Mems Reference Shelf

By: Allyson L. Hartzell, Mark G. da Silva, Herbert R. Shea

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Hardcover | 11 November 2010

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308 Pages

Dimensions(cm)
23.5 x 15.5 x 2.54

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The successful launch of viable MEMs product hinges on MEMS reliability, the reliability and qualification for MEMs based products is not widely understood. Companies that have a deep understanding of MEMs reliability view the information as a competitive advantage and are reluctant to share it.

MEMs Reliability, focuses on the reliability and manufacturability of MEMS at a fundamental level by addressing process development and characterization, material property characterization, failure mechanisms and physics of failure (POF), design strategies for improving yield, design for reliability (DFR), packaging and testing.

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Introduction: Reliability of MEMS	p. 1
References	p. 7
Lifetime Prediction	p. 9
Introduction	p. 9
Mathematical Measures of Reliability	p. 9
Reliability Distributions	p. 11
Bathtub Curve	p. 11
Exponential Distribution	p. 12
Weibull Distribution	p. 13
Lognormal distribution	p. 15
Acceleration Factors	p. 19
Lifetime Units	p. 24
Case Studies	p. 25
Texas Instruments Digital Mirror Device	p. 25
Case Study: Analog Devices Accelerometer	p. 30
Case Study: RF MEMS	p. 34
Summary	p. 41
References	p. 41
Failure Modes and Mechanisms: Failure Modes and Mechanisms in MEMS	p. 43
Introduction	p. 43
Design Phase Failure Modes	p. 45
Functional Failure Modes	p. 45
MEMS Material Failure Modes	p. 56
Non-analyzed Conditions	p. 64
Manufacturing Failure Modes	p. 66
Front End Process Defects	p. 66
Back End Process Failures	p. 78
Summary	p. 80
References	p. 81
In-Use Failures	p. 85
Introduction	p. 85
Mechanical Failure Modes	p. 85
Fracture	p. 86
Mechanical Shock Resistance	p. 90
Vibration	p. 111
Creep	p. 114
Fatigue	p. 118
Electrical Failure Modes	p. 123
Charging in MEMS	p. 123
Electrical Breakdown and ESD	p. 138
Electromigration	p. 146
Environmental	p. 148
Radiation	p. 149
Anodic Oxidation and Galvanic Corrosion of Silicon	p. 159
Metal Corrosion	p. 166
Conclusions	p. 171
References	p. 171
Root Cause and Failure Analysis	p. 179
Introduction	p. 179
FMEA, Failure Mode and Effects Analysis	p. 180
RPN (Risk Priority Number) Levels	p. 181
RFMEA Example	p. 181
Case Study of RFMEA Failure Mode	p. 185
RFMEA Safeguard: Design for Reliability, Mirror Curvature Matching	p. 185
RFMEA Safeguard: Test for Curvature	p. 188
RFMEA Safeguard: Perform Accelerated Thermal Testing and Compare Radius of Curvature Change to Predictions	p. 190
Implementation of RFMEA Learning into Production	p. 192
Failure Analysis as a Tool for Root Cause	p. 193
Analytical Methods for Failure Analysis	p. 194
Laser Doppler Vibrometry (LDV)	p. 194
Interferometry	p. 196
Scanning Electron Microscopy (SEM)	p. 198
Electron Beam Scatter Detector (EBSD)	p. 199
Transmission Electron Microscopy (TEM)	p. 200
Focused Ion Beam (FIB)	p. 201
Atomic Force Microscopy (AFM)	p. 203
Energy Dispersive X-ray Analysis (EDS, EDX, EDAX)	p. 204
Auger Analysis	p. 206
X-Ray Photoelectron Spectroscopy (ESCA/XPS)	p. 208
Time of Flight Secondary Ion Mass Spectroscopy (TOFSIMS)	p. 210
Fourier Transform Infrared Spectroscopy (FTIR)	p. 211
Summary	p. 213
References	p. 213
Testing and Standards for Qualification	p. 215
Introduction	p. 215
Testing MEMS	p. 215
Classes of MEMS Devices	p. 216
Test Equipment for MEMS	p. 217
Shaker Table for Vibration Testing	p. 218
Optical Testing for Deformable Mirrors	p. 221
Dynamic Interferometry	p. 223
MEMS Optical Switch Production Test System	p. 223
Laser Doppler Vibrometer/Strobe Video System	p. 224
SHiMMer (Sandia High Volume Measurement of Micromachine Reliability)	p. 227
Quality Standards and Qualifications	p. 227
Mil-Std-883 (Revision H is current)	p. 234
Mil-Std-810 (Current Revision G)	p. 237
Telcordia Standards	p. 240
Automotive Standards	p. 240
MEMS Qualification Testing	p. 242
ADI Accelerometers for Airbag Deployment	p. 242
Motorola MEMS Pressure Sensors	p. 245
Example: Space and Military Qualification	p. 248
Summary	p. 251
References	p. 251
Continuous Improvement: Tools and Techniques for Reliability Improvement	p. 253
The Yield-Reliability Connection	p. 254
Yield Improvement Techniques	p. 256
Design for Manufacturability (DfM)	p. 256
Design for Test (DfT)	p. 263
Process and Packaging Integration	p. 266
Yield Modeling	p. 268
Reliability Enhancement	p. 269
Process Stability and Reproducibility	p. 269
Product Qualification	p. 278
Design for Reliability (DFR)	p. 282
Summary	p. 285
References	p. 285
Subject Index	p. 289
Table of Contents provided by Ingram. All Rights Reserved.

Mems Reference Shelf

At a Glance

Hardcover

Shipping

How to return your order

Defective items

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