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| Foreword | p. xvii |
| Preface | p. xxi |
| Acknowledgments | p. xxv |
| Getting Started | |
| Introduction | p. 3 |
| Microsystems vs. MEMS | p. 3 |
| What are they? | p. 3 |
| How are they made? | p. 5 |
| What are they made of? | p. 6 |
| How are they designed? | p. 7 |
| Markets for Microsystems and MEMS | p. 8 |
| Case Studies | p. 9 |
| Looking Ahead | p. 12 |
| An Approach to MEMS Design | p. 15 |
| Design: The Big Picture | p. 15 |
| Device Categories | p. 15 |
| High-Level Design Issues | p. 16 |
| The Design Process | p. 17 |
| Modeling Levels | p. 19 |
| Analytical or Numerical? | p. 21 |
| A Closer Look | p. 22 |
| Example: A Position-Control System | p. 24 |
| Going Forward From Here | p. 26 |
| Microfabrication | p. 29 |
| Overview | p. 29 |
| Wafer-Level Processes | p. 30 |
| Substrates | p. 30 |
| Wafer Cleaning | p. 34 |
| Oxidation of Silicon | p. 34 |
| Local Oxidation | p. 37 |
| Doping | p. 38 |
| Thin-Film Deposition | p. 42 |
| Wafer Bonding | p. 47 |
| Pattern Transfer | p. 50 |
| Optical Lithography | p. 50 |
| Design Rules | p. 54 |
| Mask Making | p. 55 |
| Wet Etching | p. 57 |
| Dry Etching | p. 67 |
| Additive Processes: Lift-Off | p. 71 |
| Planarization | p. 74 |
| Conclusion | p. 77 |
| Process Integration | p. 79 |
| Developing a Process | p. 79 |
| A Simple Process Flow | p. 79 |
| The Self-Aligned Gate: A Paradigm-Shifting Process | p. 83 |
| Basic Principles of Process Design | p. 85 |
| From Shape to Process and Back Again | p. 85 |
| Process Design Issues | p. 86 |
| Sample Process Flows | p. 91 |
| A Bulk-Micromachined Diaphragm Pressure Sensor | p. 92 |
| A Surface-Micromachined Suspended Filament | p. 97 |
| Moving On | p. 98 |
| Modeling Strategies | |
| Lumped Modeling | p. 103 |
| Introduction | p. 103 |
| Conjugate Power Variables | p. 104 |
| One-Port Elements | p. 106 |
| Ports | p. 106 |
| The Variable-Assignment Conventions | p. 106 |
| One-Port Source Elements | p. 108 |
| One-Port Circuit Elements | p. 109 |
| Circuit Connections in the e [right arrow] V Convention | p. 114 |
| Kirchhoff's Laws | p. 114 |
| Formulation of Dynamic Equations | p. 116 |
| Complex Impedances | p. 116 |
| State Equations | p. 117 |
| Transformers and Gyrators | p. 118 |
| Impedance Transformations | p. 119 |
| The Electrical Inductor | p. 120 |
| Energy-Conserving Transducers | p. 125 |
| Introduction | p. 125 |
| The Parallel-Plate Capacitor | p. 125 |
| Charging the Capacitor at Fixed Gap | p. 126 |
| Charging the Capacitor at Zero Gap, then Lifting | p. 127 |
| The Two-Port Capacitor | p. 129 |
| Electrostatic Actuator | p. 130 |
| Charge Control | p. 131 |
| Voltage Control | p. 132 |
| Pull-In | p. 134 |
| Adding Dynamics to the Actuator Model | p. 137 |
| The Magnetic Actuator | p. 139 |
| Equivalent Circuits for Linear Transducers | p. 142 |
| The Position Control System--Revisited | p. 145 |
| Dynamics | p. 149 |
| Introduction | p. 149 |
| Linear System Dynamics | p. 150 |
| Direct Integration | p. 151 |
| System Functions | p. 152 |
| Fourier Transform | p. 157 |
| Sinusoidal Steady State | p. 158 |
| Eigenfunction Analysis | p. 160 |
