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Nanopackaging : Nanotechnologies and Electronics Packaging - James E. Morris

Nanopackaging

Nanotechnologies and Electronics Packaging

By: James E. Morris (Editor)

Hardcover | 23 October 2008

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This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.

Industry Reviews
From the reviews: "This is an impressive work that provides a substantial and relatively in depth coverage of a wide range of electronics packaging and assembly related applications for nanotechnology. Each chapter concludes with a list of references that can be used by the reader to further investigate a particular subject and the book is well produced with good quality figures and illustrations. ... I am pleased to be able to conclude this ... Nanopackaging: Nanotechnologies and Electronics Packaging as 'highly recommended'." (Martin Goosey, Microelectronics International, Vol. 26 (3), 2009)

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