| Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies | p. 1 |
| Wavelength and Frequency | p. 3 |
| Lumped Elements | p. 3 |
| Transmission Lines | p. 5 |
| Dispersion | p. 8 |
| Dispersion Effects in High Speed Systems | p. 10 |
| Transmission Line Distributed Effects | p. 12 |
| Transmission Line Coupling and Cross Talk | p. 13 |
| Package Fabrication Methods | p. 15 |
| Co-fired Ceramics | p. 15 |
| Thick Film and Thin Film Ceramics | p. 18 |
| Organic Substrates | p. 19 |
| Interconnects | p. 20 |
| Conclusions | p. 22 |
| References | p. 23 |
| Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages | p. 25 |
| Introduction | p. 25 |
| MicroCoax Approach | p. 26 |
| Packaging Approaches | p. 29 |
| Limitations to the Approach | p. 32 |
| MicroCoax/Leadframe Approach | p. 32 |
| Package I/O Structure Considerations | p. 33 |
| Modelling the Signal Path | p. 34 |
| Performance | p. 38 |
| Conclusion | p. 42 |
| Polymeric Microelectromechanical Millimeter Wave Systems | p. 43 |
| Introduction | p. 43 |
| Polymeric Millimeter Wave Systems using Micromachining Technologies | p. 44 |
| Fabrication Examples of mm-Wave Components | p. 48 |
| Polymeric Waveguides | p. 48 |
| Waveguide-Based Iris Filters | p. 49 |
| Waveguide-Based Tunable Filters and Phase Shifters | p. 51 |
| Waveguide-Fed Horn Antennas | p. 55 |
| W-Band Waveguide Feeding Network of a 2x2 Horn Antenna Array | p. 57 |
| Fundamenial Characterizations of Polymer Metallization Process | p. 59 |
| Surface Roughness | p. 59 |
| Characterization of In-channel Electroplating Thickness | p. 61 |
| Geometry Effects | p. 62 |
| Conclusion | p. 65 |
| References | p. 65 |
| Millimeter-Wave Chip-on-Board Integration and Packaging | p. 69 |
| Motivation for a Chip-on-Board Approach for Millimeter-Wave Product Manufacturing | p. 69 |
| The Drive for Low Cost | p. 69 |
| Low-Cost Manufacturing Processes | p. 70 |
| Problems Specific to Millimeter-Wave Electronics | p. 73 |
| A Chip-on-Board Solution | p. 80 |
| The Surface-Mount Panel | p. 81 |
| Attaching the Bare Chips | p. 83 |
| Wire Bond Interconnects | p. 83 |
| Eliminating Wire Bonds in the RF Path | p. 84 |
| Cover Lamination | p. 85 |
| Segregation | p. 87 |
| Testing | p. 87 |
| Application Examples | p. 87 |
| A 60-GHz Transceiver | p. 88 |
| Miniaturized 60-GHz Transmitter and Receiver Modules | p. 89 |
| 76-Glh Automotive Radar Module Package | p. 89 |
| Summary | p. 90 |
| References | p. 90 |
| Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules | p. 91 |
| Introduction | p. 91 |
| Design and Fabrication of the Thin-Film LCP Package | p. 93 |
| Lid Construction and Lamination | p. 97 |
| Results and Model of Lowpass Feedthrough | p. 98 |
| Hermeticity and Leak Rate Measurement | p. 101 |
| Reliability of LCP Surface Mount Packages | p. 102 |
| Non-operating Temperature Step Stressing | p. 103 |
| Non-operating Thermal Shock Testing | p. 103 |
| Operating Humidity Exposure Testing | p. 105 |
| Reliability Testing Summary | p. 106 |
| Bandpass Feedthrough | p. 106 |
| Bandpass Feedthrough Design and Fabrication | p. 106 |
| Bandpass Feedthrough Results and Discussion | p. 109 |
| Conclusion | p. 111 |
| References | p. 112 |
| RF/Micrownve Substrate Packaging Roadmap for Portable Devices | p. 115 |
| Introduction | p. 115 |
| Substrate Materials for Portable Products | p. 116 |
| RF Substrate Materials Thermal and Electrical Properties | p. 116 |
| Standard FR-4 | p. 116 |
| High TG FR-4 | p. 117 |
| Polyimide | p. 118 |
| Cyanate Ester Blend (BT- Bismaleamiden Triazine) | p. 118 |
| PTFE Based Laminates | p. 119 |
| PTFE Resin Coated on Conventional Glass | p. 119 |
| PTFE Film Impregnated with Cyanate Ester or Epoxy Resin | p. 119 |
| PTFE Mixed with Low Dk Ceramic | p. 119 |
| Materials Summary | p. 120 |
| Substrate Critical Properties | p. 120 |
| Dielectric Constant (Dk) | p. 120 |
| Dissipation Factor/Dielectric Loss: (tan ¿) | p. 121 |
