Semiconductor Modeling:

For Simulating Signal, Power, and Electromagnetic Integrity

By: Roy G. Leventhal, Lynne Green, Darren J. Carpenter

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Hardcover | 29 November 2006

At a Glance

Hardcover
792 Pages

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23.5 x 16.51 x 3.18

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Semiconductor Modeling: For Simulating Signal, Power, and Electromagnetic Integrity assists engineers - both recent graduates and working product designers - in designing high-speed circuits. The authors apply circuit theory, circuit simulation tools, and practical experience to help the engineer understand semiconductor modeling as applied to high-speed digital designs. The emphasis is on semiconductor modeling, with PCB transmission line effects, equipment enclosure effects, and other modeling issues discussed as needed. The text addresses many practical considerations, including process variation, model accuracy, validation and verification, signal integrity, and design flow. Readers will benefit from its survey of modeling for semiconductors, packages, and interconnects, along with usable advice on how to get complex, high-speed prototypes to work on the first try.

Highlights include:

- Presents a very complete and well-balanced treatment of modeling of semiconductors, packages, and interconnects. Facilitates reader comprehension of the whole field of high-speed modeling, including digital and RF circuits.

- Combines practical modeling techniques with the latest EDA tools for simulation and successful high-speed digital design. Facilitates resolution of practical, every-day problems.

- Presents modeling from its historical roots to current state of the art. Facilitates keeping abreast of the latest modeling developments as they continue to unfold.

- Includes a CD-ROM with modeling software and additional model examples.

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You Can Find This Book In

Non-Fiction Engineering & Technology Electronics & Communications Engineering Electronics Engineering Electronic Devices & Materials Semi-Conductors & Super-Conductors Energy Technology & Engineering Electrical Engineering Circuits & Components Microwave Technology Computing & I.T.Graphical & Digital Media Applications

Computer-Aided Design CAD Technology in General Maths for Engineers Engineering in General Communications Engineering & Telecommunications

