
Flexible Electronics
Materials and Applications
By: William S. Wong (Editor), Alberto Salleo (Editor)
Hardcover | 26 May 2009
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484 Pages
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Flexible-electronics is rapidly finding many main-stream applications where low-cost, ruggedness, light weight, unconventional form factors and ease of manufacturability are just some of the important advantages over their conventional rigid-substrate counterparts. Flexible Electronics: Materials and Applications surveys the materials systems and processes that are used to fabricate devices that can be employed in a wide variety of applications, including flexible flat-panel displays, medical image sensors, photovoltaics, and electronic paper. Materials discussed range from polymeric semiconductors to nanotube transparent conductors, highlighting the important characteristics of each system and their target applications. An overview of the performance benchmarks for the different materials is given in order to allow a direct comparison of these different technologies. Furthermore, the devices and processes most suitable for given applications in flexible electronics are identified.
Topics covered include:
- An overview and history of flexible electronics
- Novel materials for solution-processable thin-film electronic devices and their properties
- Low-temperature processing of conventional materials and devices on plastic foils
- Novel techniques, such as printing and roll-to-roll processing, for large-area flexible electronics manufacturing
- Materials and device physics relevant to flexible electronics
- Device integration on flexible substrates
- Mechanical and electronic characteristics for thin-film transistors and nano-scale transparent conductors on flexible platforms
- Applications towards flexible displays, sensors, actuators, solar energy, radio-frequency identification, and micro-electro-mechanical systems
Written by leading researchers in the field, Flexible Electronics: Materials and Applications serves as a reference for researchers, engineers, and students interested in the characteristics, capabilities, and limitations of these exciting materials and emerging applications.
| Overview of Flexible Electronics Technology | p. 1 |
| History of Flexible Electronics | p. 1 |
| Materials for Flexible Electronics | p. 3 |
| Degrees of Flexibility | p. 3 |
| Substrates | p. 5 |
| Backplane Electronics | p. 8 |
| Frontplane Technologies | p. 12 |
| Encapsulation | p. 16 |
| Fabrication Technology for Flexible Electronics | p. 18 |
| Fabrication on Sheets by Batch Processing | p. 18 |
| Fabrication on Web by Roll-to-Roll Processing | p. 19 |
| Additive Printing | p. 20 |
| Outlook | p. 20 |
| References | p. 20 |
| Mechanical Theory of the Film-on-Substrate-Foil Structure: Curvature and Overlay Alignment in Amorphous Silicon Thin-Film Devices Fabricated on Free-Standing Foil Substrates | p. 29 |
| Introduction | p. 29 |
| Theory | p. 32 |
| The Built-in Strain | p. 35 |
| Applications | p. 36 |
| Strain in the Substrate, and the Film, at the Deposition Temperature | p. 36 |
| Strain in the Substrate, and the Film, at Room Temperature | p. 38 |
| Radius of Curvature R of the Workpiece | p. 42 |
| Strain of the Substrate and the Curvature of the Workpiece for a Three-Layer Structure | p. 46 |
| Experimental Results for a-Si:H TFTs Fabricated on Kapton | p. 47 |
