Foldable Flex and Thinned Silicon Multichip Packaging Technology

By: John W. Balde (Editor)

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Hardcover | 31 January 2003

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Hardcover
376 Pages

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24.13 x 15.88 x 2.54

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This text presents methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means. Much of the work in this field has not been widely disseminated other than by papers presented at conferences and workshops. This text is organized to report on the developments in this technology, but with special additional material and emphasis. The intent is to do more than report on present state of the art. It is intended as an advocacy book, pointing out the reasons for 3-D assemblies, the reasons for Silicon-in-a-Package multichip modules, and the commercial availability of the techniques. The contributing authors explore the needs, reveal the state of development and production, and point to changes in technology that can bring this technology into wider use for more complex applications.

Industry Reviews

"If you are responsible for deciding on the next generation of packaging that will be used for your company's application or are steering university research and want to find high impact focus, this book is a must read....By placing all this information between two covers and having the various perspectives of the many authors clash and add to each other (and providing access to the authors), the reader is placed in a knowledgeable position from which to make their own technology investment decisions in this 3D world."
(David W Palmer, Manager Microsystems Applications, Sandia National Laboratories)

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Contributor List	p. vii
About IMAPS	p. xi
Introduction	p. xiii
3-D Assemblies of Stacked Chips and other Thin Packages	p. 1
Multi-Chip Carriers in a System-on-a-Chip World	p. 15
Packaging Technologies for Flexible Systems	p. 49
Low Profile and Flexible Electronic Assemblies Using Ultra-Thin Silicon - The European Flex-Si Project	p. 69
Thin Chips for Flexible and 3-D Integrated Electronic Systems	p. 101
Flexible Microarray Interconnection Techniques Applied to Biomedical Microdevices	p. 149
Folded Flex and other Structures for System-in-a Package	p. 177
Valtronic CSP3D Technology	p. 217
3-D Packaging Technologies: Are Flex based Solutions the Answer?	p. 235
Availability of High Density Interconnect Flexible Circuits	p. 247
Recent Advances in Flexible Circuit Technology Using Liquid Crystal Polymer Substrates	p. 257
Flex and the Interconnected Mesh Power System (IMPS)	p. 289
Thermal Management and Control of Electromagnetic Emissions	p. 311
Conclusions	p. 327
Authors' Biographies	p. 329
Index	p. 339
Table of Contents provided by Ingram. All Rights Reserved.

Foldable Flex and Thinned Silicon Multichip Packaging Technology

At a Glance

Hardcover

Industry Reviews

Shipping

How to return your order

Defective items

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Paperback

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