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Materials for Advanced Packaging - Daniel Lu

Materials for Advanced Packaging

By: Daniel Lu (Editor), C. P. Wong (Editor)

Hardcover | 1 December 2008

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Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. It discusses established techniques, as well as emerging technologies such as digital health, bio-medical, and nano-materials/processing, in addition to microelectronic and optoelectronic packaging. The book therefore provides readers with the most up-to-date developments in advanced packaging.

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Published: 8th June 2018

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