| Conclusions | p. 50 |
| References | p. 50 |
| Low-temperature Amorphous and Nanocrystalline Silicon Materials and Thin-film Transistors | p. 53 |
| Introduction | p. 53 |
| Low-temperature Amorphous and Nanocrystalline Silicon Materials | p. 55 |
| Fundamental Issues for Low-temperature Processing | p. 55 |
| Low-temperature Amorphous Silicon | p. 56 |
| Low-temperature Nanocrystalline Silicon | p. 56 |
| Low-temperature Dielectrics | p. 57 |
| Characteristics of Low-temperature Dielectric Thin-film Deposition | p. 57 |
| Low-temperature Silicon Nitride Characteristics | p. 57 |
| Low-temperature Silicon Oxide Characteristics | p. 58 |
| Low-temperature Thin-film Transistor Devices | p. 59 |
| Device Structures and Materials Processing | p. 60 |
| Low-temperature a-Si:H Thin-Film Transistor Device Performance | p. 61 |
| Contacts to a-Si:H Thin-film Transistors | p. 62 |
| Low-temperature Doped nc-Si Contacts | p. 64 |
| Low-temperature nc-Si TFTs | p. 66 |
| Device Stability | p. 67 |
| Conclusions and Future Prospective | p. 70 |
| References | p. 70 |
| Amorphous Silicon: Flexible Backplane and Display Application | p. 75 |
| Introduction | p. 75 |
| Enabling Technologies for Flexible Backplanes and Displays | p. 76 |
| Flexible Substrate Technologies | p. 76 |
| TFT Technologies for Flexible Backplanes | p. 82 |
| Display Media for Flexible Displays (LCD, Reflective-EP, OLED) | p. 89 |
| Barrier Layers | p. 90 |
| Flexible Active Matrix Backplane Requirements for OLED Displays | p. 91 |
| Active Matrix Addressing | p. 92 |
| Flexible AMOLED Displays Using a-Si TFT Backplanes | p. 95 |
| Backplane Fabrication Using PEN Plastic Substrates | p. 95 |
| Flexible OLED Display Fabrication | p. 98 |
| Flexible AMOLED Display Fabrication with Thin-film Encapsulation | p. 100 |
| Flexible Electrophoretic Displays Fabricated using a-Si TFT Backplanes | p. 102 |
| Outlook for Low-Temperature a-Si TFT for Flexible Electronics Manufacturing | p. 102 |
| References | p. 105 |
| Flexible Transition Metal Oxide Electronics and Imprint Lithography | p. 107 |
| Introduction | p. 107 |
| Previous Work | p. 108 |
| Properties of Transistor Materials | p. 113 |
| Semiconductors | p. 113 |
| Dielectrics | p. 115 |
| Contact Materials | p. 116 |
| Device Structures | p. 117 |
| Fabrication on Flexible Substrates | p. 119 |
| Imprint Lithography | p. 120 |
| Self-Aligned Imprint Lithography | p. 122 |
| SAIL Transistor Results | p. 126 |
| Summary of Imprint Lithography | p. 127 |
| Flexible TMO Device Results | p. 128 |
| Future Problems and Areas of Research | p. 133 |
| Carrier Density Control | p. 134 |
| Low-Temperature Dielectrics | p. 135 |
| Etching of TMO Materials | p. 135 |
| P-type TMO | p. 136 |
| Stability | p. 136 |
| Flexure and Adhesion of TMO | p. 137 |
| Flexible Fabrication Method Yields | p. 137 |
| Summary | p. 138 |
| References | p. 139 |
| Materials and Novel Patterning Methods for Flexible Electronics | p. 143 |
| Introduction | p. 143 |
| Materials Considerations for Flexible Electronics | p. 145 |
| Overview | p. 145 |
| Inorganic Semiconductors and Dielectrics | p. 145 |
| Organic Semiconductors and Dielectrics | p. 146 |
| Conductors | p. 149 |
| Print-Processing Options for Device Fabrication | p. 150 |
| Overview | p. 150 |
| Control of Feature Sizes of Jet-Printed Liquids | p. 151 |
| Jet-Printing for Etch-Mask Patterning | p. 153 |
