Semiconductor Equations	p. 14
Boundary Conditions	p. 16
Simplification of the Problem	p. 17
Combination of Mechanical and Electrical Effects	p. 18
Discretization Procedures	p. 20
Accelerated Nonlinear Procedures	p. 21
Methods of Solution and Grid Generation	p. 22
Equation Discretization	p. 26
Error Checking	p. 29
Results and Discussion	p. 30
Hall Devices	p. 30
Magnetotransistor	p. 33
Micromachined Flow Sensor	p. 36
Dynamic Microstructures	p. 39
Summary	p. 43
References	p. 43
Bulk Micromachining Technology
Introduction	p. 49
Basic Concept of Bulk Micromachining	p. 50
Silicon as a Mechanical Material	p. 50
Wet Anisotropic Etching	p. 51
Anisotropic Etchants	p. 59
Etch-Stop Mechanisms	p. 69
CMOS Technology and Bulk Micromachining	p. 76
CMOS Processing	p. 76
Micromechanical Structures in CMOS Processing	p. 77
Applications of Bulk Micromachining	p. 82
Bulk Micromachined Accelerometer	p. 82
Thermal Infrared Sensor	p. 84
Inductors in CMOS Technology	p. 86
Summary	p. 89
References	p. 90
Surface Micromachining Technology
Introduction	p. 95
Basic Concept of Surface Micromachining Technology	p. 96
Layer Stacking	p. 96
Sealing	p. 98
Polysilicon for Surface Micromachining	p. 99
Deposition of Polysilicon	p. 100
As-Deposited Film Stress	p. 105
Annealing of Undoped Films	p. 107
In-Situ Doping	p. 108
Ex-Situ Doping	p. 115
Sacrificial Layers and Sacrificial Etching	p. 118
Stiction	p. 124
Mechanical Characterization of Polysilicon	p. 126
Test Structures for In-Situ Characterization	p. 126
Gradient of Residual Stress	p. 130
Load-Response Characterization	p. 133
Application of Surface Micromachining	p. 140
Surface Micromachined Accelerometer	p. 140
Electrostatically Driven Resonators	p. 143
Integration of Surface Micromachined Structures--Processing Issues	p. 144
LIGA Process	p. 146
Summary	p. 149
References	p. 150
Silicon Direct Wafer Bonding
Introduction	p. 157
Mechanism of Direct Wafer Bonding	p. 159
SiO[subscript 2]//SiO[subscript 2] Bonding	p. 160
Si//Si Bonding	p. 164
Processing Considerations	p. 168
Interface Integrity	p. 168
Bond Strength	p. 178
Shaping Bonded Wafers	p. 180
Microdefects in Bonded Wafers	p. 186
Application of Direct Wafer Bonding to Sensors and Actuators	p. 192
Threshold Pressure Switch	p. 192
Pressure Sensor	p. 195
Peristaltic Membrane Pump	p. 198
Summary	p. 199
References	p. 199
Packaging for Sensors
Introduction	p. 203
Basic Considerations for Sensor Packaging	p. 204
Wafer-Level Packaging	p. 207
Glass-Sealed Technique	p. 208
Anodic Bonding	p. 210
Assembly Techniques	p. 212
Die Bonding	p. 212
Wire Bonding	p. 217
Chip Coatings	p. 219
Package Types	p. 220
Packaging for Specific Applications	p. 227
Pressure Sensor Packaging	p. 227
Accelerometer Packaging	p. 235
Summary	p. 237
References	p. 237
Magnetic Field Sensors Based on Lateral Magnetotransistors
Introduction	p. 239
Lateral Magnetotransistors	p. 240
Combined Action of an Electric Field and a Magnetic Field	p. 241
Lateral Magnetotransistor in CMOS Technology	p. 242
Suppressed Sidewall Injection Magnetotransistor in CMOS Technology	p. 243
Suppressed Sidewall Injection Magnetotransistor in Bipolar Technology	p. 255
Offset in Magnetotransistors	p. 258
Noise in Magnetotransistors	p. 260
Surface Effects	p. 268
Multidimensional Sensing	p. 270
Lateral Magnetotransistor Sensitive to Magnetic Field Either Parallel or Perpendicular to the Chip Surface	p. 271
Two-Dimensional Sensing	p. 273
Three-Dimensional Sensing	p. 277
Summary	p. 282
References	p. 282
Thermal Sensors
Introduction	p. 287
Bipolar Devices as Temperature Sensors	p. 288
Diodes as Temperature Sensors	p. 289