| Nonlinear Dynamics | p. 164 |
| Fixed Points of Nonlinear Systems | p. 164 |
| Linearization About an Operating Point | p. 165 |
| Linearization of the Electrostatic Actuator | p. 166 |
| Transducer Model for the Linearized Actuator | p. 169 |
| Direct Integration of State Equations | p. 173 |
| Resonators and Oscillators | p. 178 |
| And Then There's Chaos... | p. 178 |
| Domain-Specific Details | |
| Elasticity | p. 183 |
| Introduction | p. 183 |
| Constitutive Equations of Linear Elasticity | p. 184 |
| Stress | p. 184 |
| Strain | p. 185 |
| Elastic Constants for Isotropic Materials | p. 186 |
| Other Elastic Constants | p. 188 |
| Isotropic Elasticity in Three Dimensions | p. 189 |
| Plane Stress | p. 190 |
| Elastic Constants for Anisotropic Materials | p. 191 |
| Thermal Expansion and Thin-Film Stress | p. 193 |
| Other Sources of Residual Thin-Film Stress | p. 195 |
| Selected Mechanical Property Data | p. 196 |
| Material Behavior at Large Strains | p. 196 |
| Plastic Deformation | p. 197 |
| Structures | p. 201 |
| Overview | p. 201 |
| Axially Loaded Beams | p. 201 |
| Beams With Varying Cross-section | p. 203 |
| Statically Indeterminate Beams | p. 203 |
| Stresses on Inclined Sections | p. 205 |
| Bending of Beams | p. 207 |
| Types of Support | p. 207 |
| Types of Loads | p. 207 |
| Reaction Forces and Moments | p. 208 |
| Pure Bending of a Transversely Loaded Beam | p. 211 |
| Differential Equation for Beam Bending | p. 213 |
| Elementary Solutions of the Beam Equation | p. 216 |
| Anticlastic Curvature | p. 218 |
| Bending of Plates | p. 219 |
| Plate in Pure Bending | p. 220 |
| Effects of Residual Stresses and Stress Gradients | p. 222 |
| Stress Gradients in Cantilevers | p. 222 |
| Residual Stresses in Doubly-Supported Beams | p. 226 |
| Buckling of Beams | p. 231 |
| Plates With In-Plane Stress | p. 235 |
| What about large deflections? | p. 237 |
| Energy Methods | p. 239 |
| Elastic Energy | p. 240 |
| The Principle of Virtual Work | p. 243 |
| Variational Methods | p. 244 |
| Properties of the Variational Solution | p. 247 |
| Large Deflections of Elastic Structures | p. 249 |
| A Center-Loaded Doubly-Clamped Beam | p. 249 |
| Combining Variational Results with Simulations | p. 253 |
| The Uniformly Loaded Doubly-Clamped Beam | p. 254 |
| Residual Stress in Clamped Structures | p. 255 |
| Elastic Energy in Plates and Membranes | p. 256 |
| Uniformly Loaded Plates and Membranes | p. 257 |
| Membrane Load-Deflection Behavior | p. 259 |
| Rayleigh-Ritz Methods | p. 260 |
| Estimating Resonant Frequencies | p. 260 |
| Extracting Lumped-Element Masses | p. 263 |
| Dissipation and the Thermal Energy Domain | p. 267 |
| Dissipation is Everywhere | p. 267 |
| Electrical Resistance | p. 267 |
| Charging a Capacitor | p. 269 |
| Dissipative Processes | p. 271 |
| The Thermal Energy Domain | p. 272 |
| The Heat-Flow Equation | p. 275 |
| Basic Thermodynamic Ideas | p. 275 |
| Lumped Modeling in the Thermal Domain | p. 277 |
| Self-Heating of a Resistor | p. 278 |
| Temperature Coefficient of Resistance | p. 279 |
| Current-source drive | p. 279 |
| Voltage-source drive | p. 281 |
| A Self-Heated Silicon Resistor | p. 282 |
