Engineering Materials and Processes

Physics, Modeling, Fabrication and Measurements

By: Spartak Gevorgian

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Hardcover | 12 June 2009

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416 Pages

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Today's wireless communications and information systems are heavily based on microwave technology. Current trends indicate that in the future along with - crowaves, the millimeter wave and Terahertz technologies will be used to meet the growing bandwidth and overall performance requirements. Moreover, motivated by the needs of the society, new industry sectors are gaining ground; such as wi- less sensor networks, safety and security systems, automotive, medical, envir- mental/food monitoring, radio tags etc. Furthermore, the progress and the pr- lems in the modern society indicate that in the future these systems have to be more user/consumer friendly, i. e. adaptable, reconfigurable and cost effective. The mobile phone is a typical example which today is much more than just a phone; it includes a range of new functionalities such as Internet, GPS, TV, etc. To handle, in a cost effective way, all available and new future standards, the growing n- ber of the channels and bandwidth both the mobile handsets and the associated systems have to be agile (adaptable/reconfigurable). The complex societal needs have initiated considerable activities in the field of cognitive and software defined radios and triggered extensive research in adequate components and technology platforms. To meet the stringent requirements of these systems, especially in ag- ity and cost, new components with enhanced performances and new functionalities are needed. In this sense the components based on ferroelectrics have greater - tential and already are gaining ground.

