Nanopackaging

Nanotechnologies and Electronics Packaging

By: James E. Morris (Editor)

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Hardcover | 23 October 2008

At a Glance

Hardcover
568 Pages

Dimensions(cm)
23.5 x 15.88 x 2.54

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$329.00

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This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.

Industry Reviews

From the reviews: "This is an impressive work that provides a substantial and relatively in depth coverage of a wide range of electronics packaging and assembly related applications for nanotechnology. Each chapter concludes with a list of references that can be used by the reader to further investigate a particular subject and the book is well produced with good quality figures and illustrations. ... I am pleased to be able to conclude this ... Nanopackaging: Nanotechnologies and Electronics Packaging as 'highly recommended'." (Martin Goosey, Microelectronics International, Vol. 26 (3), 2009)

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Nanopackaging: Nanotechnologies and Electronics Packaging	p. 1
Modelling Technologies and Applications	p. 15
Application of Molecular Dynamics Simulation in Electronic Packaging	p. 39
Advances in Delamination Modeling	p. 61
Nanoparticle Properties	p. 93
Nanoparticle Fabrication	p. 109
Nanoparticle-Based High-k Dielectric Composites: Opportunities and Challenges	p. 121
Nanostructured Resistor Materials	p. 139
Nanogranular Magnetic Core Inductors: Design, Fabrication, and Packaging	p. 163
Nanoconductive Adhesives	p. 189
Nanoparticles in Microvias	p. 209
Materials and Technology for Conductive Microstructures	p. 239
A Study of Nanoparticles in SnAg-Based Lead-Free Solders	p. 265
Nano-Underfills for Fine-Pitch Electronics	p. 287
Carbon Nanotubes: Synthesis and Characterization	p. 325
Characteristics of Carbon Nanotubes for Nanoelectronic Device Applications	p. 345
Carbon Nanotubes for Thermal Management of Microsystems	p. 377
Electromagnetic Shielding of Transceiver Packaging Using Multiwall Carbon Nanotubes	p. 395
Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu Solders Reinforced With Single-Wall Carbon Nanotubes	p. 415
Nanowires in Electronics Packaging	p. 441
Design and Development of Stress-Engineered Compliant Interconnect for Microelectronic Packaging	p. 465
Flip Chip Packaging for Nanoscale Silicon Logic Devices: Challenges and Opportunities	p. 491
Nanoelectronics Landscape: Application, Technology, and Economy	p. 517
Index	p. 537
Table of Contents provided by Ingram. All Rights Reserved.

Nanopackaging

Nanotechnologies and Electronics Packaging

At a Glance

Hardcover

Industry Reviews

Shipping

How to return your order

Defective items

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