| Other Dissipation Mechanisms | p. 286 |
| Contact Friction | p. 286 |
| Dielectric losses | p. 287 |
| Viscoelastic losses | p. 288 |
| Magnetic Losses | p. 289 |
| Diffusion | p. 290 |
| Irreversible Thermodynamics: Coupled Flows | p. 291 |
| Thermoelectric Power and Thermocouples | p. 293 |
| Thermoelectric Heating and Cooling | p. 295 |
| Other Coupled-Flow Problems | p. 296 |
| Modeling Time-Dependent Dissipative Processes | p. 296 |
| Lumped Modeling of Dissipative Processes | p. 299 |
| Overview | p. 299 |
| The Generalized Heat-Flow Equation | p. 299 |
| The DC Steady State: The Poisson Equation | p. 300 |
| Finite-Difference Solution of the Poisson Equation | p. 301 |
| Temperature Distribution in a Self-Heated Resistor | p. 303 |
| Eigenfunction Solution of the Poisson Equation | p. 305 |
| Transient Response: Finite-Difference Approach | p. 307 |
| Transient Response: Eigenfunction Method | p. 307 |
| One-Dimensional Example | p. 308 |
| Equivalent Circuit for a Single Mode | p. 309 |
| Equivalent Circuit Including All Modes | p. 311 |
| Fluids | p. 317 |
| What Makes Fluids Difficult? | p. 317 |
| Basic Fluid Concepts | p. 318 |
| Viscosity | p. 318 |
| Thermophysical Properties | p. 319 |
| Surface Tension | p. 320 |
| Conservation of Mass | p. 322 |
| Time Rate of Change of Momentum | p. 323 |
| The Navier-Stokes Equation | p. 324 |
| Energy Conservation | p. 324 |
| Reynolds Number and Mach Number | p. 325 |
| Incompressible Laminar Flow | p. 326 |
| Couette Flow | p. 327 |
| Poiseuille Flow | p. 328 |
| Development Lengths and Boundary Layers | p. 331 |
| Stokes Flow | p. 332 |
| Squeezed-Film Damping | p. 332 |
| Rigid Parallel-Plate Small-Amplitude Motion | p. 334 |
| Electrolytes and Electrokinetic Effects | p. 339 |
| Ionic Double Layers | p. 340 |
| Electroosmotic Flow | p. 343 |
| Electrophoresis | p. 344 |
| Diffusion Effects | p. 347 |
| Pressure Effects | p. 348 |
| Mixing | p. 348 |
| Modeling of Electrokinetic Systems | p. 349 |
| Circuit and System Issues | |
| Electronics | p. 353 |
| Introduction | p. 353 |
| Elements of Semiconductor Physics | p. 353 |
| Equilibrium Carrier Concentrations | p. 354 |
| Excess Carriers | p. 355 |
| The Semiconductor Diode | p. 357 |
| The Diffused Resistor | p. 363 |
| The Photodiode | p. 364 |
| The Bipolar Junction Transistor | p. 365 |
| The MOSFET | p. 365 |
| Large-Signal Characteristics of the MOSFET | p. 367 |
| MOSFET Capacitances | p. 371 |
| Small-Signal Model of the MOSFET | p. 371 |
| MOSFET Amplifiers | p. 372 |
| The CMOS Inverter | p. 373 |
| Large-Signal Switching Speed | p. 376 |
| The Linear-Gain Region | p. 379 |
| Other Amplifier Configurations | p. 381 |
| Operational Amplifiers | p. 381 |
| Dynamic Effects | p. 383 |
| Basic Op-Amp Circuits | p. 384 |
| Inverting Amplifier | p. 384 |
| Short Method for Analyzing Op-Amp Circuits | p. 387 |
| Noninverting Amplifier | p. 387 |
| Transimpedance Amplifier | p. 388 |
| Integrator | p. 389 |
| Differentiator | p. 390 |
| Charge-Measuring Circuits | p. 391 |
| Differential Charge Measurement | p. 391 |
| Switched-Capacitor Circuits | p. 393 |
| Feedback Systems | p. 397 |
| Introduction | p. 397 |
| Basic Feedback Concepts | p. 397 |
