Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module

Ceramic research and development in Japan

By: K. Otsuka

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Hardcover | 30 April 1993

At a Glance

Hardcover
260 Pages

Dimensions(cm)
23.39 x 15.6 x 1.6

Hardcover

$519.00

Aims to ship in 7 to 10 business days

A translation of an important Japanese work on electronic ceramics, this work is particularly concerned with the manufacturing processes of multilayer ceramic substrates for use in semiconductors. This processing technology is important in helping to create efficient high speed devices and has a wide range of applications in many areas of general electronics. In order to improve the dimensional accuracy of alumina ceramic multilayer substrate, theoretical and experimental studies are included concentrating on the process conditions of pwder preparation, mixing, casting, printing, laminating and firing. The relationship between dimensional control and process vairation is described along with an analysis of adhesion in the layers of a tungsten and aluminium substrate.

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Foreword
Introduction
Modeling of fine powder mixing and measurement of the degree of mixing
Simulation of the flowpath in the doctor-blade and its application to raising the precision of green sheet thickness
Improving dimensional precision by firing in a reducing atmosphere
Effect of forming and firing conditions on the dimensions of ceramics
Improving the strength of tungsten metallization on alumina ceramics
Study of fine wire aluminium metallization on alumina ceramics
Electrical insulation between fine metallization on alumina ceramics, and its protection
Summary
References
Index
Table of Contents provided by Blackwell. All Rights Reserved.

Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module

Ceramic research and development in Japan

At a Glance

Hardcover

Shipping

How to return your order

Defective items

You Can Find This Book In

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