| Introduction: Reliability of MEMS | p. 1 |
| References | p. 7 |
| Lifetime Prediction | p. 9 |
| Introduction | p. 9 |
| Mathematical Measures of Reliability | p. 9 |
| Reliability Distributions | p. 11 |
| Bathtub Curve | p. 11 |
| Exponential Distribution | p. 12 |
| Weibull Distribution | p. 13 |
| Lognormal distribution | p. 15 |
| Acceleration Factors | p. 19 |
| Lifetime Units | p. 24 |
| Case Studies | p. 25 |
| Texas Instruments Digital Mirror Device | p. 25 |
| Case Study: Analog Devices Accelerometer | p. 30 |
| Case Study: RF MEMS | p. 34 |
| Summary | p. 41 |
| References | p. 41 |
| Failure Modes and Mechanisms: Failure Modes and Mechanisms in MEMS | p. 43 |
| Introduction | p. 43 |
| Design Phase Failure Modes | p. 45 |
| Functional Failure Modes | p. 45 |
| MEMS Material Failure Modes | p. 56 |
| Non-analyzed Conditions | p. 64 |
| Manufacturing Failure Modes | p. 66 |
| Front End Process Defects | p. 66 |
| Back End Process Failures | p. 78 |
| Summary | p. 80 |
| References | p. 81 |
| In-Use Failures | p. 85 |
| Introduction | p. 85 |
| Mechanical Failure Modes | p. 85 |
| Fracture | p. 86 |
| Mechanical Shock Resistance | p. 90 |
| Vibration | p. 111 |
| Creep | p. 114 |
| Fatigue | p. 118 |
| Electrical Failure Modes | p. 123 |
| Charging in MEMS | p. 123 |
| Electrical Breakdown and ESD | p. 138 |
| Electromigration | p. 146 |
| Environmental | p. 148 |
| Radiation | p. 149 |
| Anodic Oxidation and Galvanic Corrosion of Silicon | p. 159 |
| Metal Corrosion | p. 166 |
| Conclusions | p. 171 |
| References | p. 171 |
| Root Cause and Failure Analysis | p. 179 |
| Introduction | p. 179 |
| FMEA, Failure Mode and Effects Analysis | p. 180 |
| RPN (Risk Priority Number) Levels | p. 181 |
| RFMEA Example | p. 181 |
| Case Study of RFMEA Failure Mode | p. 185 |
| RFMEA Safeguard: Design for Reliability, Mirror Curvature Matching | p. 185 |
| RFMEA Safeguard: Test for Curvature | p. 188 |
| RFMEA Safeguard: Perform Accelerated Thermal Testing and Compare Radius of Curvature Change to Predictions | p. 190 |
| Implementation of RFMEA Learning into Production | p. 192 |
| Failure Analysis as a Tool for Root Cause | p. 193 |
| Analytical Methods for Failure Analysis | p. 194 |
| Laser Doppler Vibrometry (LDV) | p. 194 |
| Interferometry | p. 196 |
| Scanning Electron Microscopy (SEM) | p. 198 |
| Electron Beam Scatter Detector (EBSD) | p. 199 |
| Transmission Electron Microscopy (TEM) | p. 200 |
| Focused Ion Beam (FIB) | p. 201 |
| Atomic Force Microscopy (AFM) | p. 203 |
| Energy Dispersive X-ray Analysis (EDS, EDX, EDAX) | p. 204 |
| Auger Analysis | p. 206 |
| X-Ray Photoelectron Spectroscopy (ESCA/XPS) | p. 208 |
| Time of Flight Secondary Ion Mass Spectroscopy (TOFSIMS) | p. 210 |
| Fourier Transform Infrared Spectroscopy (FTIR) | p. 211 |
| Summary | p. 213 |
| References | p. 213 |
| Testing and Standards for Qualification | p. 215 |
| Introduction | p. 215 |
| Testing MEMS | p. 215 |
| Classes of MEMS Devices | p. 216 |
| Test Equipment for MEMS | p. 217 |
| Shaker Table for Vibration Testing | p. 218 |
| Optical Testing for Deformable Mirrors | p. 221 |
| Dynamic Interferometry | p. 223 |
| MEMS Optical Switch Production Test System | p. 223 |
| Laser Doppler Vibrometer/Strobe Video System | p. 224 |
| SHiMMer (Sandia High Volume Measurement of Micromachine Reliability) | p. 227 |
| Quality Standards and Qualifications | p. 227 |
| Mil-Std-883 (Revision H is current) | p. 234 |
| Mil-Std-810 (Current Revision G) | p. 237 |
| Telcordia Standards | p. 240 |
| Automotive Standards | p. 240 |
| MEMS Qualification Testing | p. 242 |
| ADI Accelerometers for Airbag Deployment | p. 242 |
| Motorola MEMS Pressure Sensors | p. 245 |
| Example: Space and Military Qualification | p. 248 |
| Summary | p. 251 |
| References | p. 251 |
| Continuous Improvement: Tools and Techniques for Reliability Improvement | p. 253 |
| The Yield-Reliability Connection | p. 254 |
| Yield Improvement Techniques | p. 256 |
| Design for Manufacturability (DfM) | p. 256 |
| Design for Test (DfT) | p. 263 |
| Process and Packaging Integration | p. 266 |
| Yield Modeling | p. 268 |
| Reliability Enhancement | p. 269 |
| Process Stability and Reproducibility | p. 269 |
| Product Qualification | p. 278 |
| Design for Reliability (DFR) | p. 282 |
| Summary | p. 285 |
| References | p. 285 |
| Subject Index | p. 289 |
| Table of Contents provided by Ingram. All Rights Reserved. |
