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Multichip Modules

By: Ernest Kuh (Editor)

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Hardcover | 1 December 1991

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Hardcover
156 Pages

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Multichip module (MCM) technology has been used in high-end systems, such as mainframe and supercomputers as well as military and space applications for some time. Rapid advances in VLSI technology and novel system architecture concepts have presented both challenges and opportunities for MCM technologists. Recent developments in MCM technology indicate that it will eventually take over much of the electronic packaging currently using printed circuit boards. This collection of articles gives an in-depth study of the state-of-the-art of MCM technology from systems, CAD and technology viewpoints.

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You Can Find This Book In

Non-Fiction Engineering & Technology Electronics & Communications Engineering Electronics Engineering Circuits & Components Computing & I.T.Computer Science Energy Technology & Engineering Electrical Engineering Booktopia Publisher Services World Scientific Publishing

Introduction
Early Assessment of Design, Packaging and Technology Tradeoffs	p. 1
The VAX 9000 Multichip Packaging and Its Evolution to Future High End Computer Applications	p. 27
Si-on-Si MCM Technology and Its Applications	p. 43
Design Automation for Multichip Module--Issues and Status	p. 55
Performance Driven Layout for Thin-Film Multichip Modules	p. 79
Transient Simulation of Lossy Coupled Transmission Lines Characterized with Frequency-Dependent Parameters	p. 111
Table of Contents provided by Blackwell. All Rights Reserved.

Multichip Modules

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Hardcover

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How to return your order

Defective items

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