| Preface | p. xi |
| Introduction | p. 1 |
| Motivation | p. 1 |
| Mems | p. 2 |
| Moems | p. 3 |
| Display technologies | p. 3 |
| Printers and industrial machining | p. 9 |
| Imaging scanners | p. 9 |
| Telecommunication | p. 10 |
| Adaptive or corrective optics | p. 12 |
| Spectroscopy applications | p. 13 |
| Medical applications | p. 15 |
| Moems actuation principles | p. 16 |
| Electrostatic actuation | p. 17 |
| Piezoelectric actuation | p. 22 |
| Magnetic actuation | p. 23 |
| Thermal actuation | p. 24 |
| Basics for a thermally actuated micromirror | p. 27 |
| Microactuator specifications | p. 27 |
| Principle of the presented microscanner | p. 28 |
| The thermal bimorph actuator | p. 28 |
| Thermal expansion | p. 29 |
| Stress in bimorph cantilevers and initial rest position | p. 29 |
| Thermal bimorph actuator design | p. 41 |
| Static temperature distribution in the microscanner | p. 46 |
| Analytical model | p. 46 |
| Determination of constants | p. 51 |
| Influence of the different constants on the temperature distribution | p. 55 |
| Summary | p. 58 |
| Response time of the bimorph beam | p. 59 |
| Thermal cut-off | p. 59 |
| Measurements of the cut-off frequency of the bimorph actuator | p. 60 |
| Conclusion | p. 61 |
| Dynamic temperature distribution in the bimorph beam | p. 62 |
| General conclusions | p. 64 |
| Microscanner technology | p. 67 |
| Fabrication process | p. 67 |
| Process improvements | p. 70 |
| Dry mirror release | p. 70 |
| Mirror stiffness and flatness improvement | p. 70 |
| Mirror reflectivity | p. 76 |
| Conclusions | p. 76 |
| One-dimensional microscanner | p. 77 |
| Test Set-up | p. 77 |
| Static characterization of Chromium based actuators | p. 78 |
| Single device characterization | p. 78 |
| Comparing angular deflection among various devices | p. 80 |
| Resistance variation of Cr layer with temperature | p. 84 |
| Static characterization of Nickel based actuators | p. 86 |
| Angle vs. temperature | p. 86 |
| Resistance vs. temperature | p. 86 |
| Angle vs. power | p. 87 |
| Summary | p. 88 |
| Dynamic characterization | p. 88 |
| Fundamental resonance frequency calculation | p. 89 |
| Experimental comparison of the resonance frequency | p. 94 |
| Influence of damping | p. 97 |
| Thermal cut-off | p. 98 |
| Dynamic microscanner performances | p. 98 |
| Lateral suspension mirror | p. 100 |
| Dynamics of the tunable optical filter with Ni based actuator | p. 102 |
| Summary | p. 104 |
| 1D scanner applications | p. 105 |
| Barcode reader | p. 105 |
| Micromechanical detector for molecular beams | p. 109 |
| Conclusions | p. 111 |
| Two-dimensional microscanner | p. 113 |
| Principle | p. 113 |
| Design and modelling of the raster natural frequency | p. 113 |
| Analytical model | p. 113 |
| Simulations | p. 119 |
| Dynamic measurements | p. 120 |
| 2D-microscanner type 1 | p. 120 |
| 2D-microscanner type 2 | p. 122 |
| Summary | p. 123 |
| Microprojector application | p. 123 |
| Scanner requirements | p. 123 |
| Pixel resolution | p. 124 |
| Static and dynamic mirror deformations | p. 126 |
| Experimental results | p. 127 |
| Conclusions | p. 133 |
| Advanced Optical Filters of Porous Silicon | p. 135 |
| Principle | p. 135 |
| History of porous silicon | p. 136 |
| Fabrication of porous silicon | p. 136 |
| Single etch cell | p. 137 |
| Double etch cell | p. 138 |
| Parameters determining the structure of porous silicon | p. 139 |
| Why porous silicon is porous | p. 139 |
| Substrate doping | p. 140 |
| Illumination | p. 141 |
| Electrolyte concentration | p. 141 |
| Current densities | p. 142 |
| Electropolishing | p. 144 |
| Porous silicon as sacrificial layer | p. 145 |
| Calculation of optical interference filters | p. 145 |
| Principle | p. 145 |
| General theory for simulation of optical multilayer filters | p. 146 |
| Bragg band reflectors | p. 148 |
| Fabry-Perot bandpass filters | p. 150 |
| Multi band reflectors | p. 151 |
| Edge filters | p. 152 |
| Angular dependence | p. 153 |
| Fabrication of optical filter of porous silicon | p. 153 |
| Effective media theory | p. 153 |
| Lateral homogeneity | p. 156 |
| Depth homogeneity | p. 156 |
| Oxidation and aging | p. 161 |
| Summary | p. 163 |
| Micromachining using porous Silicon | p. 165 |
| Goals for the technology | p. 165 |
| Metal masks | p. 166 |
| Nitride masks | p. 167 |
| Free-standing porous silicon films | p. 167 |
| Mask removal | p. 169 |
| Thermal actuator design | p. 169 |
| Calculation of optimum layer thicknesses | p. 173 |
| Calculation of beam length | p. 180 |
| Electrical heater resistance | p. 180 |
| Mechanical filter plate suspension | p. 181 |
| Shape and size of filter plate | p. 181 |
| Ways of suspension | p. 181 |
| Homogeneity of the optical filter | p. 184 |
| Frontside mask only | p. 185 |
| Frontside and backside mask | p. 186 |
| Experimental comparison | p. 187 |
| Electropolished well | p. 189 |
| Process flow | p. 190 |
| Summary | p. 193 |
| Tunable Optical Filter and IR Gas Spectroscopy | p. 195 |
| Overview of devices | p. 195 |
| Optical characterization | p. 198 |
| Visible light | p. 198 |
| Infrared light | p. 200 |
| Chip separation and packaging | p. 202 |
| Cleaving | p. 202 |
| Bonding on PCB | p. 204 |
| Encapsulation | p. 204 |
| Protection by a fusible link | p. 205 |
| System integration for gas sensing | p. 205 |
| Principle of infrared gas absorption spectroscopy | p. 205 |
| Set-up | p. 208 |
| Experimental results | p. 208 |
| Summary | p. 210 |
| Conclusions and outlook | p. 211 |
| Conclusions | p. 211 |
| Micromirror | p. 211 |
| Tunable optical filter | p. 213 |
| Outlook | p. 215 |
| Appendices | p. 217 |
| Complement to the curvature calculation due to residual stress | p. 217 |
| Complement to the static temperature distribution calculation | p. 221 |
| Large deflections | p. 225 |
| References | p. 229 |
| Symbols and Abbreviations | p. 255 |
| Glossary of terms | p. 263 |
| Acknowledgments | p. 267 |
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