| Preface | p. xiii |
| Fabrication | |
| Introduction | p. 3 |
| What are MEMS? | p. 3 |
| Why MEMS? | p. 4 |
| Low cost, redundancy and disposability | p. 4 |
| Favorable scalings | p. 5 |
| How are MEMS made? | p. 8 |
| Roadmap and perspective | p. 12 |
| Essay: The Role of Surface to Volume Atoms as Magnetic Devices Miniaturize | p. 12 |
| The substrate and adding material to it | p. 17 |
| Introduction | p. 17 |
| The silicon substrate | p. 17 |
| Silicon growth | p. 17 |
| It's a crystal | p. 19 |
| Miller indices | p. 20 |
| It's a semiconductor | p. 24 |
| Additive technique: Oxidation | p. 35 |
| Growing an oxide layer | p. 35 |
| Oxidation kinetics | p. 37 |
| Additive technique: Physical vapor deposition | p. 40 |
| Vacuum fundamentals | p. 41 |
| Thermal evaporation | p. 46 |
| Sputtering | p. 51 |
| Other additive techniques | p. 57 |
| Chemical vapor deposition | p. 57 |
| Electrodeposition | p. 58 |
| Spin casting | p. 58 |
| Wafer bonding | p. 58 |
| Essay: Silicon Ingot Manufacturing | p. 59 |
| Creating and transferring patterns-Photolithography | p. 65 |
| Introduction | p. 65 |
| Keeping it clean | p. 66 |
| Photoresist | p. 69 |
| Positive resist | p. 69 |
| Negative resist | p. 70 |
| Working with resist | p. 71 |
| Applying photoresist | p. 71 |
| Exposure and pattern transfer | p. 72 |
| Development and post-treatment | p. 77 |
| Masks | p. 79 |
| Resolution | p. 81 |
| Resolution in contact and proximity printing | p. 81 |
| Resolution in projection printing | p. 82 |
| Sensitivity and resist profiles | p. 84 |
| Modeling of resist profiles | p. 86 |
| Photolithography resolution enhancement technology | p. 87 |
| Mask alignment | p. 88 |
| Permanent resists | p. 89 |
| Essay: Photolithography-Past, Present and Future | p. 90 |
| Creating structures-Micromachining | p. 95 |
| Introduction | p. 95 |
| Bulk micromachining processes | p. 96 |
| Wet chemical etching | p. 96 |
| Dry etching | p. 106 |
| Surface micromachining | p. 108 |
| Surface micromachining processes | p. 109 |
| Problems with surface micromachining | p. 111 |
| Lift-off | p. 112 |
| Process integration | p. 113 |
| A surface micromachining example | p. 115 |
| Designing a good MEMS process flow | p. 119 |
| Last thoughts | p. 124 |
| Essay: Introduction to MEMS Packaging | p. 126 |
| Solid mechanics | p. 131 |
| Introduction | p. 131 |
| Fundamentals of solid mechanics | p. 131 |
| Stress | p. 132 |
| Strain | p. 133 |
| Elasticity | p. 135 |
| Special cases | p. 138 |
| Non-isotropic materials | p. 139 |
| Thermal strain | p. 141 |
| Properties of thin films | p. 142 |
| Adhesion | p. 142 |
| Stress in thin films | p. 142 |
| Peel forces | p. 149 |
| Applications | |
| Thinking about modeling | p. 157 |
| What is modeling? | p. 157 |
| Units | p. 158 |
| The input-output concept | p. 159 |
| Physical variables and notation | p. 162 |
| Preface to the modeling chapters | p. 163 |
| MEMS transducers-An overview of how they work | p. 167 |
| What is a transducer? | p. 167 |
| Distinguishing between sensors and actuators | p. 168 |
| Response characteristics of transducers | p. 171 |
| Static response characteristics | p. 172 |
| Dynamic performance characteristics | p. 173 |
| MEMS sensors: principles of operation | p. 178 |
| Resistive sensing | p. 178 |
| Capacitive sensing | p. 181 |
| Piezoelectric sensing | p. 182 |
| Resonant sensing | p. 184 |
| Thermoelectric sensing | p. 186 |
| Magnetic sensing | p. 189 |