Bipolar Transistors as Temperature Sensors	p. 290
Stability	p. 294
Integrated Temperature Sensors in Bipolar Technology	p. 294
Intrinsically Referenced Temperature Sensors	p. 300
Temperature Sensors in CMOS Technology	p. 302
Bipolar Transistors in CMOS Technology	p. 302
Integrated Temperature Sensors in CMOS Technology Based on Bipolar Transistors	p. 304
Temperature Sensors Based on MOS Transistors and Resistors	p. 307
Temperature Sensors with Digital Output	p. 309
Polysilicon Resistors	p. 311
Summary	p. 313
References	p. 313
Planar Silicon Photosensors
Introduction	p. 317
Planar Silicon Photodiodes	p. 320
Fundamentals of Photosensors	p. 322
Material Properties	p. 322
Quantum Efficiency	p. 326
Collection Efficiency Models	p. 327
Photocurrent	p. 330
Noise Current	p. 331
Response Time	p. 333
Level of Integration	p. 334
Summary	p. 337
References	p. 338
Charge Coupled Devices
Introduction	p. 341
Basic Concepts	p. 342
CCD Charge Storage Fundamentals	p. 342
CCD Architectures	p. 343
Three-Phase CCD Example	p. 344
Quantum Efficiency	p. 347
QE Model	p. 348
Quantum Yield and Photon Transfer Curve	p. 348
Backside Illumination and Thinning	p. 350
Details of Flashgate Theory	p. 352
Thinning Technology and Backside Performance	p. 357
Alternative Approaches for High QE	p. 358
Charge Collection Efficiency	p. 360
Charge Transfer Efficiency	p. 366
Read Noise	p. 369
Summary	p. 373
Acknowledgments	p. 374
References	p. 374
Sensors for the Automotive Industry	p. 377
Introduction	p. 384
Sensing Technology in Vehicle Systems	p. 384
Manifold Absolute Pressure	p. 386
Tire Pressure Sensor	p. 390
Position, Rotation, and Speed Sensing	p. 391
Flow	p. 399
Accelerometers	p. 401
Future Automotive Sensing	p. 407
High-Temperature Operation	p. 407
Liquid Level	p. 407
Chemical Sensing	p. 408
Oil Quality	p. 410
Capability to Compute Rather than Sense	p. 410
Vehicle Diagnostics	p. 412
RF Sensor Applications	p. 413
Future Sensor Requirements	p. 414
Summary	p. 417
References	p. 418
Signal Processing for Micromachined Sensors
Introduction	p. 421
Sensing Methods	p. 421
Piezoelectric Sensing	p. 422
Piezoresistive Sensing	p. 424
Capacitive Sensing	p. 428
Open- and Closed-Loop Systems	p. 433
Different Micromachined Structures--Mechanical Issues	p. 433
Open-Loop Capacitive Sensing	p. 438
Closed-Loop Capacitive Sensing	p. 440
Integration	p. 446
Integrated Pressure Sensor	p. 446
Integrated Accelerometer	p. 446
Dynamic Considerations	p. 448
Shock Considerations	p. 450
Self-Test Features	p. 452
Testing and Trimming	p. 453
Summary	p. 455
References	p. 455
Controlled Oscillators and Their Applicability to Sensors
Introduction	p. 457
Controlled Sinusoidal Oscillators	p. 458
The Oscillator Circuit and Its Control Characteristics	p. 458
Oscillator Amplitude and Frequency Transients	p. 461
Interaction of the Frequency and Amplitude Controls	p. 463
Sinusoidal Oscillators in Applications	p. 466
Controlled Multivibrators	p. 467
Multivibrators versus Sinusoidal Oscillators	p. 467
Multivibrators with Operational Amplifiers	p. 468
Switches in the Basic Multivibrator Circuits	p. 471
One-Amplifier Multivibrator	p. 476
Voltage-to-Frequency Converters	p. 479
Current-to-Frequency Converters	p. 484
Duty-Cycle Modulation	p. 504
Controlled Multivibrators in Applications	p. 507
Summary	p. 507
References	p. 508
About the Authors	p. 511
Index	p. 517
Table of Contents provided by Syndetics. All Rights Reserved.

Sensor Technology & Devices

At a Glance

Hardcover

Shipping

How to return your order

Defective items

You Can Find This Book In

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