Handbook of Thin Film Deposition, Third Edition

By: Krishna Seshan

Write A Review

Hardcover | 27 June 2012 | Edition Number 3

At a Glance

Hardcover
408 Pages

Edition Type
Revised

Dimensions(cm)
24.13 x 15.88 x 2.54

New Edition

Published: 27th February 2018

Hardcover

RRP $310.95

$277.75

11%OFF

or 4 interest-free payments of $69.44 with

Ships in 5 to 7 business days

New second edition of the popular book on deposition (first edition by Klaus Schruegraf) for engineers, technicians, and plant personnel in the semiconductor and related industries. This book traces the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition techniques and the development of highly specialized equipment to enable this deposition. The book includes much cutting-edge material. Entirely new chapters on contamination and contamination control describe the basics and the issues—as feature sizes shrink to sub-micron dimensions, cleanliness and particle elimination has to keep pace. A new chapter on metrology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together all the physical vapor deposition techniques.

Two entirely new areas receive full treatment: chemical mechanical polishing which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.

A practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance and applications.

Covers core processes and applications in the semiconductor industry and new developments in the photovoltaic and optical thin film industries.

The new edition takes covers the transition taking place in the semiconductor world from Al/SiO₂ to copper interconnects with low-k dielectrics.

Written by acknowledged industry experts from key companies in the semiconductor industry including Intel and IBM.

Foreword by Gordon E. Moore, co-founder of Intel and formulator of the renowned 'Moore's Law' relating to the technology development cycle in the semiconductor industry.

Shipping

	Standard Shipping	Express Shipping
Metro postcodes:	$9.99	$14.95
Regional postcodes:	$9.99	$14.95
Rural postcodes:	$9.99	$14.95

Orders over $79.00 qualify for free shipping.

How to return your order

At Booktopia, we offer hassle-free returns in accordance with our returns policy. If you wish to return an item, please get in touch with Booktopia Customer Care.

Additional postage charges may be applicable.

Defective items

If there is a problem with any of the items received for your order then the Booktopia Customer Care team is ready to assist you.

For more info please visit our Help Centre.

You Can Find This Book In

Non-Fiction Engineering & Technology Industrial Chemistry & Manufacturing Technologies Metals Technology & Metallurgy Mechanical Engineering & Materials Materials Science Electronics & Communications Engineering Electronics Engineering Electronic Devices & Materials Semi-Conductors & Super-Conductors Science Physics

Foreword to the Third Edition
Scaling of Devices and Thermal Scaling
PVD - Special Topics
CVD New Developments
CVD Equipment
CMP Method and Practice
Process Technology for Copper Interconnects
Optical Thin Films
Thin Films in Photovoltaics
Thin Films in Memory Applications
Index
Table of Contents provided by Publisher. All Rights Reserved.

Handbook of Thin Film Deposition, Third Edition

At a Glance

New Edition

Hardcover

Shipping

How to return your order

Defective items

You Can Find This Book In

More in Metals Technology & Metallurgy

Steels and High Entropy Alloys

Advances and Applications

Austenitic Stainless Steels

Structure and Properties

Austenitic Stainless Steels

Structure and Properties

Austenitic Stainless Steels

Structure and Properties

Austenitic Stainless Steels

Structure and Properties

Circular Steel Production

Pathways to Net-Zero Carbon Emissions

Wills' Mineral Processing Technology

An Introduction to the Practical Aspects of Ore Treatment and Mineral Recovery

Microbiologically Influenced Corrosion

A Comprehensive Guide to Principles, Assessment and Mitigation

Additive Manufacturing

Advances in Composites, Functionally Graded Materials, and Topologically Optimized Structures

Handbook of Perovskites

Chemistry, Synthesis, and Applications

Handbook of Metal Alloy Catalysts

Application in Energy, Chemical, and Environment

Surface Modifications of Titanium and Its Alloys for Biomedical Applications

Industrial Composites, Optimization Methods, and Tribological Considerations

Manufacturing Design and Technology

East Germanic Ironmaking in the Roman Period

Archaeometry of Slag and Ore Finds in the Przeworsk Culture

Still the Iron Age

Iron and Steel in the Modern World

Advanced Modeling Methods for Pitting Corrosion in Metals

Aerospace Materials

Novel Technologies and Practical Applications

Trutmezzer

A Blade of Two Ways

Powder Metallurgy

Characterization, Processing, and Optimization Techniques

High-entropy Alloy Nanostructures

Faraday Discussion 264

Cyanoximes

Chemistry, coordination and organometallic compounds and their applications

Chemistry and Applications of Metal-organic Framework (MOFs)

Advances in Terrestrial and Extraterrestrial Drilling:

Ground, Ice, and Underwater

Advances in Corrosion Control of Magnesium and its Alloys

Metal Matrix Composites and Protective Coatings

This product is categorised by