Low Dielectric Constant Materials for IC Applications

By: Paul S. Ho (Editor), Jihperng Leu (Editor), Wei William Lee (Editor)

Write A Review

Hardcover | 14 November 2002

At a Glance

Hardcover
336 Pages

Dimensions(cm)
23.5 x 15.88 x 1.27

Hardcover

$249.00

or 4 interest-free payments of $62.25 with

Ships in 7 to 10 business days

Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.

Industry Reviews

From the reviews: Praise for P.S. Ho, J. Leu, and W.W. Lee, Ed's, Low Dielectric Constant Materials for IC Applications Electrical Insulation Magazine "Because this volume contains an excellent overview of the current research and issues with low-k dielectric materials for IC applications along with comprehensive practical information, researches, material scientists, and polymer engineers working in the area of microelectronics will find this book a very valuable addition to their library." "This text addresses the latest advances in low-k materials, thin film characterization, integration into copper interconnection processing, and reliability for microelectronics applications. ! Because this volume contains an excellent overview of the current research and issues with low-k dielectric materials for IC applications along with comprehensive practical information, researchers, material scientists, and polymer engineers working in the area of microelectronics will find this book a very valuable addition to their library." (IEEE Electrical Insulation Magazine, Vol. 20 (2), March/April, 2004) "This book addresses issues on the development, characterization and integration of low dielectric constant (k) materials for advanced on-chip interconnects. ! this book illustrates in a comprehensive way the technological challenges brought by the introduction of low-k materials into semiconductor manufacturing. ! Being intended to researchers and engineers active in the field of semiconductor processing, it can be used as an introductory book ! . Highly appreciated." (Jean - Francois de Marneffe, Physicalia, Vol. 25 (4), 2003)

Shipping

	Standard Shipping	Express Shipping
Metro postcodes:	$9.99	$14.95
Regional postcodes:	$9.99	$14.95
Rural postcodes:	$9.99	$14.95

Orders over $79.00 qualify for free shipping.

How to return your order

At Booktopia, we offer hassle-free returns in accordance with our returns policy. If you wish to return an item, please get in touch with Booktopia Customer Care.

Additional postage charges may be applicable.

Defective items

If there is a problem with any of the items received for your order then the Booktopia Customer Care team is ready to assist you.

For more info please visit our Help Centre.

You Can Find This Book In

Non-Fiction Engineering & Technology Energy Technology & Engineering Electrical Engineering Electronics & Communications Engineering Electronics Engineering Circuits & Components Mechanical Engineering & Materials Materials Science Science Physics Electricity

