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Results for author 'Ibrahim M. Elfadel'

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3D Stacked Chips : From Emerging Processes to Heterogeneous Systems - Ibrahim (Abe) M. Elfadel

3D Stacked Chips

From Emerging Processes to Heterogeneous Systems

Ibrahim (Abe) M. Elfadel and Gerhard Fettweis

Hardcover

$84.99

The IoT Physical Layer : Design and Implementation - Ibrahim (Abe) M. Elfadel

The IoT Physical Layer

Design and Implementation

Ibrahim (Abe) M. Elfadel and Mohammed Ismail

Hardcover

$169.75

VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence : 31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023, Sharjah, United Arab Emirates, October 16â"18, 2023, Revised Extended Selected Papers - Ibrahim M. Elfadel

VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence

31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023, Sharjah, United Arab Emirates, October 16â"18, 2023, Revised Extended Selected Papers

Ibrahim M. Elfadel and Lutfi Albasha

Hardcover

$139.75

Tapered Beams in MEMS : A Symbolic Modeling Framework with Applications to Energy Harvesting - Ibrahim M. Elfadel

Tapered Beams in MEMS

A Symbolic Modeling Framework with Applications to Energy Harvesting

Ibrahim M. Elfadel and Wajih U. Syed

Hardcover

$139.75

3D Stacked Chips : From Emerging Processes to Heterogeneous Systems - Gerhard Fettweis

3D Stacked Chips

From Emerging Processes to Heterogeneous Systems

Gerhard Fettweis and Ibrahim M. Elfadel

Paperback

$84.99

Secure, Low-Power IoT Communication Using Edge-Coded Signaling - Ibrahim M. Elfadel

Secure, Low-Power IoT Communication Using Edge-Coded Signaling

Ibrahim M. Elfadel and Shahzad Muzaffar

Paperback

$139.00

Machine Learning in VLSI Computer-Aided Design - Ibrahim (Abe) M. Elfadel

Machine Learning in VLSI Computer-Aided Design

Ibrahim (Abe) M. Elfadel, Duane S. Boning and Xin Li

Hardcover

$279.00

7 Results