| Feedback in Linear Systems | p. 398 |
| Feedback Amplifiers | p. 399 |
| Example: The Position Controller | p. 400 |
| PID Control | p. 405 |
| The Effect of Amplifier Bandwidth | p. 407 |
| Phase Margin | p. 408 |
| Noise and Disturbances | p. 409 |
| Stabilization of Unstable Systems | p. 410 |
| Controllability and Observability Revisited | p. 411 |
| Feedback in Nonlinear Systems | p. 411 |
| Quasi-static Nonlinear Feedback Systems | p. 412 |
| Resonators and Oscillators | p. 413 |
| Simulink Model | p. 417 |
| The (Almost) Sinusoidal Oscillator | p. 418 |
| Relaxation Oscillation | p. 420 |
| Noise | p. 425 |
| Introduction | p. 425 |
| The Interference Problem | p. 426 |
| Shields | p. 427 |
| Ground Loops | p. 428 |
| Guards | p. 429 |
| Characterization of Signals | p. 430 |
| Amplitude-Modulated Signals | p. 431 |
| Characterization of Random Noise | p. 433 |
| Mean-Square and Root-Mean-Square Noise | p. 434 |
| Addition of Uncorrelated Sources | p. 434 |
| Signal-to-Noise Ratio | p. 435 |
| Spectral Density Function | p. 435 |
| Noise in Linear Systems | p. 436 |
| Noise Sources | p. 436 |
| Thermal Noise | p. 436 |
| Noise Bandwidth | p. 438 |
| Shot Noise | p. 439 |
| Flicker Noise | p. 440 |
| Amplifier Noise | p. 441 |
| Example: A Resistance Thermometer | p. 442 |
| Using a DC source | p. 445 |
| Modulation of an AC Carrier | p. 446 |
| Caution: Modulation Does Not Always Work | p. 447 |
| Drifts | p. 447 |
| Case Studies | |
| Packaging | p. 453 |
| Introduction to the Case Studies | p. 453 |
| Packaging, Test, and Calibration | p. 454 |
| An Approach to Packaging | p. 455 |
| A Commercial Pressure-Sensor Case Study | p. 459 |
| Device Concept | p. 461 |
| System Partitioning | p. 461 |
| Interfaces | p. 462 |
| Details | p. 463 |
| A Final Comment | p. 467 |
| A Piezoresistive Pressure Sensor | p. 469 |
| Sensing Pressure | p. 469 |
| Piezoresistance | p. 470 |
| Analytic Formulation in Cubic Materials | p. 471 |
| Longitudinal and Transverse Piezoresistance | p. 472 |
| Piezoresistive Coefficients of Silicon | p. 473 |
| Structural Examples | p. 474 |
| Averaging over Stress and Doping Variations | p. 477 |
| A Numerical Example | p. 480 |
| The Motorola MAP Sensor | p. 481 |
| Process Flow | p. 481 |
| Details of the Diaphragm and Piezoresistor | p. 483 |
| Stress Analysis | p. 485 |
| Signal-Conditioning and Calibration | p. 488 |
| Device Noise | p. 492 |
| Recent Design Changes | p. 493 |
| Higher-Order Effects | p. 494 |
| A Capacitive Accelerometer | p. 497 |
| Introduction | p. 497 |
| Fundamentals of Quasi-Static Accelerometers | p. 498 |
| Position Measurement With Capacitance | p. 500 |
| Circuits for Capacitance Measurement | p. 502 |
| Demodulation Methods | p. 507 |
| Chopper-Stabilized Amplifiers | p. 510 |
| Correlated Double Sampling | p. 511 |
| Signal-to-Noise Issues | p. 512 |
| A Capacitive Accelerometer Case Study | p. 513 |
| Specifications | p. 516 |
| Sensor Design and Modeling | p. 518 |
| Fabrication and Packaging | p. 520 |
| Noise and Accuracy | p. 523 |
| Position Measurement With Tunneling Tips | p. 525 |
| Electrostatic Projection Displays | p. 531 |
| Introduction | p. 531 |
