Practical MMIC Design

By: Steve Marsh

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Hardcover | 13 March 2026

At a Glance

Hardcover
376 Pages

Edition Type
Unabridged

Dimensions(cm)
22.86 x 15.24 x 2.24

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$359.75

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Fabricating monolithic microwave integrated circuits (MMICs) can be high cost and high risk. Design is key to ensuring correct fabrication, minimizing costs, and reducing refabrication. This practical volume is filled with hands-on design techniques and rules of thumb that practitioners can use everyday to fabricate MMICs to system specifications. More than 100 photos of real MMIC designs show how these design techniques have been successfully implemented in the field.

Practical MMIC Design offers practitioners:

In-depth information on designing amplifiers, power amplifiers, and millimeter-wave circuits;
Guidance on selecting the right type of foundry and technology-Si/GaAs or HEMT/HBT-for specific design;
Real-world insight into component modeling, circuit simulation and layout, and processing and testing;
A unique look into day-to-day foundry practices and the economics associated with fabricating MMICs.

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You Can Find This Book In

Non-Fiction Engineering & Technology Electronics & Communications Engineering Electronics Engineering Microwave Technology Circuits & Components Communications Engineering & Telecommunications Technology in General Engineering in General Industrial Chemistry & Manufacturing Technologies

Foreword	p. xiii
Preface	p. xv
Introduction	p. 1
Introduction to MMICs	p. 2
The History of MMICs	p. 3
The MMIC Advantage	p. 6
Basic Design Process	p. 7
References	p. 8
Component Technology and Foundry Choice	p. 11
Active Components	p. 12
Substrate Material	p. 12
Transistor Type	p. 14
Transistor Response Versus Frequency	p. 30
Passive Components	p. 31
Diodes	p. 31
Transmission Lines	p. 31
Resistors	p. 42
Capacitors	p. 44
Inductors	p. 46
Metal Layer Interconnects	p. 49
Bond-pads	p. 49
Substrate Vias	p. 50
Questions	p. 50
References	p. 52
Foundry Use and Economics	p. 57
Using a Foundry	p. 57
Agreements and Discussions	p. 57
Delivery of Design Data	p. 59
Circuit Design	p. 59
Design Review	p. 60
Wafer Fabrication	p. 60
Test and Delivery	p. 61
Economics	p. 61
MMIC Production Costs	p. 61
Defect Densities	p. 62
References	p. 64
Simulation and Component Models	p. 65
Simulation	p. 66
The s-parameters	p. 66
Component Characterization	p. 69
Model Development	p. 71
Linear Simulation	p. 74
Nonlinear Simulation	p. 74
2D, 2.5D, and 3D Electromagnetic Simulation	p. 75
Passive Component Models	p. 76
Capacitors	p. 76
Inductors	p. 77
Resistors	p. 78
Vias	p. 79
Transmission-Line Discontinuities	p. 79
Active Component Models	p. 82
FET Model	p. 83
HBT Model	p. 84
Questions	p. 84
References	p. 85
Design	p. 89
Impedance Matching and the Smith Chart	p. 90
Matching	p. 90
Smith Chart	p. 92
Converting Impedance to Reflection Coefficient	p. 95
Converting Impedance to Admittance	p. 96
Deriving the Conjugate Impedance	p. 96
Transforming a Load Impedance Along a Lossless Transmission Line	p. 97
Addition of Series Reactive and Shunt Susceptance Lumped Elements	p. 99
T and Pi Matching Circuits	p. 103
Curves of Constant Q-factor	p. 104
Circles of Constant Performance	p. 105
Passive Elements	p. 108
Open Circuit and Short Circuit Stubs	p. 108
Radial Stubs	p. 109
Couplers, Splitters, and Combiners	p. 110
Baluns	p. 122
Filters	p. 123
Antennas	p. 124
Amplifiers	p. 125
Initial Considerations	p. 126
Small-Signal Amplifiers	p. 132
Power Amplifiers	p. 147
Oscillators	p. 188
Oscillation Principles	p. 189
Mixers	p. 194
MMIC Mixers	p. 196
Switches	p. 207
Phase Shifters	p. 210
Reflective Phase Shifters	p. 210
Loaded-Line Phase Shifters	p. 211
Switched-Delay-Line Phase Shifters	p. 211
Switched-Filter Phase Shifters	p. 211
Switched-Path Attenuators	p. 213
Circuits with Digital Application	p. 214
Prescalers	p. 214
Logarithmic Amplifiers	p. 215
Darlington Pair Amplifiers	p. 216
Millimeter-Wave Circuits	p. 216
High-Frequency Effects	p. 217
Component Choice	p. 221
Simulation Issues	p. 228
Yield Improvement	p. 231
What Is the MMIC Yield?	p. 232
Yield-Improvement Techniques	p. 234
Questions	p. 246
References	p. 250
Layout	p. 261
Layout Files	p. 262
Circuit Layout Process	p. 264
Layout Checking	p. 267
Layout Design Rules	p. 267
Design Rule Checking	p. 269
Electrical Rule Checking	p. 270
Layout Versus Schematic	p. 270
Reverse Engineering	p. 270
Visual Checking	p. 270
Chip Arraying	p. 270
Chip Identifiers	p. 271
Arraying Guidelines	p. 273
Mask Manufacture	p. 274
Layout Examples	p. 274
Questions	p. 277
References	p. 277
Processing Technology	p. 279
Substrate Material Growth	p. 280
Wafer Production	p. 283
Surface Layers	p. 283
Photolithography	p. 285
Typical MMIC Photolithographic Steps	p. 288
Device Isolation	p. 290
Ohmic Contacts	p. 291
Gate Contacts	p. 293
First Interconnect Metal	p. 296
High-Dielectric-Constant Layer	p. 296
Resistive Metal	p. 298
Low-Dielectric-Constant Layer	p. 298
Second Interconnect Metal	p. 299
Dielectric Encapsulation and Saw/Scribe Lane Definition	p. 301
Wafer Thinning	p. 302
Through-Substrate Vias	p. 304
Back-Face Metal	p. 305
Chip Separation	p. 306
Quality Assurance	p. 306
Questions	p. 308
References	p. 309
Test	p. 313
Process Control and Monitoring (PCM)	p. 313
The dc Test and Stability Problems	p. 314
RF Testing and Calibration	p. 315
Questions	p. 319
References	p. 320
Answers to Questions	p. 323
	p. 323
	p. 324
	p. 324
	p. 328
	p. 329
	p. 330
Glossary	p. 331
About the Author	p. 341
Index	p. 343
Table of Contents provided by Ingram. All Rights Reserved.

Practical MMIC Design

At a Glance

Hardcover

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How to return your order

Defective items

You Can Find This Book In

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