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Introduction: Overview of Agile Microwave Technologies	p. 1
Introduction	p. 1
Ferroelectrics: The Main Material Properties	p. 2
Ferroelectric Properties	p. 3
Dielectric Properties	p. 4
Acoustic Properties	p. 5
Typical Microwave Paraelectrics	p. 6
Microwave Applications	p. 7
Historical Overview	p. 7
Current Status	p. 8
Potential and Trends	p. 11
Other Agile Microwave Technologies	p. 15
Conclusions	p. 18
References	p. 18
Physics of the Tunable Ferroelectric Devices	p. 21
Introduction	p. 21
Crystal Structure, Non-Polar (Paraelectric) and Polar (Ferroelectric) Phases	p. 22
Dielectric Models of the Ferroelectric and Paraelectric Phases	p. 24
Phenomenological (Thermodynamic) Theory	p. 24
Microscopic Theory	p. 27
Engineering Models of the Dielectric Permittivity	p. 29
Barrett's Formula. Bulk Single Crystals	p. 29
Rupprecht-Bell-Silverman Model. Bulk Single Crystals	p. 30
Vendik's Model. Bulk Single Crystals	p. 31
Granular Ceramics and Composites	p. 32
Columnar Thin Film Ceramics and Composites	p. 34
Models of the Loss Tangent	p. 37
Loss Mechanisms and Early Models of the Loss Tangent	p. 37
Models of the Main Loss Mechanisms	p. 39
Dielectric Nonlinearities	p. 44
Nonlinear Performance of Paraelectrics	p. 44
Nonlinearity and Power Handling Capability	p. 45
Thin Films vs. Bulk	p. 46
Thin Film vs. Bulk Single Crystal	p. 46
Strain	p. 48
The Effects of the Strain on Dielectric Properties of the Thin Films	p. 50
Electro-Acoustic Properties	p. 52
Electrostriction	p. 52
Piezoelectricity and Electrostriction	p. 52
Electric Field Induced Piezoelectricity in Paraelectric Films	p. 54
Bulk Conductivity	p. 56
Conclusions	p. 57
References	p. 57
Fabrication of Ferroelectric Components and Devices	p. 61
Introduction	p. 61
Fabrication of Devices Using Single Crystals	p. 63
Growth Techniques of Single Crystals	p. 63
Structural Characterization	p. 64
Bulk Single Crystal Devices	p. 65
Thin Film Single Crystal Capacitors	p. 66
Fabrication of Devices Using Bulk Ceramics	p. 68
Ceramic Processes	p. 68
Bulk Ceramic Device Fabrication	p. 68
Structure of the Bulk Ferroelectric Ceramics	p. 73
Thick Film, HTCC and LTCC Technologies	p. 74
Fabrication of Devices Using Thick Film Technology	p. 74
Fabrication of HTCC and LTCC Devices	p. 76
Structure of Thick and HTCC/LTCC Films	p. 78
Fabrication of Thin Ferroelectric Films	p. 80
Chemical Deposition Methods	p. 81
Physical Deposition Methods	p. 87
Thin Film Device Processing	p. 98
Coplanar-Plate Configuration	p. 99
Parallel-Plate Configuration	p. 101
Substrate Micromachining and Passivation	p. 106
Substrate Micromachining	p. 106
Substrate Passivation	p. 107
Conclusions	p. 108
References	p. 109
Substrates, Varactors and Passive Components	p. 115
Introduction	p. 115
Substrates	p. 116
Common Substrates	p. 116
Silicon as a Microwave Substrate	p. 118
High Resistivity Silicon	p. 119
Varactors. Basic Designs and Figure of Merit	p. 125
Basic Designs of Ferroelectric Varactors	p. 125
Figure of Merit, Structure and Performance of Ferroelectric Films	p. 128
Correlation of the Design with the Film Structure	p. 129
Varactor Design Issues	p. 134
Equivalent Circuit Model of the Varactors	p. 139
Equivalent Circuit	p. 139
Impedance of Parallel-Plate Varactors	p. 143
Low Frequency and Tuning Performances	p. 144
C-V and P-V Performances	p. 144
I-V Performance	p. 146
Tuneability and Response Time	p. 149
Microwave Performance	p. 151
Parallel-Plate Varactors	p. 151
Coplanar-Plate Varactors	p. 156
Distributed Varactors	p. 161
Power Handling Capability and High Power Varactors	p. 162
Parallel-Plate Varactors	p. 163
Coplanar-Plate Varactors	p. 164
Ferroelectrics in Passive Devices as High Permittivity Dielectric	p. 165
High Density Capacitors	p. 165
MEMs with Ferroelectric Spacers	p. 167
MOS Transistors with Ferroelectrics as Gate Dielectric	p. 168
Conclusions	p. 169
References	p. 170
Ferroelectric Devices	p. 175
Introduction	p. 175
Tunable Delay Lines and Delay Line Type Phase Shifters	p. 176
Figure of Merit	p. 176
Periodically Loaded Lines	p. 177
Uniformly Loaded Delay Lines	p. 182
Other Delay Lines	p. 186
Phase Shifters	p. 187
Figure of Merit of an Analog Phase Shifter	p. 187
Periodically Loaded Line Phase Shifters	p. 188
Reflection Type Phase Shifters	p. 192
Phase Shifters Based on All Pass Filter Topology	p. 192
Other Phase Shifters	p. 194
Tunable Filters	p. 196
Tunable Resonators	p. 196
Bandpass Filters	p. 199
Notch Filters	p. 203
Matching Networks (Impedance Tuners)	p. 204
Power Splitters	p. 206
Antennas	p. 207
Nonlinear Devices	p. 208
Harmonic Generators	p. 208
Frequency Up-Converters	p. 208
Power Limiters	p. 209
Pulse Shapers	p. 210
Parametric Amplifiers	p. 211
TFBARs	p. 212
Basic Designs and Resonant Frequencies	p. 212
Tunable TFBARs	p. 213
Conclusions	p. 217
References	p. 217
Circuit and System Applications of Tunable Ferroelectric Devices	p. 225
Introduction	p. 225
Voltage Controlled Oscillators	p. 226
Amplifiers	p. 229
Steerable Phased Array and Beam Antennas	p. 231
Phased Arrays	p. 231
Steerable Beamformers and Phased Arrays	p. 232
Nontraditional and Lens Type Steerable Beamformers	p. 236
Conclusions	p. 241
References	p. 242
Modeling	p. 245
Introduction	p. 245
Coplanar-Plate Transmission Lines	p. 246
The Equivalent Circuit of the Lines	p. 246
Coplanar-Strip Waveguides	p. 249
Coplanar Waveguides	p. 259
Multilayer Substrate Coplanar-Plate Capacitors	p. 260
Coplanar Plate Capacitors with the Straight Gap (Slot)	p. 260
Interdigital (IDC) Coplanar-Plate Capacitors	p. 265
Parallel-Plate Capacitor	p. 267
Conclusions	p. 271
Appendix A	p. 273
Appendix B	p. 276
Appendix C	p. 280
Appendix D	p. 285
References	p. 285
Measurements of the Dielectric Properties	p. 287
Introduction	p. 287
Resonant Techniques	p. 289
Disk Resonator Technique	p. 289
Courtney Resonator	p. 291
Composite Resonator Method	p. 295
Split-Post Dielectric Resonator Method for Thick and Thin Films	p. 297
Open Resonator Technique	p. 299
Resonant Technique for on Wafer Characterization of the Ferroelectric Varactors and Films	p. 302
Transmission Line Resonator Method	p. 306
Near Field Scanning Microscope	p. 308
Uncertainty of Resonant Measurements	p. 311
Broadband Techniques	p. 317
Transmission/Reflection Method. Bulk Samples in Waveguides	p. 317
Film Measurements Using Coplanar Waveguide (CPW)	p. 321
Film Measurements Using Coupled Microstrip Lines	p. 325
Measurements Using Test Varactors	p. 326
Nonlinear Measurements of Ferroelectrics	p. 330
Switching Time of Ferroelectric Films	p. 332
Conclusions	p. 334
Appendix E	p. 336
Appendix F	p. 343
Appendix G	p. 346
References	p. 347
Potentials and Perspectives	p. 351
Introduction	p. 351
Multiferroics	p. 352
Ferroelectric Nanotubes. Ferromagnetic Nanowires	p. 354
Metamaterials	p. 357
Bridging the "THz Gap"	p. 360
Other Tunable Materials	p. 361
Pyrochlores	p. 362
Resistive Switching in Oxides	p. 364
High Temperature Superconductors (HTS)	p. 367
Liquid Crystals	p. 367
Other/New Effects	p. 370
Resistivity Switching in Doped SrTiO3	p. 370
Nanoscale Effects	p. 372
Integration with Semiconductors	p. 372
Conclusions	p. 373
References	p. 374
Concluding Remarks	p. 379
Introduction	p. 379
Stabilization of the Temperature Dependences	p. 379
Intrinsic Temperature Dependences of Permittivity and Tuneability	p. 380
Materials and Device Design Based Methods of Stabilization	p. 381
Nonlinearity and Power Handling Capability	p. 384
Hysteresis, Retention, Long Term Stability and Noise	p. 384
Reliability	p. 387
Integration Trends	p. 388
References	p. 389
Index	p. 391
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Engineering Materials and Processes

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At a Glance

Hardcover

Shipping

How to return your order

Defective items

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