| Electromechanics of the DMD Device | p. 536 |
| Electrode Structure | p. 536 |
| Torsional Pull-in | p. 537 |
| Electromechanics of Electrostatically Actuated Beams | p. 541 |
| M-Test | p. 544 |
| The Grating-Light-Valve Display | p. 544 |
| Diffraction Theory | p. 544 |
| Device Fabrication and Packaging | p. 548 |
| Quantitative Estimates of GLV Device Performance | p. 550 |
| A Comparison | p. 558 |
| A Piezoelectric Rate Gyroscope | p. 561 |
| Introduction | p. 561 |
| Kinematics of Rotation | p. 561 |
| The Coriolis Rate Gyroscope | p. 563 |
| Sinusoidal Response Function | p. 565 |
| Steady Rotation | p. 566 |
| Response to Angular Accelerations | p. 567 |
| Generalized Gyroscopic Modes | p. 567 |
| Piezoelectricity | p. 570 |
| The Origin of Piezoelectricity | p. 570 |
| Analytical Formulation of Piezoelectricity | p. 571 |
| Piezoelectric Materials | p. 573 |
| Piezoelectric Actuation | p. 575 |
| Sensing with Piezoelectricity | p. 577 |
| A Quartz Rate Gyroscope Case Study | p. 578 |
| Electrode Structures | p. 579 |
| Lumped-Element Modeling of Piezoelectric Devices | p. 582 |
| QRS Specifications and Performance | p. 592 |
| A Quantitative Device Model | p. 594 |
| The Drive Mode | p. 595 |
| Sense-Mode Displacement of the Drive Tines | p. 598 |
| Coupling to the Sense Tines | p. 599 |
| Noise and Accuracy Considerations | p. 602 |
| Closing Comments | p. 602 |
| Dna Amplification | p. 605 |
| Introduction | p. 605 |
| Polymerase Chain Reaction (PCR) | p. 606 |
| Elements of PCR | p. 606 |
| Specifications for a PCR System | p. 610 |
| Microsystem Approaches to PCR | p. 611 |
| Batch System | p. 611 |
| PCR Flow System | p. 614 |
| Thermal Model of the Batch Reactor | p. 616 |
| Control Circuit and Transient Behavior | p. 618 |
| Thermal Model of the Continuous Flow Reactor | p. 621 |
| A Comparison | p. 625 |
| A Microbridge Gas Sensor | p. 629 |
| Overview | p. 629 |
| System-Level Issues | p. 630 |
| First-Order Device and System Models | p. 632 |
| Filament Characteristics | p. 632 |
| Resistance-Control System | p. 634 |
| A Practical Device and Fabrication Process | p. 639 |
| Creating the Filament | p. 639 |
| High-Temperature Bond Pads | p. 641 |
| Catalyst Coating | p. 642 |
| Sensor Performance | p. 643 |
| Demonstration of Hydrogen Detection | p. 643 |
| Mass-Transport-Limited Operation | p. 644 |
| Reaction-Rate-Limited Operation | p. 645 |
| Advanced Modeling | p. 646 |
| Epilogue | p. 648 |
| Appendices | p. 650 |
| Glossary of Notation | p. 651 |
| Electromagnetic Fields | p. 657 |
| Introduction | p. 657 |
| Quasistatic Fields | p. 657 |
| Elementary Laws | p. 657 |
| Electroquasistatic Systems | p. 658 |
| Magnetoquasistatic Systems | p. 659 |
| Elastic Constants in Cubic Material | p. 663 |
| References | p. 665 |
| Index | p. 677 |
| Table of Contents provided by Syndetics. All Rights Reserved. |
ISBN: 9780792372462
ISBN-10: 0792372468
Published: 29th July 2005
Format: Hardcover
Language: English
Number of Pages: 722
Audience: Professional and Scholarly
Publisher: Springer Nature B.V.
Country of Publication: NL
Dimensions (cm): 24.77 x 16.51 x 3.81
Weight (kg): 1.18
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