| Glass Transition Temperature (Tg) | p. 121 |
| Glass Decomposition Temperature; Td | p. 121 |
| Moisture Absorption | p. 122 |
| Coefficient of Thermal Expansion | p. 122 |
| Materials Summary | p. 122 |
| Portable Products Technology Roadmap | p. 122 |
| Summary | p. 126 |
| Summary | p. 128 |
| References | p. 128 |
| Ceramic Systems in Package for RF and Microwave | p. 129 |
| Introduction | p. 129 |
| Rf-Platform | p. 129 |
| LTCC for Systems in Package | p. 130 |
| Design of Ceramic Packages | p. 131 |
| Why Multi-Project Wafers Made of LTCC? | p. 131 |
| Hermetic Capping of MEMS with Ceramic Lids | p. 132 |
| LTCC Packages for Advanced RF and Microwave Applications | p. 133 |
| Three Examples | p. 135 |
| 4 by 4 Patch Antenna Array for Operation at 35 GHz | p. 135 |
| LTCC for 77-81 GHz Automotive Radar Systems-in-Package | p. 142 |
| 24 GHz Switched Beam Steering Array Antenna Based on RF MEMS Switch Matrix | p. 145 |
| RF-MEMS for Radar and Telecom Applications | p. 155 |
| Research Activities and Trends on RF-MEMS Switches | p. 156 |
| References | p. 163 |
| Low-Temperature Cofired-Ceramic Laminate Waveguides for mm Wave Applications | p. 165 |
| Introduction | p. 165 |
| The Laminated Waveguide | p. 166 |
| Transitions to a LWG | p. 167 |
| Rectangular Waveguide Theory | p. 169 |
| LTCC Process | p. 174 |
| Insertion Loss in an LTCC Laminated Waveguides | p. 174 |
| U-band | p. 177 |
| V-band | p. 178 |
| E-band | p. 178 |
| W-band | p. 178 |
| F-band | p. 184 |
| LWG-to-LWG Coupling | p. 184 |
| LWG vs. Stripline | p. 184 |
| Summary | p. 187 |
| References | p. 188 |
| LTCC Substrates for RF/MW Application | p. 189 |
| Introduction | p. 189 |
| LTCC Fabrication Process | p. 192 |
| Current Status and Trend | p. 197 |
| References | p. 203 |
| High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging | p. 207 |
| Introduction | p. 208 |
| Ceramics and Carbon Based Materials | p. 210 |
| Common Packaging Ceramics | p. 210 |
| LTCC | p. 210 |
| High Performance Packaging Ceramics (BeO AIN) | p. 215 |
| Direct Bond Copper (DBC) Packaging | p. 218 |
| RF/MW Brazed Packages | p. 220 |
| Thin-Film Packaging | p. 221 |
| Thick-Film Packaging | p. 221 |
| Carbon Nanotubes (CNT) | p. 223 |
| Composites | p. 223 |
| Metal Matrix Composites | p. 223 |
| Cu/cBN Composites | p. 227 |
| Cu/SiC Composites | p. 228 |
| Al/Diamond Composites | p. 228 |
| Conclusions | p. 231 |
| References | p. 231 |
| High Performance Microelectronics Packaging Heat Sink Materials | p. 233 |
| Introduction | p. 233 |
| Refractory Metal Based Microelectronics Packaging Materials | p. 236 |
| Development, Manufacturing and Application of Copper Tungsten | p. 236 |
| Development, Manufacturing and Application of Copper Molybdenum (MoCu) | p. 241 |
| Development, Manufacturing and Application of Copper-Molybdenum-Copper Laminates and Copper-Copper/Molybdenum-Copper Laminates | p. 244 |
| Aluminum Based Heat Sink Materials | p. 248 |
| AlSiC Heat Sink Materials | p. 248 |
| New Development for Microelectronics Packaging Heat Sink Materials | p. 258 |
| References | p. 261 |
| Technology Research on AIN 3D MCM | p. 267 |
| Introduction | p. 267 |
| Experiment | p. 269 |
| Co-fired Spacer Rod and 2D MCM Substrate | p. 269 |
| Vertical Interconnected by BGA Solder Ball | p. 269 |
| A1N 3D MCM Package | p. 269 |
| Technological Method | p. 270 |
| Result and Discussion | p. 270 |
| General Technological Scheme | p. 270 |
| Layout and Interconnect Design | p. 271 |
| Matching Optimization Research on W paste and A1N Ceramics | p. 272 |
| Technological Improvement Experiment of AIN 2D MCM Substrate | p. 273 |
| The Making of Spacer Rod | p. 274 |
| Package Technology | p. 276 |
| Vertical Interconnected Technology Research | p. 276 |
| Result of Experiment | p. 278 |
| Conclusion | p. 278 |
| References | p. 278 |
| Index | p. 281 |
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