Medicine Medicine in General

Overview on Low Dielectric Constant Materials for IC Applications	p. 1
Introduction	p. 1
Dielectric Constant and Bonding Characteristics	p. 4
Material Properties and Integration Requirements	p. 8
Characterization of Low-k Dielectrics	p. 11
Porous Low-k Materials	p. 14
Conclusion	p. 18
References	p. 19
Materials Issues and Characterizationof Low-k Dielectric Materials	p. 23
Introduction	p. 23
Thin-Film Material Characterization	p. 26
General Structure-Property Relationships	p. 37
Dielectric Constant	p. 37
Thermal Properties	p. 43
Moisture Uptake	p. 46
Thermomechanical and Thermal Stress Properties	p. 46
Fluorinated Polyimide: Effect of Chemical-Structure Modifications on Film Properties	p. 48
Crosslinked and Thermosetting Materials	p. 51
Parylene Polymers: Effect of Thermal History on Film Properties	p. 56
Future Challenges	p. 64
References	p. 68
Structure and Property Characterization of Low-k Dielectric Porous Thin Films Determined by X-Ray Reflectivity and Small-Angle Neutron Scattering	p. 75
Introduction	p. 75
Two-Phase Methodology	p. 76
Experimental	p. 77
Two-Phase Analysis Using the Debye Model	p. 79
Results and Discussion	p. 80
Three-Phase Methodology	p. 83
Films with Ordered Porous Structure	p. 86
Limits of SANS Characterization Methods	p. 87
Future Developments	p. 88
Contrast Variation SXR	p. 88
Inhomogeneous Wall Composition	p. 89
Conclusion	p. 92
References	p. 92
Vapor Deposition of Low-k Polymeric Dielectrics	p. 95
Introduction	p. 95
Vapor-Phase Deposition and Polymerization on Substrates	p. 97
Parylenes	p. 98
Synthesis Review	p. 99
Properties of Parylene-N	p. 100
Mechanisms and Models of Parylene Polymerization	p. 101
Integration Issues with Parylene-N	p. 106
Synthesis and Properties of Parylene-F	p. 107
Integration Issues with Parylene-F	p. 110
Polynaphthalene and Its Derivatives	p. 111
Experimental System for Polynaphthalene Synthesis	p. 111
Properties of Polynaphthalene and Fluorinated Polynaphthalene	p. 113
Teflon and Its Derivatives	p. 114
Synthesis of Teflon-AF	p. 114
Properties of Teflon-AF	p. 115
Integration Issues with Teflon	p. 115
Vapor-Deposited Polyimides	p. 116
Prospects for Vapor-Depositable Low-k Polymers	p. 117
References	p. 117
Plasma-Enhanced Chemical Vapor Deposition of FSG and a-C:F Low-k Materials	p. 121
Introduction	p. 121
FSG Films	p. 122
Introduction	p. 122
General Characteristics	p. 122
HDP-CVD FSG Film	p. 128
a-C:F Films	p. 144
Introduction	p. 144
Deposition of a-C:F by PE-CVD and Controlling Fluorine Concentration	p. 145
Control of F/C Ratio by Helicon-Wave HDP-CVD	p. 146
Mechanism of the Reduction of the Dielectric Constant of a-C:F	p. 151
Signal-Delay Measurements of CMOS Circuits	p. 156
Conclusion	p. 162
References	p. 163
Porous Organosilicates for On-Chip Applications: Dielectric Generational Extendibility by the Introduction of Porosity	p. 167
Introduction	p. 167
Porous Silica	p. 171
Organosilicates	p. 173
Porogens	p. 175
Porous Organosilicate Matrix Resins	p. 180
Formation of Nanohybrids	p. 183
Porous Organosilicates	p. 186
Characterization of Porous Organosilicates	p. 187
Conclusion	p. 196
References	p. 198
Metal/Polymer Interfacial Interactions	p. 203
Introduction	p. 203
Experimental Methods	p. 204
XPS and AES Analysis	p. 205
XPS for Nucleation Modes	p. 206
Other Surface-Science Techniques	p. 207
Metal-Deposition Techniques	p. 207
Metallization of Fluoropolymers	p. 209
Metal Evaporation	p. 209
Sputter Deposition	p. 210
Aluminum MOCVD	p. 210
Copper MOCVD	p. 213
Polymers on Metals: Adhesion to Cu	p. 216
Introduction to SiC films	p. 216
Vinyl Silane-Derived Films on Cu	p. 217
Conclusion	p. 218
References	p. 219
Diffusion of Metals in Polymers and During Metal/Polymer Interface Formation	p. 221
Introduction	p. 221
Thermodynamic Considerations	p. 223
Effect of Metal-Polymer Interaction on the Mobility of Metal Atoms	p. 227
Surface Diffusion, Nucleation, and Growth of Metal Films	p. 229
Diffusion and Aggregation	p. 235
Atomic Diffusion	p. 241
Conclusion	p. 247
References	p. 248
Plasma Etching of Low Dielectric Constant Materials	p. 253
Introduction	p. 253
Technological Requirements and Patterning Approaches	p. 255
Damascene Processing	p. 255
Plasma Etching	p. 257
Important Low Dielectric Constant Materials	p. 258
Fluorocarbon-Based Etching Processes	p. 260
Fluorine-Doped SiO₂ (SiOF), Hydrogen Silsequioxane (HSQ) and Methyl Silsequioxane (MSQ)	p. 260
Porous Silica Films	p. 263
Directional Etching of Organic Low-k Materials	p. 265
Hydrocarbon-Based Organic Materials: Etching of Olyarylene Ether (PAE-2) in Ar/O₂/N₂ Gas Mixtures	p. 268
Fluorocarbon-Based Organic Materials: Polytetrafluoroethylene	p. 269
Hybrid Materials	p. 271
Postetch Mask-Stripping and Via-Cleaning Processes	p. 271
Conclusion	p. 274
References	p. 275
Integration of SiLK Semiconductor Dielectric	p. 277
Introduction	p. 277
SiLK Semiconductor Dielectric	p. 278
Subtractive Technologies	p. 279
Introduction	p. 279
Integration Flow for Subtractive Interconnects	p. 281
Integration Unit Steps	p. 282
Electrical Results	p. 288
Conclusion	p. 288
Damascene Technologies	p. 290
Introduction	p. 290
Embedded-Hardmask Approach for Dual Damascene	p. 290
Dual Damascene Schemes with Multilayered Hardmasks	p. 297
Cost-of-Ownership	p. 301
Conclusion	p. 302
References	p. 303
Index	p. 305
Table of Contents provided by Publisher. All Rights Reserved.

Low Dielectric Constant Materials for IC Applications

At a Glance

Hardcover

Industry Reviews

Shipping

How to return your order

Defective items

You Can Find This Book In

More in Circuits & Components

Book of Making 2026

Projects for Makers and Hackers

Open Circuits

The Inner Beauty of Electronic Components

Circuits and Systems

A Modern Approach

Recent Advances in Compact Antennas

Encyclopedia of Electronic Components

Resistors, Capacitors, Inductors, Semiconductors, Electromagnetism

Make : Analog Synthesizers

A modern approach to old-school sound synthesis

Applied Embedded Electronics

Design Essentials for Robust Systems

Learning the Art of Electronics

A Hands-On Lab Course

Encyclopedia of Electronic Components V3

Make: Electronic Music from Scratch

A Beginner's Guide to Homegrown Audio Gizmos

Make: More Electronics

Journey Deep into the World of Logic Chips, Amplifiers, Sensors, and Randomicity

Introductory Circuit Analysis, Global Edition

14th Edition

Practical Electronics for Inventors

Electronics

Make: Electronics, 3e

Learning by Discovery: A hands-on primer for the new electronics enthusiast

Easy Electronics

Make: Handbook

Learn Electronics with Arduino

An Illustrated Beginner's Guide to Physical Computing

Smart Grids

Sustainable Energy Systems

Robert Lacoste's The Darker Side

Practical Applications for Electronic Design Concepts from Circuit Cellar

Intelligent and Sustainable Systems

AI, Green IoT, and Adaptive Automation in Electrical and Communication Technologies

Transformative applied research

Breakthrough research in a changing world

Silicon Nanowire Optical Waveguide Sensors

Design and Analysis

Electricity for the Entertainment Electrician and Technician

Electricity, Power Distribution, and Electrical Safety for the Stage and Set

Electricity for the Entertainment Electrician and Technician

Electricity, Power Distribution, and Electrical Safety for the Stage and Set

Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology

Volume 2

This product is categorised by