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Nanofluids Technology for Thermal Sciences and Engineering : Research, Development, and Applications - Ashwani  Kumar

Nanofluids Technology for Thermal Sciences and Engineering

Research, Development, and Applications

By: Ashwani Kumar (Editor), Nitesh Dutt (Editor), Mukesh Kumar Awasthi (Editor)

Paperback | 21 May 2026 | Edition Number 1

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This text highlights how nanofluids can be used in thermal solutions across multiple industries, including electronics, energy, and manufacturing. It emphasizes the enhanced heat transfer properties of nanofluids and their potential to significantly improve the efficiency of heat exchange processes. This book discusses topics such as nanoparticle synthesis, nanofluid testing, performance enhancement using nanofluids, thermal behavior of hybrid nanofluids, Brinkman equation in nanofluids and safety considerations in nano fluidâ'based systems.

This book:

  • Discusses the recent innovation, technological development of nanofluids and explores nanoparticle synthesis and characterization for nanofluid development
  • Offers a comprehensive understanding of nanofluid technology and nanofluid for aerospace application, covering diverse topics from fundamental properties to advanced research frontiers in nanofluids for thermal engineering
  • Includes realâ'world case studies and practical techniques that will help the readers to apply nanofluid technology in various thermal engineering scenarios
  • Covers heat exchanger performance improvement with nanofluids, hybrid nanofluids, Flow of Newtonian and Nonâ'Newtonian hybrid Nanofluid, and oilâ'based Triâ'hybrid Nanofluid
  • Explains experimental techniques for nanofluid testing and validation and presents safety and environmental considerations in nanofluidâ'based systems

It is primarily written for senior undergraduates, graduate students, and academic researchers in the fields of manufacturing engineering, industrial engineering, production engineering, mechanical engineering, automotive engineering, and aerospace engineering.

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