Semiconductor Memories

Chapter 1: Introduction.

Chapter 2: Random Access Memory Technologies.

2.1 Introduction.

2.2 Static Random Access Memories (SRAMs).

2.3 Dynamic Random Access Memories (DRAMs).

Chapter 3: Nonvolatile Memories.

3.1 Introduction.

3.2 Masked Read-Only Memories (ROMs).

3.3 Programmable Read-Only Memories (PROMs).

3.4 Erasable (UV)-Programmable Read-Only Memories (EPROMs).

3.5 Electrically Erasable PROMs (EEPROMs).

3.6 Flash Memories (EPROMs or EEPROMs).

Chapter 4: Memory Fault Modeling and Testing.

4.1 Introduction . . . .

4.2 RAM Fault Modeling.

4.3 RAM Electrical Testing.

4.4 RAM Pseudorandom Testing.

4.5 Megabit DRAM Testing.

4.6 Nonvolatile Memory Modeling and Testing.

4.7 IDDQ Fault Modeling and Testing.

4.8 Application Specific Memory Testing.

Chapter 5: Memory Design for Testability and Fault Tolerance.

5.1 General Design for Testability Techniques.

5.2 RAM Built-in Self-Test (BIST).

5.3 Embedded Memory DFT and BIST Techniques.

5.4 Advanced BIST and Built-in Self-Repair Architectures.

5.5 DFT and BIST for ROMs.

5.6 Memory Error-Detection and Correction Techniques.

5.7 Memory Fault-Tolerance Designs.

Chapter 6: Semiconductor Memory Reliability.

6.1 General Reliability Issues.

6.2 RAM Failure Modes and Mechanisms.

6.3 Nonvolatile Memory Reliability.

6.4 Reliability Modeling and Failure Rate Prediction.

6.5 Design for Reliability.

6.6 Reliability Test Structures.

6.7 Reliability Screening and Qualification.

Chapter 7: Semiconductor Memory Radiation Effects.

7.1 Introduction.

7.2 Radiation Effects.

7.3 Radiation-Hardening Techniques.

7.4 Radiation Hardness Assurance and Testing.

Chapter 8: Advanced Memory Technologies.

8.1 Introduction.

8.2 Ferroelectric Random Access Memories (FRAMs).

8.3 Gallium Arsenide (GaAs) FRAMs.

8.4 Analog Memories.

8.5 Magnetoresistive Random Access Memories (MRAMs).

8.6 Experimental Memory Devices.

Chapter 9: High-Density Memory Packaging Technologies.

9.1 Introduction.

9.2 Memory Hybrids and MCMs (2-D).

9.3 Memory Stacks and MCMs (3-D).

9.4 Memory MCM Testing and Reliability Issues.

9.5 Memory Cards.

9.6 High-Density Memory Packaging Future Directions.

Index.