| Methods for Minimizing Feature Size | p. 154 |
| Printing Active Materials | p. 156 |
| Performance and Characterization of Electronic Devices | p. 157 |
| Overview | p. 157 |
| Bias Stress in Organic Thin-Film Transistors | p. 158 |
| Nonideal Scaling of Short-Channel Organic TFTs | p. 163 |
| Low-Temperature a-Si:H TFT Device Stability | p. 165 |
| Low-temperature a-Si:H p-i-n Devices | p. 167 |
| Printed Flexible Electronics | p. 170 |
| Overview | p. 170 |
| Digital Lithography for Flexible Image Sensor Arrays | p. 170 |
| Printed Organic Backplanes | p. 172 |
| Conclusions and Future Prospects | p. 176 |
| References | p. 176 |
| Sheet-Type Sensors and Actuators | p. 183 |
| Introduction | p. 183 |
| Sheet-type Image Scanners | p. 184 |
| Imaging Methods | p. 185 |
| Device Structure and Manufacturing Process | p. 186 |
| Electronic Performance of Organic Photodiodes | p. 190 |
| Organic Transistors | p. 191 |
| Photosensor Cells | p. 193 |
| Issues Related to Device Processes: Pixel Stability and Resolution | p. 195 |
| A Hierarchal Approach for Slow Organic Circuits | p. 196 |
| The Double-Wordline and Double-Bitline Structure | p. 196 |
| A New Dynamic Second-Wordline Decoder | p. 199 |
| Higher Speed Operation with Lower Power Consumption | p. 199 |
| New Applications and Future Prospects | p. 200 |
| Sheet-Type Braille Displays | p. 201 |
| Manufacturing Process | p. 201 |
| Electronic Performance of Braille Cells | p. 204 |
| Organic Transistor-based SRAM | p. 210 |
| Reading Tests | p. 211 |
| Future Prospects | p. 212 |
| Summary | p. 212 |
| References | p. 213 |
| Organic and Polymeric TFTs for Flexible Displays and Circuits | p. 215 |
| Introduction | p. 215 |
| Important Organic TFT Parameters for Electronic Systems | p. 216 |
| Field-Effect Mobility | p. 216 |
| Threshold Voltage | p. 219 |
| Subthreshold Swing | p. 220 |
| Leakage Currents | p. 222 |
| Contact Resistance | p. 222 |
| Capacitances and Frequency Response | p. 223 |
| TFT Nonuniformity | p. 225 |
| Bias-Stress Instability and Hysteresis | p. 225 |
| Active Matrix Displays | p. 227 |
| Introduction | p. 227 |
| Liquid Crystal and Electrophoretic Displays | p. 228 |
| Active Matrix OLED Displays | p. 236 |
| Introduction | p. 236 |
| Using Organic TFTs for Electronic Circuits | p. 242 |
| Thin-Film Transistor Circuits | p. 242 |
| Frequency Limitations of OTFTs | p. 246 |
| Integrated Display Drivers | p. 247 |
| Radio Frequency Identification Tags | p. 248 |
| Conclusion | p. 256 |
| References | p. 256 |
| Semiconducting Polythiophenes for Field-Effect Transistor Devices in Flexible Electronics: Synthesis and Structure Property Relationships | p. 261 |
| Introduction | p. 261 |
| Polymerization of Thiophene Monomers | p. 264 |
| General Considerations | p. 264 |
| Synthetic Routes for the Preparation of Thiophene Polymers | p. 264 |
| Poly(3-Alkylthiophenes) | p. 273 |
| Electrical Properties | p. 275 |
| Thin-film Device Processing and Morphology | p. 276 |
| Doping and Oxidative Stability | p. 277 |
| Polythiophene Structural Analogues | p. 279 |
| Thienothiophene Polymers | p. 286 |
| Poly(Thieno(2,3-b)Thiophenes) | p. 286 |
| Poly(Thieno(3,2-b)Thiophenes) | p. 288 |
| Summary | p. 292 |
| References | p. 293 |
| Solution Cast Films of Carbon Nanotubes for Transparent Conductors and Thin Film Transistors | p. 297 |
| Introduction: Nanoscale Carbon for Electronics, the Value Proposition | p. 297 |
