Get Free Shipping on orders over $79
Materials for Advanced Packaging - Daniel Lu

Materials for Advanced Packaging

By: Daniel Lu (Editor), C. P. Wong (Editor)

Hardcover | 1 December 2008

At a Glance

Hardcover


$279.75

or 4 interest-free payments of $69.94 with

 or 

Ships in 7 to 10 business days

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. It discusses established techniques, as well as emerging technologies such as digital health, bio-medical, and nano-materials/processing, in addition to microelectronic and optoelectronic packaging. The book therefore provides readers with the most up-to-date developments in advanced packaging.

Other Editions and Formats

Paperback

Published: 8th June 2018

More in Electronics Engineering

LEGO : Gadgets (Klutz) - Editors of Klutz

RRP $34.99

$25.75

26%
OFF
The Art of Electronics : 3rd edition improved - Paul Horowitz

RRP $171.95

$123.75

28%
OFF
Agentic AI For Dummies : For Dummies (Computer/Tech) - Pam Baker
Redefining Innovative Practices in the Age of AI - Binkey Srivastava

RRP $336.00

$289.75

14%
OFF
Architecture and AI : Controlling the Hallucination - Mustapha El Moussaoui

RRP $284.00

$246.75

13%
OFF
Deep Learning in Genome Mapping : Computation and Analysis - Soumya Ranjan Nayak
Green Technology and Industry 4.0 for Sustainable Future - Sheila Mahapatra
Metal oxide-based thermoelectric materials : Metal Oxides - Jai Singh
Book of Making 2026 : Projects for Makers and Hackers - The Makers of Raspberry Pi Official magazine
Advances in Sliding Mode Control - Jim Evans
Handbook of Semiconductor Technology - Bill Fraley