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Paperback

Published: 16th November 2014

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Preface	p. xv
Acknowledgments	p. xix
Introduction	p. 1
How the Workplace Supports Successful Design	p. 3
High-Speed Digital Design Is Challenging	p. 3
Needs for Technical Specialization	p. 6
The Role of Processes and Procedures	p. 7
Using Judgment When Making Design Tradeoffs	p. 8
HSDD Needs the Help of EDA Tools	p. 9
HSDD Needs a Team That Extends Beyond the Company	p. 9
HSDD Team Members Often Have Their Own Agendas	p. 10
HSDD Simulations Performed in the Workplace	p. 11
Modeling and Simulation Versus Prototype and Debug	p. 12
Ten Tips for Modeling and Simulation	p. 13
Summary	p. 13
Introduction to Modeling Concepts	p. 15
Modeling and Simulation for All Scales of System Size	p. 15
Communicating Across Specialties	p. 15
What Is a Model?	p. 16
What Is a System?	p. 18
Needs for Model Accuracy Change as a Design Progresses	p. 20
There Are Many Kinds of Models and Simulations	p. 22
Modeling and Simulation for Systems	p. 23
Bottom-Up and Top-Down Design	p. 24
Analog Issues in Digital Design	p. 27
Noise Modeling on Electrical Signals	p. 34
Additional Design Issues to Model and Simulate	p. 36
Using EDA Tools for Semiconductors	p. 41
Using EDA Tools for Board Interconnections	p. 43
Looking Ahead in the Book	p. 45
Summary	p. 45
Generating Models	p. 47
Model Properties Derived from Device Physics Theory	p. 49
Introduction	p. 49
Why Deep Sub-Micron Technology Is Complex	p. 50
Models Extracted from Semiconductor Design Theory	p. 52
Example of the BJT Process	p. 53
How BJT and FET Construction Affect Their Operation	p. 54
Calculating Device Physics Properties	p. 65
Examples of Computing Electrical Properties from Structure	p. 71
Examples of SPICE Models and Parameters	p. 75
Modeling Packaging Interconnections	p. 90
Summary	p. 93
Measuring Model Properties in the Laboratory	p. 95
Introduction to Model Measurements	p. 95
Matrix Models	p. 97
Scattering-Parameter Models	p. 103
SPICE Models	p. 106
IBIS Models	p. 114
Web Sites for IBIS Visual Editors and Other Tools	p. 126
TDR/TDT - VNA Measurements	p. 126
RLGC Matrixes	p. 127
Field Solver RLGC Extraction for ICs	p. 130
What is Model Synthesis?	p. 130
Test Equipment Providers	p. 130
Software for Test Equipment Control	p. 131
Summary	p. 132
Using Statistical Data to Characterize Component Populations	p. 133
Why Process Variation Is Important	p. 133
Achieving Process Control with Population Statistics	p. 133
Basics of Population Statistics	p. 134
Characterization for Six-Sigma Quality	p. 144
Six-Sigma Quality for Modeling and Design	p. 149
Summary	p. 150
Selecting Components and Their Models	p. 151
Using Selection Guides to Compare and Contrast Components	p. 153
Tools for Making Component Choices	p. 153
Team Members Use of Selection Guides	p. 155
Selection Guide Examples	p. 156
Selection Guides Help Component Standardization	p. 161
Simulation as a Selection Guide	p. 161
Right-Thinking	p. 166
Summary	p. 167
Using Data Sheets to Compare and Contrast Components	p. 169
Data Sheets as Product Descriptions	p. 169
Are Data Sheets Accurate and Complete?	p. 173
Selecting a Component That Is Fit for Use	p. 175
Using Data Sheets to Begin the Selection Process	p. 176
Construction Characteristics of Amplifiers and Switches	p. 178
Using Beta to Explain Device Tradeoffs	p. 179
Comparing Five BJTs to Illustrate Making a Selection	p. 182
Process for Making Tradeoffs	p. 195
Additional Choices for Picking a Component	p. 197
Thoughts About the Physical Design Examples	p. 197
Summary	p. 198
Selecting the Best Model for a Simulation	p. 199
From Component Choice to Model Choice	p. 199
Questions That Modeling and Simulation Can Answer	p. 200
Types of Models	p. 201
Using Symbols and Schematics to Represent Models	p. 202
Major Types of Models	p. 205
Compare Models by Simulation Performance	p. 211
Additional Model Comparisons	p. 221
Recommendations for Modeling	p. 223
