+612 9045 4394
$7.95 Delivery per order to Australia and New Zealand
100% Australian owned
Over a hundred thousand in-stock titles ready to ship
Materials for Electronic Packaging - Deborah D. L. Chung

Materials for Electronic Packaging

By: Deborah D. L. Chung (Editor)

Hardcover Published: 19th April 1995
ISBN: 9780750693141
Number Of Pages: 368

Share This Book:


RRP $992.99
or 4 easy payments of $171.81 with Learn more
Ships in 7 to 10 business days

Earn 1375 Qantas Points
on this Book

Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective.
The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems.
Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors.
Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science.
Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems.

Overview of materials for electronic packaging
Solderability fundamentals: role of microscopic processes
Determining the damaging strains which cause failure in lead tin solders
Fluxless soldering for microelectronic applications, The effect of microstructure on the bonding of metal/ceramic interfaces
The future of advanced composite electronic packaging
Low thermal expansion composite materials for electronic packaging
Electrically conducting polymer-matrix composites
Thick-film technology
Electroless copper for micropackaging and ultra large scale integrated circuit applications
Vacuum metallization for integrated circuit packages
Electrically conducting polymers and organic materials
Diamond films
Measurements of properties of materials in electronic packaging
Table of Contents provided by Publisher. All Rights Reserved.

ISBN: 9780750693141
ISBN-10: 0750693142
Audience: Professional
Format: Hardcover
Language: English
Number Of Pages: 368
Published: 19th April 1995
Country of Publication: GB
Dimensions (cm): 24.31 x 16.36  x 2.36
Weight (kg): 0.74

Earn 1375 Qantas Points
on this Book