Integrated Circuit Quality and Reliability

By: Eugene R. Hnatek

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Hardcover | 1 December 1994 | Edition Number 2

At a Glance

Hardcover
808 Pages

Edition Type
New edition

Dimensions(cm)
22.9 x 15.2 x 4.2

Hardcover

RRP $389.00

$330.65

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Examines all important aspects of integrated circuit design, fabrication, assembly and test processes as they relate to quality and reliability. This second edition discusses in detail: the latest circuit design technology trends; the sources of error in wafer fabrication and assembly; avenues of contamination; new IC packaging methods; new in-line process monitors and test structures; and more.;This work should be useful to electrical and electronics, quality and reliability, and industrial engineers; computer scientists; integrated circuit manufacturers; and upper-level undergraduate, graduate and continuing-education students in these disciplines.

Industry Reviews

"The new edition brings the baseline IC technology and tool set up to date. . ..it covers all the material in more depth than the first edition. . .. . . .a good tutorial on IC fabrication and packaging, including quality concerns. . .. Excellent chapters on design, fabrication, packaging, and test put today's engineer in a good position to understand the impact of contamination and manufacturing errors on their IC products." ---IEEE Components, Packaging, and Manufacturing Technology Society Newsletter

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