Converting a Model to Another Type of Model	p. 227
Transform Models for Systems	p. 234
Summary	p. 241
Modeling and Simulation in the Design Process Flow	p. 243
Simulation in the Design Process	p. 243
A Typical Design Flow	p. 244
Strategy of Modeling and Simulation in Design	p. 248
Acquiring IBIS Models: An Overview	p. 249
Summary	p. 257
About the IBIS Model	p. 259
Key Concepts of the IBIS Specification	p. 261
Introduction	p. 261
IBIS Specification	p. 264
Sample IBIS Data File	p. 283
Parsing and Checking IBIS Data Files	p. 294
Schematic of a Basic IBIS Model	p. 297
How IBIS Circuit Modeling Methodology Is Used	p. 301
IBIS Test Circuits	p. 309
ISO 9000 Process Documentation for IBIS Models	p. 310
Summary	p. 314
Using IBIS Models in What-If Simulations	p. 315
A New Method of Design and Development	p. 315
Virtual Experiments	p. 316
Virtual Experiment Techniques	p. 316
Propagation Delay in High-Speed Nets	p. 317
Why We Use the IBIS Model	p. 318
Data Used in Experiments	p. 320
Experiment 1: Output Drive Capabity Versus Load	p. 322
Experiment 2: C_comp Loading	p. 327
All-Important Zo: Algorithms and Field Solvers	p. 332
Experiment 3: Edge Rate of a Driver and Reflections	p. 333
Experiment 4: Using V-T Data Versus a Ramp	p. 336
Experiment 5: Parasitics and Packaging Effects	p. 346
Experiment 6: Environmental and Population Variables	p. 349
Other Considerations: Timing and Noise Margin Issues	p. 352
Experiment 7: Vol from Simulation Versus Data Sheet	p. 356
How IBIS Handles Simulator Issues	p. 358
Summary	p. 359
Fixing Errors and Omissions in IBIS Models	p. 361
IBIS Model Validation Steps	p. 361
Process and Product Improvement Steps	p. 362
Step 1: Detect and Acknowledge the Quality Problem	p. 363
Step 2: Diagnose the Problem's Root Cause	p. 364
Step 3: Design a Fix Based on Root Cause	p. 366
Step 4: Verify the Fix	p. 370
Step 5: Archive Corrected Models	p. 372
Beyond Parsers and Checklists: Simulations and Reality Checking	p. 372
Tools Provided by the IBIS Committee	p. 374
IBIS Common Errors Checklist and Correction Procedures	p. 382
3Com's ISO 9000 Process for IBIS Models	p. 386
IBIS Model Acceptance and Legitimacy	p. 391
Summary	p. 394
Using EDA Tools to Create and Validate IBIS Models from SPICE	p. 395
Introduction	p. 395
I/O Buffer Example	p. 396
SPICE-to-IBIS Conversion Methodology	p. 399
Modeling Passive Interconnections in IBIS	p. 414
IBIS Model Validation	p. 415
Summary	p. 422
Managing Models	p. 425
Sources of IBIS Models	p. 427
Model Needs Change as a Product is Developed	p. 427
List of IBIS Model Sources	p. 428
Using Default Models to Get Started	p. 430
Using the Company's Model Library	p. 430
Using the EDA Tool Provider's Model Library	p. 430
Searching the Web for the Supplier's Model	p. 431
Requesting Models Directly from the Supplier	p. 434
Purchasing a Commercial Third-Party Model Library	p. 436
Using Models Adapted from Other Models	p. 437
Review	p. 440
Purchasing Custom Models from a Third-Party	p. 441
Converting SPICE Models to IBIS Models	p. 441
Using a Supplier's Preliminary Models	p. 441
Asking SI-List and IBIS E-mail Reflectors for Help	p. 450
Modeling Tools on the IBIS Website	p. 451
Summary	p. 452
Working with the Model Library	p. 453
The Best Way to Manage Models	p. 453
Component Standardization and Library Management	p. 458
Storing and Retrieving Model Files	p. 470
Assigning Models to Components in EDA Simulators	p. 473
Flexibility in Model Choices at Run Time	p. 476
Summary	p. 476
Model Accuracy and Verification	p. 477
Methodology for Verifying Models	p. 479
Overview of Model Verification	p. 479
Model Verification Methodology	p. 481
Verifying SPICE Models	p. 489
Verifying PDS Models	p. 497
Verifying IBIS Models	p. 503
Verifying Other Model Types	p. 508
Summary	p. 510
Verifying Model Accuracy by Using Laboratory Measurements	p. 511
Introduction	p. 511
Instrumentation Loading as a Source of Errors	p. 512
Other Test Setup Errors	p. 517
Signal Noise as a Source of Errors	p. 519
