Low Dielectric Constant Materials for IC Applications

From the reviews: Praise for P.S. Ho, J. Leu, and W.W. Lee, Ed's, Low Dielectric Constant Materials for IC Applications Electrical Insulation Magazine "Because this volume contains an excellent overview of the current research and issues with low-k dielectric materials for IC applications along with comprehensive practical information, researches, material scientists, and polymer engineers working in the area of microelectronics will find this book a very valuable addition to their library." "This text addresses the latest advances in low-k materials, thin film characterization, integration into copper interconnection processing, and reliability for microelectronics applications. ! Because this volume contains an excellent overview of the current research and issues with low-k dielectric materials for IC applications along with comprehensive practical information, researchers, material scientists, and polymer engineers working in the area of microelectronics will find this book a very valuable addition to their library." (IEEE Electrical Insulation Magazine, Vol. 20 (2), March/April, 2004) "This book addresses issues on the development, characterization and integration of low dielectric constant (k) materials for advanced on-chip interconnects. ! this book illustrates in a comprehensive way the technological challenges brought by the introduction of low-k materials into semiconductor manufacturing. ! Being intended to researchers and engineers active in the field of semiconductor processing, it can be used as an introductory book ! . Highly appreciated." (Jean - Francois de Marneffe, Physicalia, Vol. 25 (4), 2003)