Lead-Free Soldering

By: Jasbir Bath (Editor)

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Hardcover | 5 July 2007

At a Glance

Hardcover
316 Pages

Dimensions(cm)
23.5 x 16.51 x 2.54

Hardcover

$169.00

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The past few years have seen major developments in soldering materials and processes for electronics assembly manufacture due to the movement from tin-lead to lead-free soldering. The removal of lead from electronics solders due to environmental considerations first developed with proposed US legislation in the early 1990s. At that time, the alternatives had not been fully explored, so a ban on the use of lead in electronic solders was put on hold. However the seed was sown for development with various projects initiated during the 1990s in Europe, the Americas, and Asia. Based on government pressures, Japan OEMs began to move to lead-free solder products from 1998 and this, combined with the European Union ROHS (Restriction of Hazardous Substances) legislation enacted in 2006, drove the global manufacture of electronics consumer products with le- free solders. From 1998 to the present, the development of lead-free solder materials and processes has progressed to such an extent that development work moving forward will typically only concentrate on lead-free solders and components rather than tin-lead solders and components. This book aims to give the latest information on development of the lead-free soldering materials and processes and identify where more work is needed. The chapters of the book describe legislation, alloys, reflow, wave, rework, reliability, backward and forward process compatibility, PCB surface finishes and PCB laminates, and standards affecting the general lead-free soldering arena.

Industry Reviews

From the reviews:

"Jasber Bath has gathered together a good mixture of industry and academic authors to cover each step in the path to RoHS compliance. ... it is fairly obvious that the main focus on the book is manufacturing and the impact of lead-free technology. It is fairly easy to read so very suitable for engineers and non technical staff to get a balanced overview or the real hands on story." (Bob Willis, Electronics Production World, August, 2007)

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You Can Find This Book In

Non-Fiction Engineering & Technology Mechanical Engineering & Materials Materials Science Energy Technology & Engineering Electrical Engineering Other Technologies & Applied Sciences Applied Optics Industrial Chemistry & Manufacturing Technologies Metals Technology & Metallurgy Electronics & Communications Engineering Electronics Engineering

Circuits & Components Law Laws of Specific Jurisdictions Environment Environment Law Environmental Science

Preface	p. v
List of Authors	p. xi
Introduction	p. 1
Lead Restrictions and Other Regulatory Influences on the Electronics Industry	p. 5
Introduction	p. 5
A Regulatory Tour of Europe	p. 6
A Regulatory Tour of Asia	p. 14
Regulatory Tour of the Americas	p. 16
Business Impacts and Conclusions	p. 17
Fundamental Properties of Pb-Free Solder Alloys	p. 21
Search for a Pb-Free Alternative to Sn-Pb Eutectic	p. 21
Primary Alloy Design Criteria	p. 21
Solder Alloy Solidification and Microstructural Development	p. 25
Melting Behavior	p. 25
Solidification Behavior	p. 44
Wetting and Solderability	p. 58
Pb-Free Solder Mechanical Behavior and Solder Joint Reliability	p. 62
Lead-Free Surface Mount Assembly	p. 75
Introduction	p. 75
Solder Paste Alloy	p. 75
Screen Printing Process	p. 76
Component Placement	p. 77
Reflow Soldering	p. 78
Solder Joint Inspection and Acceptance Criteria	p. 82
Lead-Free Wave Soldering	p. 91
Introduction	p. 91
Lead-Free Wave Solder Alloy Alternatives	p. 92
Wave Solder Equipment Recommendations	p. 94
Process Recommendations	p. 98
Solder Joint Characterization	p. 102
Design Considerations	p. 110
Lead-Free Rework	p. 117
Introduction	p. 117
Lead-Free Hand Soldering SMT Rework	p. 117
Lead-Free SMT Rework of BGA/CSP Soldered Joints	p. 124
Lead-Free Pin-Through-Hole (PTH) Hand Solder Rework	p. 135
Lead-Free Pin-Through-Hole Mini-Pot Rework Soldering	p. 138
Lead-Free Solder Joint Reliability	p. 145
Introduction	p. 145
General Trends	p. 146
SAC Solder Joint Reliability Case Study	p. 153
Backward and Forward Compatibility	p. 173
Introduction	p. 173
Reliability of BGA/CSP Backward Compatibility	p. 177
Estimation of Mixed Composition Liquidus Temperature	p. 182
Chip Component and Lead-Frame-Component Backward Compatibility	p. 187
Forward Compatibility	p. 190
Press Fit Connector Interconnections	p. 192
PCB Laminates	p. 199
Introduction	p. 199
Types of Stress in Printed Wiring Boards	p. 200
Laminate Material Test Methods	p. 202
Accelerated Thermal Stress Testing	p. 206
Accelerated Thermal Stress Test Methods	p. 209
HATS Test Methods - A Case Study	p. 212
Lead-Free Board Surface Finishes	p. 221
Introduction	p. 221
Process Overview	p. 222
Lead-Free Soldering Standards	p. 271
Introduction	p. 271
IPC and JEDEC Standards	p. 271
IEC Standards	p. 279
Japan (JEITA) Standards	p. 280
Other Standards	p. 281
Conclusions	p. 285
Index	p. 291
Table of Contents provided by Publisher. All Rights Reserved.

Lead-Free Soldering

At a Glance

Hardcover

Industry Reviews

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How to return your order

Defective items

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