| MEMS actuators: principles of operation | p. 193 |
| Capacitive actuation | p. 193 |
| Piezoelectric actuation | p. 194 |
| Thermo-mechanical actuation | p. 196 |
| Thermo-electric cooling | p. 201 |
| Magnetic actuation | p. 202 |
| Signal conditioning | p. 204 |
| A quick look at two applications | p. 206 |
| RF applications | p. 207 |
| Optical applications | p. 207 |
| Piezoresistive transducers | p. 211 |
| Introduction | p. 211 |
| Modeling piezoresistive transducers | p. 212 |
| Bridge analysis | p. 213 |
| Relating electrical resistance to mechanical strain | p. 215 |
| Device case study: Piezoresistive pressure sensor | p. 221 |
| Capacitive transducers | p. 231 |
| Introduction | p. 231 |
| Capacitor fundamentals | p. 232 |
| Fixed-capacitance capacitor | p. 232 |
| Variable-capacitance capacitor | p. 234 |
| An overview of capacitive sensors and actuators | p. 236 |
| Modeling a capacitive sensor | p. 239 |
| Capacitive half-bridge | p. 239 |
| Conditioning the signal from the half-bridge | p. 243 |
| Mechanical subsystem | p. 246 |
| Device case study: Capacitive accelerometer | p. 250 |
| Piezoelectric transducers | p. 255 |
| Introduction | p. 255 |
| Modeling piezoelectric materials | p. 256 |
| Mechanical modeling of beams and plates | p. 261 |
| Distributed parameter modeling | p. 261 |
| Statics | p. 262 |
| Bending in beams | p. 268 |
| Bending in plates | p. 274 |
| Case study: Cantilever piezoelectric actuator | p. 276 |
| Thermal transducers | p. 283 |
| Introduction | p. 283 |
| Basic heat transfer | p. 284 |
| Conduction | p. 286 |
| Convection | p. 288 |
| Radiation | p. 289 |
| Case study: Hot-arm actuator | p. 294 |
| Lumped element model | p. 295 |
| Distributed parameter model | p. 300 |
| FEA model | p. 306 |
| Essay: Effect of Scale on Thermal Properties | p. 310 |
| Introduction to microfluidics | p. 317 |
| Introduction | p. 317 |
| Basics of fluid mechanics | p. 319 |
| Viscosity and flow regimes | p. 320 |
| Entrance lengths | p. 324 |
| Basic equations of fluid mechanics | p. 325 |
| Conservation of mass | p. 325 |
| Conservation of linear momentum | p. 326 |
| Conservation equations at a point: Continuity and Navier-Stokes equations | p. 329 |
| Some solutions to the Navier-Stokes equations | p. 337 |
| Couette flow | p. 337 |
| Poiseuille flow | p. 339 |
| Electro-osmotic flow | p. 339 |
| Electrostatics | p. 340 |
| Ionic double layers | p. 346 |
| Navier-Stokes with a constant electric field | p. 355 |
| Electrophoretic separation | p. 357 |
| Essay: Detection Schemes Employed in Microfluidic Devices for Chemical Analysis | p. 362 |
| Microfabrication laboratories | |
| Microfabrication laboratories | p. 371 |
| Hot-arm actuator as a hands-on case study | p. 371 |
| Overview of fabrication of hot-arm actuators | p. 372 |
| Cleanroom safety and etiquette | p. 375 |
| Experiments | p. 377 |
| Wet oxidation of a silicon wafer | p. 377 |
| Photolithography of sacrificial layer | p. 384 |
| Depositing metal contacts with evaporation | p. 388 |
| Wet chemical etching of aluminum | p. 392 |
| Plasma ash release | p. 395 |
| Characterization of hot-arm actuators | p. 397 |
| Notation | p. 405 |
| Periodic table of the elements | p. 411 |
| The complimentary error function | p. 413 |
| Color chart for thermally grown silicon dioxide | p. 415 |
| Glossary | p. 417 |
| Subject Index | p. 439 |
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