Measurement Definitions and Terms as a Source of Errors	p. 520
Two Ways to Correlate Models with Measurements	p. 522
Involving Production in Verification	p. 523
An EMI/EMC Example	p. 523
Correlating Unit-by-Unit Model Measurements	p. 524
Statistical Envelope Correlation	p. 525
Signal Integrity and Correlation	p. 526
Waveform Correlation	p. 527
Computational Electromagnetics and the Feature Selective Validation Method	p. 530
IBIS Golden Waveforms	p. 534
How Unexpected Errors Led to an Advance in Modeling	p. 535
Recommended Verification Strategy	p. 541
Summary	p. 544
Balancing Accuracy Against Practicality When Correlating Simulation Results	p. 545
Establishing Absolute Accuracy Is Difficult	p. 545
Is a Model Accurate Enough to Be Usable?	p. 547
Model Accuracy Definitions	p. 547
Confidence Limits in Measurements and Simulations	p. 548
How Much to Guard-Band Design Simulation?	p. 549
Differences in Accuracy, Dispersion, and Precision for Simulation and Measurement	p. 550
Model Limitations	p. 551
Standardizafion and the Compact Model Council	p. 551
Summary	p. 554
Deriving an Equation-Based Model from a Macromodel	p. 555
A "New" RF Design Challenge	p. 555
Background	p. 555
Applying the RF Example to High-Speed Digital Circuits	p. 556
Predicted and Measured Results	p. 558
Reverse Isolation Analyzed	p. 559
Optimizing Single-Stage Reverse Isolation	p. 566
Combining Stages for Power Isolation	p. 567
Calculations Versus Measurements	p. 569
Construction and Test Techniques	p. 569
Summary	p. 570
Future Directions in Modeling	p. 571
The Challenge to IBIS	p. 573
Emerging Simulation Requirements	p. 573
The Leading Contenders to Change IBIS	p. 576
Models in the Context of Simplification	p. 577
Physical Modeling	p. 578
Behavioral Modeling	p. 580
Developing a Macromodel from the Behavioral Model	p. 588
Developing a SPICE Macromodel from a Physical Model	p. 592
Limitations in Models Due to Simplification	p. 608
AMS Modeling Simplified	p. 610
Limitations Because of Parameter Variation	p. 618
Limitations of Deterministic Modeling and Design	p. 621
Summary	p. 629
Feedback to the Model Provider Improves Model Accuracy	p. 631
Continuing Need for Better Models	p. 631
How Far We Have Come	p. 632
Four-Step Universal Process for Improvement	p. 633
Specs That Swim Upstream: A New Approach	p. 633
Warnings About Doing What-If Model Simulations	p. 634
Selling the Idea of Better Models and Simulation	p. 635
Summary	p. 640
Future Trends in Modeling	p. 641
Bridges to the Future	p. 641
Challenge of HSDD	p. 642
How Design Methods Have Changed	p. 644
Attitudes in EMI/EMC about Modeling and Simulation	p. 645
High-Speed Design Is Becoming More Challenging	p. 646
Advantages of SPICE, S-Parameters, and IBIS	p. 648
Combining Models and EDA Tools to Design High-Speed Serial Busses	p. 654
IBIS: Past, Present, and Future Specification Additions	p. 655
Advantages of Pre-Layout Simulation for EMI/EMC	p. 659
Interconnection Design Applied to EMI/EMC	p. 660
Modeling for Power Integrity and EMI/EMC	p. 661
Computational Electromagnetics	p. 671
EDA Tool Supplier Survey	p. 676
Risk Management and the Limitations of Simulation	p. 681
Summary	p. 681
Using Probability: The Ultimate Future of Simulation	p. 683
Introduction	p. 683
Limitations of Deterministic Modeling and Design	p. 685
A New Approach: Probabilistic Modeling	p. 687
Complexity of the EMI Chain of Cause and Effect	p. 688
Risk Management Mathematics	p. 689
Identical Equipments Case	p. 692
Non-Identical Equipments Case	p. 693
Risk Assessment	p. 693
Distribution Examples	p. 694
Review of Probability Distributions	p. 701
Follow Up Simulation with Product Assurance	p. 702
Summary	p. 703
Glossary, Bibliography, Index, and CD-ROM	p. 705
Glossary	p. 707
Bibliography	p. 733
Index	p. 745
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Semiconductor Modeling:

For Simulating Signal, Power, and Electromagnetic Integrity

At a Glance

Hardcover

Shipping

How to return your order

Defective items

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