| Carbon NT Film Properties | p. 298 |
| Carbon Nanotubes: The Building Blocks | p. 298 |
| Carbon Nanotube Network as an Electronic Material | p. 298 |
| Electrical and Optical Properties of NT Films | p. 300 |
| Doping and Chemical Functionalization | p. 304 |
| Fabrication Technologies | p. 305 |
| Solubilization | p. 306 |
| Deposition | p. 306 |
| Carbon NT Films as Conducting and Optically Transparent Material | p. 309 |
| Network Properties: Sheet Conductance and Optical Transparency | p. 309 |
| Applications: ITO Replacement | p. 312 |
| Challenges and the Path Forward | p. 312 |
| TFTs with Carbon Nanotube Conducting Channels | p. 313 |
| Device Characteristics | p. 314 |
| Device Parameters | p. 316 |
| Challenges and the Path Forward | p. 323 |
| Conclusions | p. 324 |
| References | p. 325 |
| Physics and Materials Issues of Organic Photovoltaics | p. 329 |
| Introduction | p. 329 |
| Basic Operation | p. 329 |
| Photocurrent | p. 331 |
| Dark Current | p. 331 |
| Organic and Hybrid Solar Cell Architectures | p. 332 |
| Materials | p. 334 |
| Light Absorption | p. 334 |
| Exciton Harvesting | p. 338 |
| Effects of Disorder | p. 340 |
| Extrinsic Defects | p. 344 |
| Measuring Exciton Harvesting | p. 344 |
| Approaches to Overcome Small Diffusion Lengths | p. 347 |
| Exciton Dissociation | p. 349 |
| Dissociating Geminate Pairs | p. 351 |
| Heterojunction Energy Offsets | p. 355 |
| Charge Transport and Recombination | p. 357 |
| Diffusion-Limited Recombination | p. 359 |
| Interface-Limited (Back Transfer Limited) Recombination | p. 360 |
| Measurements Relevant for Extracting Charge | p. 363 |
| Nanostructures | p. 364 |
| Efficiency Limits and Outlook | p. 367 |
| References | p. 368 |
| Bulk Heterojunction Solar Cells for Large-Area PV Fabrication on Flexible Substrates | p. 373 |
| Introduction and Motivation | p. 373 |
| Photovoltaics | p. 373 |
| Technology Overview | p. 374 |
| Motivation for Large-Area, Solution-Processable Photovoltaics | p. 375 |
| The Concept of Bulk Heterojunction Solar Cells | p. 377 |
| Basics of Organic Solar Cell Materials | p. 377 |
| Fundamentals of Photovoltaics | p. 378 |
| Understanding and Optimization of BHJ Composites | p. 385 |
| Challenges for Large-Area Processing | p. 401 |
| Production Scheme | p. 401 |
| Encapsulation of Flexible Solar Cells | p. 404 |
| Conclusions | p. 408 |
| References | p. 409 |
| Substrates and Thin-Film Barrier Technology for Flexible Electronics | p. 413 |
| Introduction | p. 413 |
| Barrier Requirements | p. 414 |
| Generic Requirements | p. 416 |
| Substrate-Specific Requirements | p. 417 |
| Thin-Film Barrier Technology | p. 419 |
| Historical Background | p. 419 |
| Permeation Measurement Techniques | p. 420 |
| Permeation Through Thin-Film Barriers | p. 426 |
| Barrier-Device Integration | p. 437 |
| Substrate and Barrier Compatibility with OLEDs | p. 437 |
| Thin-Film Encapsulation | p. 440 |
| Concluding Remarks | p. 442 |
| References | p. 442 |
| Index | p. 451 |
| Table of Contents provided by Ingram. All Rights Reserved. |
ISBN: 9780387743622
ISBN-10: 0387743626
Series: Electronic Materials: Science & Technology
Published: 26th May 2009
Format: Hardcover
Language: English
Number of Pages: 484
Audience: Professional and Scholarly
Publisher: Springer Nature B.V.
Country of Publication: US
Dimensions (cm): 24.13 x 16.51 x 3.18
Weight (kg): 0.79
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