Optics and Optoelectronics

1 Introduction, 1.1 A brief history of the moir© method, References, CHAPTER 2: STRAIN MEASUREMENTS AT THE LIMITâ"THE MOIR MICROSCOPE, 2.1 Nonlinear analysis of interferometric moir© fringes, 2.1.1 Example fringe data reduction, References, 2.2 Microscopic moir© interferometry, 2.2.1 Immersion interferometer, 2.2.1.1 Optical configuration, 2.2.1.2 Four-beam immersion interferometer, 2.2.2 Mechanical configuration, 2.2.3 Fringe shifting and O/DFM method, References, 2.3 Localized thermal strains in electronic interconnections by microscopic moir© interferometry, 2.3.1 Specimen preparation, 2.3.2 Thin small outline package, 2.3.3 Leadless chip carrier, 2.3.4 Effect of underfill encapsulation on flip chip solder bump, 2.3.5 Plated through hole, References, 2.4 Titanium in elastic tension: micromechanical deformation, 2.4.1 Introduction, 2.4.2 Specimen and loading fixture, 2.4.3 Experimental procedure and fringe patterns, 2.4.4 Anomalous strains along the grain boundaries, 2.4.5 Discussion, References, 2.5 Micromechanical thermal deformation of unidirectional boron/aluminum composite, 2.5.1 Experimental procedure and fringe patterns, 2.5.2 Analysis and results, 2.5.3 Discussion, References, CHAPTER 3: FRACTURE MECHANICS, 3.1.1 Assessment of the shape of crack-tip plastic zones as a function of applied load, 3.1.1.1 Introduction, 3.1.1.2 Experimental details, 3.1.1.3 Measurement of Von Mises yield locus, 3.1.1.4 Discussion of results, 3.1.1.5 Conclusions, References, 3.1.2 Deformation around fatigue cracks from moir© fringe measurement, 3.1.2.1 Introduction, 3.1.2.2 Basic crack-tip models, 3.1.2.2.1 Stationary crack under monotonie loading, 3.1.2.2.2 Stationary crack under cyclic loading, 3.1.2.3 Experimental details, 3.1.2.4 Fatigue crack-tip deformation, 3.1.2.4.1 Local yielding, 3.1.2.4.2 Non-singular stresses, 3.1.2.4.3 Cyclic plasticity, 3.1.2.4.4 Local mode-mixity, 3.1.2.5 Summary, Acknowledgment, References, 3.2.1 Applications of moir© to cellulosic (paper and woo