Manufacturing Technology in the Electronics Industry

Part 1 Introduction to the electronics industry: a history; the electronics market; electronics manufacturing company structure; test engineering and quality assurance. Part 2 Electronic components: component interconnection methods; electronic components; component packaging; cabling; component quality assurance. Part 3 Electronic design: quality and reliability assessment; the product design process; circuit design; integrated circuit design; circuit layout. Part 4 Semiconductor device manufacture: semiconductor materials; clean room requirements; silicon water manufacture; photolithography; layer fabrications processes; bipolar junction transistor fabrication; field effect transistor fabrication; integrated circuit packaging and testing. Part 5 Printed circuit board manufacture: types; substrate materials; substrate manufacture; fabrication procedures; single-sided manufacture; double-sided manufacture; multilayer manufacture. Part 6 Printed circuit board assembly: hand assembly; automatic component insertion; assembly related faults; soldering techniques; solder joint insection and common soldering faults; cleaning; testing and reworking. Part 7 Surface mount component assembly: advantages of surface mount components; surface mount component assembly; adhesive application; solder paste application; component insertion; soldering techniques; mixing surface mount with leaded components; soldering quality; testing; reworking. Part 8 Alternative technologies: hybrid technology; tape automated bonding; silicon on silicon wafer scale integration; application specific integrated circuits; flexible circuits.